IC Design and Packaging Technologies

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Title	Product code	Price
Global and China Advanced Packaging Industry Report 2012-2013	ISBN / SKU #: RIC1284	US$2,500.00	Select options
ASICs, ASSPs and PLDs/FPGAs - Market Research Report	ISBN / SKU #: SC7840	US$6,000.00	Select options
The Worldwide IC Packaging Market	ISBN / SKU #: NVR1740	US$3,495.00	Select options
3-D TSV: Insight On Critical Issues And Market Analyses	ISBN / SKU #: TIN9700	US$2,495.00	Add to Cart
Equipment and Materials for 3D IC and Wafer-Level-Packaging	ISBN / SKU #: YD4822	US$5,390.00	Select options
Advanced IC Packaging, Technologies, Materials and Markets	ISBN / SKU #: NVR6085	US$3,495.00	Select options
Flip-Chip Market and Technology Trends	ISBN / SKU #: YD2850	US$7,990.00	Add to Cart
Micro Nano Sensors Market: Global Forecast and Analysis 2011-2016	ISBN / SKU #: MA-SE1795	US$4,650.00	Select options
System-On-A-Chip - Global Strategic Business Report	ISBN / SKU #: GIA-MCP1471	US$4,500.00	Select options
System-in-Package (SiP) Technology - Global Strategic Business Report	ISBN / SKU #: GIA-MCP7595	US$4,600.00	Select options
Digital Signal Processors Market, Global Forecast & Analysis 2011-2016	ISBN / SKU #: MA-SE1258	US$4,650.00	Select options
3D IC & TSV Interconnects 2012 Business Update	ISBN / SKU #: YD4290	US$5,390.00	Select options

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