ELECTRONICS.CA PUBLICATIONS announces the availability of a comprehensive global report on Surface Mount Technology (SMT) Equipment. The global market for Surface Mount Technology Equipment is projected to reach US$4.5 billion by 2020, driven by the strong demand for electronic products and the ensuing increase in production of Printed Circuit Boards (PCBs).

Circuit that reduces power leakage when transmitters are idle could greatly extend battery life At this year’s Consumer Electronics Show in Las Vegas, the big theme was the “Internet of things” — the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks. Realizing that vision, however, requires transmitters that are powerful enough to broadcast to devices dozens of yards away but energy-efficient enough to last for months — or even to harvest energy from heat or mechanical…

Experiments at SLAC Show Potential for Graphene-based Organic Electronic Devices Graphene – a one-atom-thick sheet of carbon with highly desirable electrical properties, flexibility and strength – shows great promise for future electronics, advanced solar cells, protective coatings and other uses, and combining it with other materials could extend its range even further.

Two leading standards for the electronics assembly industry have been revised. IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies is recognized worldwide as the sole industry-consensus standard for soldering processes and materials. IPC-A-610F, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronics assemblies meet the most current acceptance requirements. Some significant changes to IPC-J-STD-001F and IPC-A-610F standards include: Requirements added for two new SMT terminations P-Style terminations Butt/I terminations — Solder charged terminations Revised Class 2 plated-through hole vertical solder fill requirements Revised void criteria for BGA/CSP components Revised class 2 flux activity criteria Improved language for…

Updated forecast expects robust 8.2% average annual semiconductor unit shipment growth through 2019. Total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march through the current cyclical period and top one trillion units for the first time in 2017 according to IC Insights forecast presented in the 2015 edition of The McClean Report – A Complete Analysis and Forecast of the Integrated Circuit Industry. Semiconductor shipments in excess of one trillion units are forecast to be the new normal beginning in 2017.

The First Edition analysis of the Wireless Charging Market is an in-depth analysis detailing the latest developments in this important emerging market. The wireless power charging IC market will see tremendous growth over the next five years, with a dollar market increasing from $284.3 million in 2015 to over $2.8 billion in 2020, a compounded annual growth rate (CAGR) of 58.7%. The wireless power charging market covered in this report is made up of both wireless charging receiver ICs and transmitter ICs. But the longer-term market growth is still uncertain.

Silicon Photonics is a relatively new technology which uses optical rays in order to transfer data between different computer chips and peripherals. New report covers particularly the markets for final products, devices and equipment that function on Silicon Photonics technology for six major application verticals namely: Telecommunications, Data communication, displays and consumer electronics, sensing, metrology, high performance computing and medicines. The silicon photonics market is expected to increase at a compound annual growth rate (CAGR) of 27.74% from 2014 to $497.53m by 2020.

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get the complete IPC standards collection and save 55% on individual document prices. Users can also purchase and download IPC standards from Electronics.ca Publications by following IPC specs below.

MCUs enter into the next wave of growth as new applications such as the Internet of Things and wearable systems emerge. Information in this Research Bulletin comes from The McClean Report 2015, IC Insights flagship market analysis and forecast report on the IC industry.  Details are provided at the end of this bulletin.

Structural electronics  is one of the most important developments this century yet most people have never heard of it. Strange – there are over 37 million items on Google. Two years ago, IEEE published,”3D Printing for Rapid Prototyping of Structural Electronics”. Drayson revealed the “structural battery” in the aerofoil of its pure electric racing car. Tesla amazed us with an empty engine compartment and trunk in its pure electric car – the power train was entirely fitted into the sides and floor.