Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts

Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts

IDTechEX, Date of Publication: Jul 22, 2015, 178 Pages
US$5,475.00
IDT2082

Thermal Interface Materials Industry Status, Market Opportunities and Forecasts

This report covers the ten types of materials available to improve heat removal in eleven key applications with a combined market of $1.7bn, predicted to rise to $3.7bn by 2025. Upon request the original PowerPoint can be included free of charge as part of the report purchase.

Thermal Interface Materials

Overheating is the most critical issue in the computer industry. It limits further miniaturisation, power, performance and reliability. The escalation of power densities in electronic devices has made efficient heat removal a crucial issue for progress in information, communication, energy harvesting, energy storage and lighting technologies. As long as electronic systems aren't monolithic, but are built from a wide range of materials such as metals, polymers, ceramics and semiconductors, there will be a need for thermal interface materials.
 
The contact area between high power, heat generating components and heat sinks can be as low as 3%, due to the micro-scale surface roughness. Thermal interface materials are required to enhance the contact between the surfaces, and decrease thermal interfacial resistance, and increase heat conduction across the interface.
 
Proper selection of Thermal Interface Materials (TIM) is crucial for the device efficiency. Instead of sophisticated cooling technique, it is often better to invest in the interface material. Without good thermal contact, the use of expensive thermally conducting materials for the components is a waste.
 
The most appropriate choice of thermal interface material has been shown to:

  • Reduce total cost of ownership
  • Eliminate of the need for liquid cooling
  • Reduce system cooling power consumption
  • Reduce building power consumption
  • Increase operational lifetime

The geographic breakdown of sales of thermal interface materials, included in Thermal Interface Materials 2015-2025, demonstrates this is truly a global industry:
 
Global Electronics Industry Report
 
Breakdown of TIM sales by region. 
 
Innovation in this industry is driven forward by:

  • Faster computers: With electronic systems becoming faster, hotter, more compact, and portable, the need for better TIMs in consumer and industrial computing will continue.
  • Greener lighting: LEDs are replacing traditional lighting in more applications, for lower energy and higher brightness, especially in the automotive industry.
  • Electrification of transport: Heat management is of very high importance in electric vehicles, which have large energy storage systems. As vehicles incorporate more and more electrics and electronics, thermal management will become increasingly important.
  • Better connectivity: As a wider-reaching and more comprehensive wireless network is built, and higher reliability is expected, more, better quality TIM is being used in telecommunications equipment.

Thermal Interface Materials 2015-2025 includes a technology appraisal of the ten key technologies:
 
1. Pressure-Sensitive Adhesive Tapes
2. Thermal Adhesives
3. Thermal Greases
4. Thermal Gels, Pastes and Liquids
5. Elastomeric Pads
6. Phase Change Materials
7. Graphite
8. Solders and Phase Change Metals
9. Compressible Interface Materials
10. Liquid Metals
 
The technologies and chemistries are described and compared, and performance data from a wide selection of commercially available products is benchmarked.
 
There are many current and growing opportunities for these technologies to be used in the following markets:

  • LED lighting
  • Photovoltaics
  • Lasers
  • Telecommunications equipment
  • Automotive electronics
  • Industrial computing
  • Defence and aerospace electronics
  • Consumer and mobile handheld electronics
  • Medical electronics
  • Wireless sensor networks
  • PCB testing equipment

The importance and uses of TIMs in these industries, the materials used most frequently and the market size is presented.
 
The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated by TIM type and by application. These have been compiled after an extensive interview program with thermal interface material manufacturers making a variety of materials, and many different applications, and using financial data published by public companies. Thermal Interface Materials 2015-2025 includes profiles of 29 companies working in this industry.

This report purchase includes up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.


TABLE OF CONTENTS


1. EXECUTIVE SUMMARY

1.1. Potential benefits of using TIMs
1.2. Drivers for the improvement of TIMs
1.3. Ten Types of Thermal Interface Material
1.4. Factors which influence the choice of TIM
1.5. Properties of Thermal Interface Materials
1.6. Uses for thermal interface materials
1.7. Materials by Application
1.8. Thermal Interface Material Manufacturers
1.9. Cost of TIM
1.10. Market Share by TIM type in 2015
1.11. Market Share by Application in 2015
1.12. Market Share of Computing in 2015
1.13. Geographic Breakdown
1.14. Forecast by TIM type
1.15. Forecast by Application
1.16. Forecast for Computing Applications
1.17. Restraints
1.18. Opportunities for developments
1.19. Growing Markets

2. INTRODUCTION

2.1. Schematics to show the role of Thermal Interface Materials

3. DRIVERS

3.1. Causes of Electronic Failure
3.2. Temperature increase in Power Electronic Applications
3.3. Reducing temperature in Power Electronics Applications
3.4. Potential benefits of using TIMs
3.5. Drivers for the improvement of TIMs
3.6. Fishbone Diagram
4. CHARACTERISING TIMS
4.1. TIM Designation
4.2. Thermal Conductivity vs Thermal Resistance
4.3. Testing of TIMs
4.4. Three Methods for Testing of TIMs
4.5. 1. Laser Flash Diffusivity
4.6. 2. Hot Disk
4.7. 3. ASTM-D5470
4.8. Problems with ASTM D5470

