Wafer Fabrication Costs Model and Equipment Requirements

Strategic Cost Model

IC Knowledge, Date of Publication: Nov 24, 2017

The IC Knowledge - Strategic Cost Model 2017 - takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade.

Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

Supported processes
The Model supports DRAM out to 12 nm, Foundry out to 3.5nm, NAND in 2D out to 15nm/16nm as well as 3D to 256 layers and 3D XPoint to 16 layers..

Supported wafer sizes
300mm and 450mm

Supported cost elements
Wafer cost only

Who should buy this product

The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm.

Revision 2017-04

  • Processes - Fixed a typo that listed Samsung's 3D NAND process as 2 decks when it is 1 deck. Added Silicon Photonics module options to the 'Logic' process sheet. Updated 3DXPoint processes. Added Samsung 11nm logic process. Adjusted Intel-Micron 64L 3D NAND introduction date. Fixed typos in the Samsung and Toshiba 3D NAND Channel blocks. Added W into the 3D NAND via blocks. Updated Intel 10nm, 7nm and 5nm processes. Updated DRAM 18nm, 14nm and 10nm processes HKMG usage and work function metals.
  • NGL - Split EUV into pellicle and no pellicle to account for the different throughputs.
  • Equipment - Updated CVD equipment parameters. Adjusted OEEs.
  • Materials - Updated material pricing by year. Fixed an error in fluorine free tungsten usage. Fixed an issue where a few materials were linked incorrectly. Updated reticle costs. Updated material usage amounts. Added new materials. Fixed an error in the reticle set cost amortization calculation. Updated starting wafer prices. Added the ability to select None as well as BARC or TARC for photo layers.
  • Model - Added margin override updates to the 'CostSum' sheet. Added mask set cost to the 'CostSum' sheet. Expanded the 'CostPerQtr' macro sheet to 20 quarters. Fixed an error in the 'StepCost' sheet summary section. Added fab name, year and quarter, capacity and running total to the 'InvestSum' sheet. Improved the accuracy of the 'BlockCost' sheet.
  • Yield - Fixed errors in die cost and value calculations.
  • Facilities - Fixed a typo on the 'CostSum' sheet where building systems and building labeling was reversed.
  • Fabs - Changed TSMC China fab name to Fab 16. Adjusted fab capacities.

Model Cost and How to Buy
A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $14,000. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.

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Date of Publication:
Nov 24, 2017
File Format:
Excel File via E-mail