Thermal Management Technology Roadmap

Thermal Management - 2015 iNEMI Roadmap

iNEMI, Date of Publication: Apr 8, 2015
US$500.00
INM2076

The Thermal Management  - 2015 iNEMI Thermal Management Roadmap is the most comprehensive roadmap published to date by the International Electronics Manufacturing Initiative (iNEMI). The complete roadmap report is available here. The document, created by individuals representing all aspects of the electronics manufacturing supply chain.  

The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs).  The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.

The roadmap identifies major trends in the evolution of thermal management technology, with an emphasis on identifying potentially disruptive events (business and technology). It provides the information needed to identify critical technology and infrastructure gaps, prioritize R&D needs to meet those gaps, and initiate activities that address industry needs.

Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:

  • Help OEMs, EMS providers and suppliers prioritize investments in R&D
     and technology deployment

  • Influence the focus of university-based research

  • Provide guidance for government investment in emerging technologies

Due to cost pressures in high volume applications, personal computers and consumer electronics, aluminum and copper heat sinks with air forced or natural air circulation continue to dominate in terms of unit volume. Higher performance electronics in smaller packages is forcing designers and manufacturers to consider phase change and liquid cooling techniques. Increasingly there is a recognition that reducing system power (power-in, heat out) will not only reduce the demands on thermal management technologies, it will also result in direct and indirect energy savings.  This is leading to design practices with a closer look at the sources of heat in electronic devices.  

The complete report provides a full coverage of emerging and disruptive technologies across the electronics industry: Order 2015 iNEMI Roadmap today.

 
Date of Publication:
Apr 8, 2015
File Format:
PDF via E-mail
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