Wafer Level Packaging Polymers – New Growth for Packaging

Wafer Level Packaging Polymers – New Growth for Packaging

Techcet, Date of Publication: Feb 3, 2015, 50 Pages
US$3,920.00
TC2564

Wafer Level Packaging (WLP) is one of the fastest, if not the fastest, growing segments of the semiconductor industry. This is driven by the mobile electronics industry with the ever-increasing need for more performance in a smaller package.  Wafer Level Packaging Report provides an in-depth look at the dielectric materials that are the backbone of this new packaging technology. Existing and new material requirements are discussed and how they play a role in enabling the move toward smaller device geometries. End User requirements for new dielectric materials will be discussed including those for new packaging schemes such as FAN-OUT technology. Market forecast for these dielectrics, supplier market statistics and profiles are also provided, in addition to the WLP process flow.

TABLE OF CONTENTS

1. Executive Summary 4
2. Wafer Starts 5
3. Market Statistics 6
4. The Technology Gap 13
5. The WLP Process 16
6. The WLP Polymers and characteristics 21
7. Pricing and Forecast 25
8. Technology Drivers now and Future 29
9. Supplier Chain 35
10. Supplier Profiles 37-50


Figures

1. Wafer Starts Growth by wafer size as a Percentage of 2013 5
2. WLP Dielectric Materials Market Share by Material Type 2014 7
3. WLP Dielectric Materials Market Share by Material Type 2020 9
4. Market Forecast 11
5. Traditional Packaging Concept 12
6. Technology Gap - Chip vs. Package vs. System 13
7. WLP Process Flow 16-18
8. WLP Dielectric Material Parameters 25
9. Price Range Estimates 26
10. Fan-Out Technology 29
11. WLP Dielectrics Supply Chain 30
12. WLP Dielectrics Supplier Market Share 37
13. Market Share of BI Materials 39
14. Market Share of PBO Materials 41

Tables

1. Characteristics of Good WLP Polymers (End User Requirements) 21
2. Current Dielectrics/Polymers in Use 24
3. Pricing Trends 25
4. WLP Dielectrics Future Requirements 2

Date of Publication:
Feb 3, 2015
File Format:
PDF via E-mail
Number of Pages:
50 Pages
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