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The Bestselling New Releases in Technology & Market Research

Global Market for Surface Haptics
FM4760
Global Market for Surface Haptics
US$1,500.00
Date of Publication: Apr 1, 2019
The global surface haptics market is segmented into electrotactile, thermal and mechanical feedback technologies including Variable-friction surfaces, Pin arrays, Deformable devices, Electrostatic, Microfluidic, Shape memory, Magneto-Rheological, Electroactive polymers (EAPs), Haptic jamming, Ultrasonic vibration 28, Electromagnetic: ERMS, LRAS, VCMS, Acoustic vibration and Tactile overlays.
Global Market for Carbon Nanotube
FM2580
The Global Market for Carbon Nanotubes 2018-2027
US$1,000.00
Date of Publication: Jun 6, 2019
Large-scale industrial production of single-walled carbon nanotubes (SWCNTs) has been initiated, promising new market opportunities in transparent conductive films, transistors, sensors and memory devices. Market volume for SWCNTs will increase in the coming years due to multi-volume production methods coming on stream and reduction in price. This will allow for penetration in high volume markets such as polymer composites, coatings, rubber and tires, batteries, construction materials, power cables and plastics.
IC Cost and Price Model
ICK2IM
2019 IC Cost and Price Model
US$2,400.00
Date of Publication: May 28, 2019

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

The IC Knowledge - MEMS Cost Model
ICK-2014MCM
The IC Knowledge - MEMS Cost and Price Model
US$1,995.00
Date of Publication: May 28, 2019
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.
The Global Market for Zinc Oxide Nanoparticles
FM4580
The Global Market for Zinc Oxide Nanoparticles
US$1,025.00
Date of Publication: May 28, 2019
The market for zinc oxide nanoparticles (Nano-ZnO) continues to grow, mainly driven by the demand for UVA/B filters in sunscreens and sun protection cosmetics. The Nano-ZnO market is dominated by multi-national chemicals and advanced materials companies, who mainly supply brand owners and contract manufacturers in the the ultraviolet (UV)-protection markets, principally in cosmetics and sunscreens, in multi-ton quantities. Secondary markets they sell to include academia and research, paints, coatings, biomedicine and automotive.
IPC-2591: Connected Factory Exchange (CFX)
IPC-2591
IPC-2591: Connected Factory Exchange (CFX)
US$168.00
Date of Publication: Apr 22, 2019
PC-2591 standard establishes the requirements for the omni-directional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.
The Global Market for Graphene Quantum Dots
FM5674
The Global Market for Graphene Quantum Dots
US$525.00
Date of Publication: May 21, 2019
Carbon quantum dots (CDs, CQDs or C-dots) and graphene quantum dots (GQDs) have recently emerged as a new class of QD materials. GQDs possess unique optical and electrical properties.
GB-PLS005N
EMI/RFI: Materials and Technologies
US$5,550.00
Date of Publication: Oct 24, 2018
This report identifies the nature of the EMI/RFI problem, noting the ways that the redesigning of shielding and electronics can overcome these problems. Technologies and materials specific to EMI/RFI shielding are also identified and analyzed for their impact on plastics and other materials within a context of trends in components and devices used in the electronics medical, automotive and consumer products industries.
Global Market for Metal-organic frameworks (MOFs)
FM4343
The Global Market for Metal-organic frameworks (MOFs)
US$850.00
Date of Publication: May 21, 2019
Metal-organic frameworks (MOFs) and related materials are a class of crystalline nanoporous molecular scaffolds MOFs possess excellent chemical and physical properties and can be assembled from a variety of metals and a large number of organic linkers to produce highly ordered, 3D structures.
Semiconductor Devices for High Temperature Applications: Market Opportunities
GB-SMC114A
Semiconductor Devices for High Temperature Applications: Market Opportunities
US$5,500.00
Date of Publication: Apr 23, 2019
The global market for semiconductor devices for high-temperature applications should grow from $3.9 billion in 2018 to $9.4 billion by 2023 with a compound annual growth rate (CAGR) of 19.2% for the period of 2018-2023. The market for semiconductor devices used in high-temperature applications is segmented into categories by type: GaN, SiC, GaAs, and diamond semiconductor substrate.
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-620C-Korean
IPC/WHMA-A-620C: 케이블 및 와이어 하네스 어셈블리들에 대한 요건들 및 수용
US$305.00
Date of Publication: Feb 1, 2017
이것은 케이블 및 와이어 하네스 어셈블리들의 요건들 및 수용을 위한 가장 최신 개정의 산업계가 합의한 유일의 표준으로서, 많은 섹션들에 걸쳐 있는 최신으로 갱신된 정보와 함께 안전 와이어링, 안전 케이블, 그로밋(grommet)들, 및 전선관(raceway)들에 대한 새로운 섹션들을 포함한다. 700개 이상의 사진들 및 삽화들이 있어, 이 표준은 케이블 및 하네스 어셈블리들과 관련하여, 크림프되어, 기계적으로 고정되고, 솔더링된 상호연결(interconnection)들을 생산해 내고, 관련된 어셈블리 활동들을 위한 물질들, 방법들, 테스트들 및 수용 기준들을 설명한다.
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-620C
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
US$200.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.