Wafer Fabrication Costs Model and Equipment Requirements

Strategic Cost Model

IC Knowledge, Date of Publication: Sep 26, 2016
US$5,000.00
ICK5280

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments (DRAM, Foundry, IDM Logic and NAND) and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out over the next decade (out to 5nm logic and 12nm memory plus 3D). The model provides detailed process, equipment and materials details and all values are user editable for custom calculations. All of our models include twelve month of updates with reasonable email and phone support.

Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.

In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.

For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.

Supported processes

The Model supports DRAM out to 12 nm, Foundry out to 3.5nm, NAND in 2D out to 15nm/16nm as well as 3D to 256 layers and 3D XPoint to 16 layers.

Supported wafer sizes
300mm and 450mm

Supported cost elements
Wafer cost only

Who should buy this product

The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm.

Recent revisions 2016 - 05a

  • Processes - added some comments to Global Foundries, Samsung and Intel processes. Adjusted TSMC, Samsung and Global Foundries pitches and multi-patterning usage. Updated 3D XPoint pitches and lithography. Updated Global Foundries 12FDX date. Added TSMC 250nm and 180nm processes for use with 200mm conversion calculations.
  • NGL - fixed an issue with SAQP cut/block mask usage versus linewidth.
  • Materials - no change.
  • Model - added the ability to do limited 200mm modeling.
  • Yield - no change.

 
Model Cost and How to Buy
A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $14,000. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.
 

Related Products

IC Cost and Price Model  - easily calculate the cost and price of most low power silicon integrated circuits.

MEMS Cost Model  - easily calculate the cost of most MEMS products.

Discrete and Power Products Cost and Price Model - easily calculate the cost and price of most high power silicon integrated circuits and discrete devices.

 

Date of Publication:
Sep 26, 2016
File Format:
Excel File via E-mail
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