Test, Inspection, and Measurement (TIM) technologies are an important part of electronics manufacturing. TIM encompasses technologies which allow for the identification of product defects and the characterization / improvement of the product and associated manufacturing process. Electronics product and manufacturing trends have continued to challenge both the users and providers of TIM technologies. These include higher product complexity, challenges with reduction of test access, increasing energy and environmental concerns, and the globalization of manufacturing and the diffusion of test development and support throughout the supply chain.
Higher electronic product complexity and clock / RF frequencies expands the number of components / product functions requiring test and the set of defects which can impact product performance. The move to integrate function modules and chips (system-in-module, system-in-package, package on package, and system-on-chip) is making the test of these devices more difficult and may require more coordination between providers of semiconductor test solutions and providers of board assembly test solutions. The increasing use of High Density Interconnects with the growing internal routing of signals is in many cases causing a “step function” decrease in test access and in effective test coverage. Increasing quality expectations in all product sectors require improved performance from TIM technologies, yet product cost / revenue trends are not consistent with the cost of TIM technologies. Specifically, while Moore’s law has applied to the silicon in the product, it does not apply to the overall cost of testing the resultant higher-function, lower-cost product. As these increasing speed and access issues grow, the need for industry wide testability standards and effected implementations by device designers and manufacturers as well as equipment designers must be coordinated and implemented.
Energy and environmental concerns are having a more direct impact on TIM users and providers. Equipment providers must consider energy efficiency during operation and the support of a low power consumption “standby mode” when equipment is idle so that equipment shutdown is not required in order to reduce energy costs. Proper characterization of materials changes in PCB’s (such as HFR free laminates) is required to ensure that the new materials are not adversely affected by test strategies and vice versa.
The globalization of electronics manufacturing continues in almost all product sectors. This creates on-going business and technical challenges related to the development, implementation and deployment of TIM technologies. These include globally acceptable and properly evaluated solutions for TIM, the need for consistent metrics and data reporting on test and inspection coverage and test and inspection results, and the training and support for both test and design personnel.
The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.
The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.
The roadmap identifies major trends in the evolution of Test Inspection and Measurement, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.
Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:
• Help OEMs, EMS providers and suppliers prioritize investments in R&D
and technology deployment
• Influence the focus of university-based research
• Provide guidance for government investment in emerging technologies
The complete report provides a full coverage of emerging and disruptive technologies across the electronics industry: Order 2015 iNEMI Roadmap today.