5. TYPES OF THERMAL INTERFACE MATERIAL

5.1. Ten Types of Thermal Interface Material
5.2. 1. Pressure-Sensitive Adhesive Tapes
5.3. 2. Thermal Liquid Adhesives
5.4. Thermal Liquid Adhesives
5.5. 3. Thermal Greases
5.6. Problems with thermal greases
5.7. Thermal Greases
5.8. Viscosity of Thermal Greases
5.9. Technical Data on Thermal Greases
5.10. The effect of filler, matrix and loading on thermal conductivity
5.11. 4. Thermal Gels
5.12. 4. Thermal Pastes
5.13. Technical Data on Gels and Pastes
5.14. 5. Elastomeric pads
5.15. Advantages and Disadvantages of Elastomeric Pads
5.16. 6. Phase Change Materials (PCMs)
5.17. 6. Phase Change Materials (PCMs)
5.18. 6. Phase Change Materials (PCMs)
5.19. Operating Temperature Range of Commercially Available Phase Change Materials
5.20. 7. Graphite
5.21. Metal TIMs
5.22. 8. Solders or Phase Change Metals
5.23. Which solder?
5.24. Soft Solder vs Hard Solder
5.25. Advantages and Disadvantages of Solders and Phase Change Metals
5.26. Properties of solders
5.27. 9. Compressible Interface Materials
5.28. 10. Liquid Metal

6. BENCHMARKING OF THERMAL INTERFACE MATERIALS

6.1. Ten Types of Thermal Interface Material
6.2. Factors which influence the choice of TIM
6.3. Voids
6.4. Properties of Thermal Interface Materials
6.5. Comparison of Thermal Interface Materials
6.6. Bounds on Thermal Conductivity of Commercially Available Thermal Interface Materials
6.7. Maximum Operating Temperature of Commercially Available Thermal Interface Materials
7. RELATED TECHNOLOGIES
7.1. Heat Spreaders
7.2. Immersion Cooling

8. EMERGING MATERIALS AND DISRUPTIVE TECHNOLOGIES

8.1. Pyrolytic Graphite Sheet (PGS)
8.2. New Conducting Particle Fillers for Thermal Greases
8.3. Carbon Nanotubes (CNT)
8.4. Graphene
8.5. Efficiencies of fillers

9. MARKETS

9.1. Uses for thermal interface materials
9.2. Materials by Application
9.3. 1. LED Lighting
9.4. Effects of increasing the temperature of an LED
9.5. Effects of increasing the temperature of an LED cont.
9.6. 2. Photovoltaics
9.7. Effect of Temperature on Solar Cell Efficiency
9.8. Concentrated Photovoltaics
9.9. 3. Lasers
9.10. Evolution of laser technology
9.11. Packaging of Laser Diodes to improve Thermal Management
9.12. Solder as the TIM in lasers
9.13. 5. Computing
9.14. Targeted applications within computing
9.15. A. Telecommunications Equipment
9.16. Increasing heat flux from telecommunication equipment
9.17. B. Automotive Electronics
9.18. C. Consumer and Industrial Computing
9.19. Examples of TIMs in Consumer and Industrial Computing
9.20. Varieties of TIM in Consumer and Industrial Computing
9.21. D. Defence and Aerospace
9.22. E. Mobile Hand-held Devices
9.23. Examples of TIM in Consumer Electronics
9.24. F. Medical Electronics

10. PATENTS AND PUBLICATIONS

10.1. Google Trends
10.2. Worldwide Patent Publications
10.3. Scientific Journal Articles
11. KEY PLAYERS
11.1. Thermal Interface Material Manufacturers
12. VALUE CHAINS
12.1. Value Chain
13. STATE OF THE MARKET IN 2015
13.1. Cost of TIM
13.2. Market Share by TIM type in 2015
13.3. Market Share by Application in 2015
13.4. Market Share of Computing in 2015
13.5. Geographic Breakdown
14. FORECAST 2015-2025
14.1. Forecast by TIM type
14.2. Market Share by TIM type in 2025
14.3. Bubble Plot by TIM type
14.4. Forecast by Application
14.5. Market Share by Application in 2025
14.6. Forecast for Computing Applications
14.7. Market Share of Computing in 2025
14.8. Bubble Plot by Application
15. FORECAST NARRATIVE
15.1. Forecast by TIM Type
15.2. Forecast by Application Type
15.3. Assumptions
16. LIMITATIONS, RESTRAINTS AND THREATS
16.1. Restraints
16.2. Threats to the Industry
17. GLOBAL OPPORTUNITIES
17.1. Opportunities for developments
17.2. The winners will address...
17.3. Growing Markets
18. COMPANY PROFILES
18.1. 3M Electronic Materials
18.2. AI Technology
18.3. AIM Specialty Materials
18.4. AOS Thermal
18.5. Dow Corning
18.6. DK Thermal
18.7. Dymax Corporation
18.8. Ellsworth Adhesives
18.9. Enerdyne
18.10. European Thermodynamics Ltd
18.11. Fujipoly
18.12. Fralock
18.13. GrafTech
18.14. Henkel
18.15. Indium Corporation
18.16. Inkron
18.17. Kitagawa Industries
18.18. Laird Tech
18.19. LORD
18.20. LORD
18.21. MH&W International
18.22. Minteq
18.23. Momentive
18.24. Parker Chomerics
18.25. Resinlab
18.26. Schlegel Electronics Materials
18.27. ShinEtsu
18.28. Timtronics
18.29. Universal Science

 

Date of Publication:
Jul 22, 2015
File Format:
PDF via E-mail
Number of Pages:
178 Pages
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