Wafer Cost Analysis for Solar Cell and Low-Cost Technology Trend

Wafer Cost Analysis for Solar Cell and Low-Cost Technology Trend

SNE, Date of Publication: Sep 8, 2011, 175 Pages
US$3,990.00
SNE2590

New Low Cost Technology Trend for Wafer

The photovoltaic market that has rapidly grown until 2010 is slightly slowing down due to the FIT cut and global financial crisis. The module price annually decreases through an excessive investment in production line along with reduced demand. Wafer which is key component for crystalline solar cell seems to drop by more than 30% this year as well. Some have an optimistic view of photovoltaic industry for second half of this year but the PV market seems to continue just as first half of this year. The price of all raw materials including module is expected to steadily decrease. In this situation, new technology for high efficiency and cost competitiveness are required for companies. Especially, among manufacturing cost of wafer which is one of the photovoltaic value chains, polysilicon accounts 50~60%, meaning that vertically not integrated companies have considerable burden for production cost

This report comprehensively handles development trend of low cost wafer technology and contains the cost analysis depending on vertical integration as well as analysis of investment in single/multi crystalline production line.

- Detailed 12 technologies relating to low-cost wafer manufacturing technology trend
(Mono like multi, Diamond wire saw and so on.)
- Single-crystal Wafer cost analysis
- Analysis of investment in single/multi crystal wafer manufacturing line
- Wafer demand/supply market forecast (2010~2013)
- Capacity Date of Wafer TOP 30 companies (2010~2013)


TABLE OF CONTENTS

1. Introduction 
1.1. Ingot Growth Technology 
1.1.1. Single-Crystal Ingot Growth Method 
1.1.1.1 Czochralski method 
1.1.1.2 Floating Zone method 
1.1.2. Multi-Crystal Ingot Growth Method 
1.2. Wafer Process 
1.2.1. Ingot cutting technology 
1.3. Yield by Process 
1.3.1. Growing 
1.3.2. Cropping 
1.3.3. Squaring & Rounding 
1.3.4. Wafer Process 
1.4. Scrap recycling 

2. Cost analysis 
2.1. Ingot process 
2.2. Wafer process 
2.3. Comparison Total Wafer Cost depending on Vertical Integration 

3. Investment analysis 
3.1. Single-Crystal Ingot/Wafer 
3.1.1. Equipments 
3.1.2. Utility, Operating, Building 
3.1.3. Total investment cost 
3.2 Multi-Crystal Ingot/Wafer 
3.2.1. Equipments 
3.2.2. Utility, Operating, Building 
3.2.3 Total investment 

4. Low Cost Ingot & Wafer Technology Trend 
4.1 Low Cost Ingot Growth Technology 
4.1.1. Multi furnace 
4.1.2. Mono like multi 
4.2. Low Cost Wafering Technology 
4.2.1. Thin wafer 
4.2.1.1 DFT (Direct Film Transfer) 
4.2.1.2 SLIM (Stress-induced Lift-off Method) 
4.2.1.3. SOI (Silicon On Insulator) 
4.2.2. Diamond wire 
4.2.2.1 Slurry type VS Diamond type
4.2.2.2 Running cost 
4.3.  New technology 
4.3.1. Ribbon Wafer Technology 
4.3.1.1  Vertical Growth Method (Type 1) 
4.3.1.2 Horizontal Growth Method (Type 2) 
4.3.2. Various Polysilicon wafer Processes using Ribbon Growth 
4.3.2.1 Dendrite Web Growth 
4.3.2.2 Edge-defined Film-fed Growth 
4.3.2.3 String Ribbon Growth 
4.3.2.4 Ribbon Growth on Substrate 
4.3.2.5 Silicon Sheet from Powder 
4.3.2.6 Crystallization on Dipped Substrate 
4.4. Companies using New Technology 
4.4.1. Companies using Thin wafer 
4.4.2. Companies using Ribbon wafer 
4.4.2.1 Evergreen Solar 
4.4.2.2 Schott Solar 
4.4.2.3 RGS Development BV 
4.4.2.4 1366 Technology 

5. Wafer market forecast (2010~2013) 
5.1. Global PV market forecast (2010~2013) 
5.2. Wafer capacity forecast (2010~2013) 
5.2.1. TOP 30 company Wafer capacity forecast 
5.2.2. TOP 10 company Wafer capacity forecast 
5.3. Wafer Demand & Supply forecast (2010~2013) 
5.4. Wafer price forecast (2010~2013) 

6. Index 
6.1 Figure
6.2 Table 

Date of Publication:
Sep 8, 2011
File Format:
PDF via E-Mail
Number of Pages:
175 Pages
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