Technology, Equipment and Materials

US$200.00
Date of Publication: Jun 18, 2019
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$4,995.00
Date of Publication: Jul 5, 2019
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

US$5,550.00
Date of Publication: Oct 24, 2018
This report identifies the nature of the EMI/RFI problem, noting the ways that the redesigning of shielding and electronics can overcome these problems. Technologies and materials specific to EMI/RFI shielding are also identified and analyzed for their impact on plastics and other materials within a context of trends in components and devices used in the electronics medical, automotive and consumer products industries.

US$1,350.00
Date of Publication: Feb 14, 2019
PCB Technology Trends 2018 is based on data from 74 companies (52 electronics OEMs and 22 PCB fabricators) worldwide. PCB Technology Trends 2018 presents data on the current state (2018) of PCB fabrication and OEM's PCB requirements and their use of emerging technologies.

US$3,200.00
Date of Publication: Aug 22, 2018
Miniaturization of electronic products conduces to components of all sorts being smaller and smaller and spurs the growing demand for automated inspection equipment. In the wake of a transfer of electronic components production capacity to China, the AOI equipment has been developing by leaps and bounds over the past several years.

US$5,500.00
Date of Publication: Oct 11, 2018

The global market for printed circuit board should grow from $64.6 billion in 2018 to reach $75.8 billion by 2023 at a compound annual growth rate (CAGR) of 3.2% for the period of 2018-2023.


US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.

US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.


US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.

US$702.00
Date of Publication: Jul 17, 2017
"Base Materials Specifications for Printed Boards", BdMATFAM - is a family of specifications for board materials used in the fabrication process.

US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

US$5,550.00
Date of Publication: Nov 17, 2016
This report covers the market for MV hardware and software, including smart cameras and smart sensors, compact vision systems, PC-based MV systems, MV lighting and cameras, and frame grabbers. The global market for machine vision (MV) system components will grow from $19.0 billion in 2016 to $30.8 billion by 2021 with a compound annual growth rate (CAGR) of 10.2% for the period of 2016-2021.

US$5,550.00
Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.


US$160.00
Date of Publication: Oct 9, 2013
Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading. 

US$5,550.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.


US$160.00
Date of Publication: Nov 6, 2013
This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board...

US$75.00
Date of Publication: Mar 5, 2008
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state...

US$160.00
Date of Publication: Mar 5, 2014
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses.

US$85.00
Date of Publication: Feb 2, 2012
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive...

US$152.00
Date of Publication: Aug 7, 1992
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of...

US$85.00
Date of Publication: Dec 17, 2014
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure...

US$85.00
Date of Publication: Mar 2, 2006
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation...

US$5,550.00
Date of Publication: Aug 21, 2014

The report has been prepared in a simple format that can be easily understood with a number of tables and charts/figures. The scope of the report includes a detailed study of global and regional markets for various types of conformal coatings and coating equipment with the reasons given for variations in the growth of the industry in certain regions. The value of the worldwide market for conformal coating materials and equipment and spares is expected to grow from $8.1 billion in 2013 to $9 billion in 2014, and reach $12.2 billion in 2019, a compound annual growth rate (CAGR) of 6.3% between 2014 and 2019.