The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments (DRAM, Foundry, IDM Logic and NAND) and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out over the next decade (out to 5nm logic and 12nm memory plus 3D). The model provides detailed process, equipment and materials details and all values are user editable for custom calculations. All of our models include twelve month of updates with reasonable email and phone support.
Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU, IBM Internal processor, ST Micro, NAND - Samsung, Toshiba, SK Hynix 2D and Samsung and Toshiba 3D.
In each case we present a detailed introduction date, general process's details, process flows in order, pitch by layer and node, mask layers, multi patterning usage and total masks. Process blocks, pitch and multi patterning can be edited for each case.
For each target company and process every 300mm fab they have is predefined so that if you juts pick a fab the fab details and supported processes are pre defined (although you can override them) and detailed outputs of equipment and materials requirements are provided.
The Model supports DRAM out to 1x nm, Foundry and IDM logic out to 5nm and NAND in 2D out to 1z as well as 3D.
Supported wafer sizes
300mm and 450mm
Supported cost elements
Wafer cost only
Who should buy this product
The IC Knowledge - Strategic Cost Model - is in use at many large IDMs, Consortia, Materials companies and OEMS forward projecting markets and costs as the industry implements the ITRS and 450mm,.
Revision 1501 - added TSMC Fab 15 phases 5, 6, and 7. Adjusted TSMC 10nm, 7nm and 5nm dates. Adjusted Intel 7nm and 5nm dates. Added a total steps without inspection or metrology to the bottom of the 'Process Steps' sheet. Added more step comments to the 'Process Steps' sheet. Adjusted the cut mask factors for multipatterning. Adjusted pitches for 2D and 3D NAND. Updated limits for 1D multipatterning and added new options. Updated 2D NAND and DRAM multipatterning usage.
Revision 1501a - fixed a locking error on the Samsung NAND 3D sheet. Fixed an error in the Samsung NAND 3D processes. Fixed an error in the CVD - 3D throughputs.
Revision 1502 - updated Samsung 10nm introduction date. Updated Samsung 20nm DRAM process. Adjusted Global Foundries, Intel, Samsung and TSMC 10nm, 7nm and 5nm introduction dates. Fixed the cost per block page to support 95 blocks consistent with the product pages. Added 'Cost Per Step' sheets for 'Patterning' and 'No patterning'. Fixed a transcription error where C5F8 was substituted for C4F8 for some 3D NAND etches. Changed equipment maintenance to partially scale with utilization. Added additional detail to selected ALD comments on the 'Process Step' sheet. Added defect density projections.
Revision 1503 - added a cost per step summary by step category to the 'Cost Per Step - All Steps' sheet. Fixed an error on the 3D NAND product sheets where the mask total at the bottom of the sheet was incorrect. Updated lithography gas usage and added the ability to adjust the flow of hydrogen for EUV to the 'Defaults' sheet. Adjusted Ebeam inspection system costs. Made the metrology and inspection step usage editable on the 'Process Step' sheet. Made the 'Sampling plan' sheet visible and user adjustable. Updated 2D and 3D NAND flows, Fixed bugs in the 'Cost per Block' sheet calculations. Updated defect densities.
Model Cost and How to Buy
A single user license allows one user on one computer and is $5,000, an enterprise license allowing an unlimited number of users at a company is $14,000. The model is delivered by email within a few hours of our receiving an order. The model cost includes twelve months of updates plus twelve months of reasonable levels of phone and email support. A Web Ex training session is available on request. Renewal costs at the end of twelve months are discounted 1/3 off the current prices.
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