IC Design and Packaging Technologies

  Title Product code Price  
Global and China Advanced Packaging Industry Report 2012-2013 Global and China Advanced Packaging Industry Report 2012-2013

ISBN / SKU #: RIC1284

US$2,500.00
ASICs, ASSPs and PLDs/FPGAs - Market Research Report

ISBN / SKU #: SC7840

US$6,000.00
The Worldwide IC Packaging Market

ISBN / SKU #: NVR1740

US$3,495.00
3-D TSV: Insight On Critical Issues And Market Analyses 3-D TSV: Insight On Critical Issues And Market Analyses

ISBN / SKU #: TIN9700

US$2,495.00
Equipment and Materials for 3D IC and Wafer-Level-Packaging Equipment and Materials for 3D IC and Wafer-Level-Packaging

ISBN / SKU #: YD4822

US$5,390.00
Advanced IC Packaging, Technologies, Materials and Markets

ISBN / SKU #: NVR6085

US$3,495.00
Flip-Chip Market and Technology Trends Flip-Chip Market and Technology Trends

ISBN / SKU #: YD2850

US$7,990.00
Micro Nano Sensors Market: Global Forecast and Analysis 2011-2016

ISBN / SKU #: MA-SE1795

US$4,650.00
System-On-A-Chip - Global Strategic Business Report System-On-A-Chip - Global Strategic Business Report

ISBN / SKU #: GIA-MCP1471

US$4,500.00
System-in-Package (SiP) Technology - Global Strategic Business Report System-in-Package (SiP) Technology - Global Strategic Business Report

ISBN / SKU #: GIA-MCP7595

US$4,600.00
Digital Signal Processors Market, Global Forecast & Analysis 2011-2016

ISBN / SKU #: MA-SE1258

US$4,650.00
3D IC & TSV Interconnects 2012 Business Update

ISBN / SKU #: YD4290

US$5,390.00
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