The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies.  It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years. The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). There is one additional chapter on Test, developed in 2013, also included.  The PEGs and TWGs are defined below. The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five…

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. Over the past several years the migration from the use of lead-bearing materials to lead-free materials has resulted in many changes in electronics manufacturing operations. Some of the residual materials that remain on the circuit card assembly are becoming increasingly more problematic to clean. Component densities and component under-clearances are creating new cleaning challenges. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.  With guidance from industry experts, the…

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated ‘F’ Revisions Cover More Advanced Technologies  IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards,  IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610 Acceptability of Electronics Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria for P-style and solder-charged Butt/I SMT terminations, a change to void criteria for BGAs, and enhancements to the language within the documents to provide ease of use and clarity. New photos facilitate further understanding….

ELECTRONICS.CA PUBLICATIONS announces the availability of a new comprehensive analysis of industry segments, trends, growth drivers, market share, market size and demand forecasts on the global Fuses and Circuit Breakers market. Global market for Fuses and Circuit Breakers is projected to reach US$19.7 billion by 2020, driven by sustained demand in commercial power distribution systems.

As of November 2014, sales growth was flat in the bare printed circuit board (PCB) and electronics manufacturing services (EMS) segments of the electronics industry, in sharp contrast to semiconductor sales that continued to skyrocket. U.S. new orders for electronics products, which tend to lead sales by about one month, continued to sag. IPC’s PCB book-to-bill ratio, which normally leads PCB sales by three to six months, climbed further to 1.06 in November after hovering around 1.00 during most of 2014. Ratios above parity (1.00) indicate greater demand than supply, which may be a precursor of strengthening sales growth in…

Nanotechnology and nanomaterials are key enablers for a whole new generation of products and processes, some of which have come onto the market in 2014 in sectors such as consumer electronics. The Nanotechnology Industry Review and Prospects Report is a comprehensive guide to materials, markets and products in nanotech over the past 12 months and future developments. This publication details leading developments within the industry during this period. 2014 witnessed numerous major advances enabled by nanomaterials in consumer electronics (quantum dots), medicine and coatings technology. The number of nanocellulose and graphene producers and applications developers has grown significantly. Other 2D…

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Markets for Carbon Nanotubes as Transparent Conductors”.  According to this report, conductive coatings (TCs) based on carbon nanotubes (CNTs) will generate almost $300 million in revenues by 2020, rising to more than $0.5 billion by 2022.  However, while suppliers of CNT TCs are currently focusing on the opportunities in touch panels, a bigger opportunity for these materials will be found in thin-film photovoltaics (TFPV) and anti-static coatings.

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report on the global Active Optical Cables market, covering the industry segments, trends, growth drivers, market share, market size and demand forecasts.  Global market for Active Optical Cables (AOC) is projected to surpass US$2 billion by 2020, driven by bandwidth explosion, expansion of internet infrastructure, and advancements in fiber optics technology. Need For Bandwidth Drives Demand for Active Optical Cables Active Optical Cables present an integral part of contemporary data communication platforms. Defined as a cabling solution that provides electrical to optical conversion on cable ends for improved speed and distance efficiency, active optical…

While LTE and LTE-Advanced deployments are still underway, wireless carriers and vendors have already embarked on R&D initiatives to develop so-called “5G” technology, with a vision of commercialization by 2020. 5G is essentially a revolutionary paradigm shift in wireless networking to support the throughput, latency, and scalability requirements of future use cases such as extreme bandwidth augmented reality applications and connectivity management for billions of M2M (Machine to Machine) devices. Although 5G is yet to be standardized, some of the collectively accepted attributes of the technology include new air interface transmission schemes, new spectrum bands, spectrum aggregation, Massive MIMO, beamforming,…

ELECTRONICS.CA PUBLICATIONS announces the availability of a new report entitled “Optical Network Components: Global Markets”.  This study reveals that the ongoing migration from lower speed to higher speed connections is providing optical network component suppliers with a recurring revenue stream. Optical network semiconductors will witness an increase from $6.4 billion in 2014 to $7.6 billion in 2019, registering a 3.2% rise in compound annual growth rate (CAGR). The result is that optic components will continue to be an area of prime interest to silicon suppliers.