March 27, 2015

  • Structural Electronics Industry Report

    Structural Electronics – A Business of Tens of Billions of Dollars Within the Coming Decade

    Structural electronics  is one of the most important developments this century yet most people have never heard of it. Strange – there are over 37 million items on Google. Two years ago, IEEE published,”3D Printing for Rapid Prototyping of Structural Electronics”. Drayson revealed the “structural battery” in the aerofoil of its pure electric racing car. Tesla amazed us with an empty engine compartment and trunk in its pure electric car – the power train was entirely fitted into the sides and floor.

  • Global IP-Traffic by Access Technology

    Wi-Fi Semiconductor Chipset Analysis – Wi-Fi Ascending ­ Now More Than Ever

    ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Supplier BullsEye Analysis 802.11ac WiFi Chipsets”.  According to the oft-cited Cisco Visual Networking Index, by 2018, Wi-Fi becomes the most important air interface (and possibly the most important broadband wireless communications interface bar none).

  • Global Market for Thin, Flexible and Printed Batteries

    The Market for Thin, Flexible and Printed Batteries Will Increase to Over $300M by 2024

    Form factor is becoming a major driver shaping innovation and transforming the energy storage industry globally. This is fueled by the emergence of new market categories such as wearable electronic devices and Internet of Things, which demand thinness and flexibility. According to a new study, “Flexible, Printed and Thin Film Batteries 2015-2025: Technologies, Forecasts, Players“,  these new market categories will help the market for thin and flexible batteries reach $300 million in 2024.

  • Wireless M2M & IoT Market Opportunities

    Wireless M2M & IoT Market Opportunities Report

    Global spending on wireless M2M technology is expected to reach nearly $200 Billion by the end of 2014. Despite its low ARPU, the wireless M2M market has become a key focus of many mobile network operators as their traditional voice and data markets become saturated. Likewise, government and regulatory initiatives such as the EU initiatives to have a smart meter penetration level of 80% by 2020 and the mandatory inclusion of automotive safety systems such as eCall in all new car models, have also helped to drive overall wireless M2M connections and revenue.

  • Electronics Production by Country

    Growth in Electronics Production by Country

    Growth within the global electronics industry started to gain momentum in the later part of 2013 a trend which will continue in 2014 and then accelerate in the period to 2017, with stronger growth in the emerging markets. Growth is being driven by the improved outlook for the global economy although downside risks still remain. The Volume 2 of the Yearbook of World Electronics Data tracks developments in the electronics industry for 16 countries with emphasis on the Americas, Japan and the Asia Pacific.

New Releases in Technology & Market Research

Rigid PCB Industry Report: Global Top 40 Rigid PCB Companies by Revenue

Mar 9, 2015

2014 was a good year for majority of PCB companies, as output value of PCB industry touched USD59.6 billion, rising 3.7% against 2013, the fastest growth rate since 2011. Looking forward to 2015, a collapse in prices of commodities, especially in that of copper, will significantly reduce raw materials costs of PCB companies, thus further driving their profit margins. In 2014, in key regions of PCB manufacturing, euro, NTD, and yen all depreciated sharply, while the won appreciated, dealing a heavy blow to South Korean PCB industry and cutting profit margins of the country’s PCB companies, which all suffered declines…

SMT Equipment Market is Projected to Reach US$4.5 Billion by 2020

Feb 25, 2015

ELECTRONICS.CA PUBLICATIONS announces the availability of a comprehensive global report on Surface Mount Technology (SMT) Equipment. The global market for Surface Mount Technology Equipment is projected to reach US$4.5 billion by 2020, driven by the strong demand for electronic products and the ensuing increase in production of Printed Circuit Boards (PCBs).

Radio Chip for the “Internet of things”

Feb 23, 2015

Circuit that reduces power leakage when transmitters are idle could greatly extend battery life At this year’s Consumer Electronics Show in Las Vegas, the big theme was the “Internet of things” — the idea that everything in the human environment, from kitchen appliances to industrial equipment, could be equipped with sensors and processors that can exchange data, helping with maintenance and the coordination of tasks. Realizing that vision, however, requires transmitters that are powerful enough to broadcast to devices dozens of yards away but energy-efficient enough to last for months — or even to harvest energy from heat or mechanical…

Semiconductor Works Better when Hitched to Graphene

Feb 23, 2015

Experiments at SLAC Show Potential for Graphene-based Organic Electronic Devices Graphene – a one-atom-thick sheet of carbon with highly desirable electrical properties, flexibility and strength – shows great promise for future electronics, advanced solar cells, protective coatings and other uses, and combining it with other materials could extend its range even further.

Some Questions Answered About IPC J-STD-001F and IPC A-610F

Feb 21, 2015

Two leading standards for the electronics assembly industry have been revised. IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies is recognized worldwide as the sole industry-consensus standard for soldering processes and materials. IPC-A-610F, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronics assemblies meet the most current acceptance requirements. Some significant changes to IPC-J-STD-001F and IPC-A-610F standards include: Requirements added for two new SMT terminations P-Style terminations Butt/I terminations — Solder charged terminations Revised Class 2 plated-through hole vertical solder fill requirements Revised void criteria for BGA/CSP components Revised class 2 flux activity criteria Improved language for…

Semiconductor Unit Shipments To Exceed One Trillion Devices in 2017

Feb 19, 2015

Updated forecast expects robust 8.2% average annual semiconductor unit shipment growth through 2019. Total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march through the current cyclical period and top one trillion units for the first time in 2017 according to IC Insights forecast presented in the 2015 edition of The McClean Report – A Complete Analysis and Forecast of the Integrated Circuit Industry. Semiconductor shipments in excess of one trillion units are forecast to be the new normal beginning in 2017.

Wireless Charging ICs Market Report

Feb 11, 2015

The First Edition analysis of the Wireless Charging Market is an in-depth analysis detailing the latest developments in this important emerging market. The wireless power charging IC market will see tremendous growth over the next five years, with a dollar market increasing from $284.3 million in 2015 to over $2.8 billion in 2020, a compounded annual growth rate (CAGR) of 58.7%. The wireless power charging market covered in this report is made up of both wireless charging receiver ICs and transmitter ICs. But the longer-term market growth is still uncertain.

Silicon Photonics Market Analysis by Products, Applications & Geography – Analysis & Forecast

Feb 10, 2015

Silicon Photonics is a relatively new technology which uses optical rays in order to transfer data between different computer chips and peripherals. New report covers particularly the markets for final products, devices and equipment that function on Silicon Photonics technology for six major application verticals namely: Telecommunications, Data communication, displays and consumer electronics, sensing, metrology, high performance computing and medicines. The silicon photonics market is expected to increase at a compound annual growth rate (CAGR) of 27.74% from 2014 to $497.53m by 2020.

Electronics Assembly IPC Standards Collection

Feb 6, 2015

It takes a lot to be successful in electronics assembly. Get the reference documents you need on all aspects of the job from solder materials, component characteristics, manufacturing and quality requirements, and acceptability of the final assembly. Includes 41 key documents for SMT and through-hole assembly, including the widely used IPC-A-610, J-STD-001 and IPC-A-620.  Get the complete IPC standards collection and save 55% on individual document prices. Users can also purchase and download IPC standards from Electronics.ca Publications by following IPC specs below.

Microcontroller Sales Regain Momentum After Slump

Feb 5, 2015

MCUs enter into the next wave of growth as new applications such as the Internet of Things and wearable systems emerge. Information in this Research Bulletin comes from The McClean Report 2015, IC Insights flagship market analysis and forecast report on the IC industry.  Details are provided at the end of this bulletin.