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The Bestselling New Releases in Technology & Market Research

GIA-MCP1078
US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Alarm Monitoring Services in US$ Million by the following Segments: Intrusion & Fire Alarm Monitoring...

TIN4700
US$2,495.00
Date of Publication: Oct 18, 2017
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits.  This report discussed the potential for these products to be the next killer green application.

TIN9000
US$2,495.00
Date of Publication: Oct 18, 2017
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

TIN9700
US$2,495.00
Date of Publication: Oct 18, 2017
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

TIN4750
US$2,495.00
Date of Publication: Oct 18, 2017

The commercial battle for next-generation power semiconductors is evolving. IGBTs, SiC and other technologies are geared for the niche-oriented markets at 1,700 volts and higher. But what is the best technology for the larger 600- and 1,200-volt markets? both super-junction MOSFETs and IGBTs are ramping up on 300mm wafers, making them less expensive than GaN and SiC. In comparison, SiC MOSFETs are ramping up on 100mm wafers, while GaN-on-silicon is running on 150mm substrates. This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices.  Market shares of vendors by type are presented.


GIA-MCP2775
US$4,950.00
Date of Publication: Oct 18, 2017

This report analyzes the worldwide markets for Lighting Fixtures and Luminaires in US$ by the following Product Segments and End-Use Sectors: Product Segments - Portable, Non-Portable, and Parts and Accessories; End-Use Sectors - Automotive Lighting, and General Lighting (Residential, Office, Outdoor, Architectural, & Others). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. 


GIA-MCP7853
US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Automatic Number Plate Recognition Systems in US$ Thousand. The Global market is analyzed by the following Applications: Toll & Parking, Law Enforcement, and Journey Time. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, China, South Korea and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024. 

GIA-MCP7874
US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Environmental Sensing and Monitoring Technologies in US$ Million by the following Segments: Air Monitoring, Water Monitoring, Soil Monitoring, and Noise Monitoring. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. 

IN4852
US$2,495.00
Date of Publication: Oct 18, 2017

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.


GIA-MCP1077
US$4,950.00
Date of Publication: Oct 18, 2017
This report analyzes the worldwide markets for Electronic Security Systems (ESS) in US$ by the following Product Segments: Alarms, Electronic Access Control Systems, CCTV and Video Surveillance Systems, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.

TIN5480
US$4,995.00
Date of Publication: Oct 18, 2017

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.


IPC-7091
US$180.00
Date of Publication: Oct 17, 2017
The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements—some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components’ substrate structure.