Technology, Equipment and Materials

US$500.00
Date of Publication: Apr 8, 2015
The Thermal Management  - 2015 iNEMI Thermal Management Roadmap is the most comprehensive roadmap published to date by the International Electronics...

US$500.00
Date of Publication: Apr 7, 2015
Interconnect PCB-Organic Technology Roadmap The interconnecting substrate can, and generally does, provide many functional attributes in addition to the...

US$4,950.00
Date of Publication: Feb 4, 2015
This report analyzes the worldwide markets for Membrane Separation Technologies in US$ US$ Thousands by the following Product Segments: Microfiltration, Ultrafiltration, Reverse Osmosis, Nanofiltration, and Other Technologies. The report also analyzes the following End-Use Applications: Pharmaceuticals, Water Treatment, Chemical, Food & Beverage, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East, and Rest of World. Annual estimates and forecasts are provided for the period 2013 through 2020.

US$152.00
Date of Publication: Nov 6, 2013
This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board...

US$75.00
Date of Publication: Mar 5, 2008
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state...

US$160.00
Date of Publication: Mar 5, 2014
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses.

US$85.00
Date of Publication: Feb 2, 2012
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive...