Test Assembly and Packaging

Newest Items First
8 Per Page
High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
US$4,995.00
Date of Publication: Mar 24, 2021
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.
Metrology, Inspection, and Process Control in VLSI Manufacturing
Metrology, Inspection, and Process Control in VLSI Manufacturing
US$4,995.00
Date of Publication: Jun 29, 2020

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.

3D TSV: Insight On Critical Issues And Market Analyses
3D TSV: Insight On Critical Issues And Market Analyses
US$4,995.00
Date of Publication: Jun 29, 2020
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.
Global and China Automated Optical Inspection (AOI) Industry Report, 2018-2022
Global and China Automated Optical Inspection (AOI) Industry Report, 2018-2022
US$3,200.00
Date of Publication: Aug 22, 2018
Miniaturization of electronic products conduces to components of all sorts being smaller and smaller and spurs the growing demand for automated inspection equipment. In the wake of a transfer of electronic components production capacity to China, the AOI equipment has been developing by leaps and bounds over the past several years.
Select options
Semiconductor Packaging & Testing Industry
Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond
US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.