RESEARCH INDEX RESEARCH INDEX

       

The Bestselling New Releases in Technology & Market Research

GB-ENG012A
US$5,500.00
Date of Publication: Jan 7, 2019
The scope of this report covers various types of security systems used for airport security globally which are access control, cyber security, perimeter security, screening, surveillance, and others, classified in terms of their utility at airports, applications and regional markets. The report also discusses the major market players in various regions. Revenue forecasts are given for 2018 to 2023.

GB-AVM163A
US$5,500.00
Date of Publication: Dec 13, 2018
This report provides an updated review of ceramic capacitor technology, including materials and production processes, and identifies current and emerging applications for this technology. The global market for ceramic capacitors should grow from $14.8 billion in 2018 to $30.7 billion by 2023 at a compound annual growth rate (CAGR) of 15.7% for the period of 2018-2023.

IPC-9850A
US$180.00
Date of Publication: Oct 11, 2011
This document standardizes the parameters, measurement procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations.

IPC-J-STD-001G
US$160.00
Date of Publication: Nov 2, 2017
J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. 

IPC-7711/21C
US$330.00
Date of Publication: Jun 12, 2017
IPC 7711/21C has been completely updated to meet the best industry practices, common procedures and general information on rework, modification and repair of electronic assemblies. New procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.

IPC-4101D-WAM1
US$158.00
Date of Publication: Mar 17, 2017
If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.

ICK5280
US$5,000.00
Date of Publication: Nov 27, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.


ICK1250
US$2,300.00
Date of Publication: Nov 27, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

FM1241
US$1,400.00
Date of Publication: Nov 27, 2018
Many industries including electronics, automotive, aerospace, telecommunications and healthcare are exploring the use of high impact nanomaterials such as nanocellulose, carbon nanotubes and graphene. Other 2-D nanomaterials such as silicene, graphyne, graphdiyne, grapahane and molybdenum disulfide are also under intense study. CNTs and graphene are the strongest, lightest and most conductive fibers known to man, with a performance-per-weight greater than any other material.

MC4430
US$2,995.00
Date of Publication: Nov 21, 2018
This research provides an in-depth assessment of both technical issues (enabling technologies, 5G standardization and research initiatives, spectrum bands, etc.) and business areas (market drivers, challenges, use cases, vertical market applications, regulatory issues, trial commitments, introduction strategies, and impact to CSPs), as well as analysis of the emerging 5G ecosystem.  The report includes specific ecosystem constituent recommendations and forecasts for both 5G investments, subscriptions, and more for the period of 2020 – 2025.

IPC-A-620C
US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

IPC-A-610G
US$190.00
Date of Publication: Mar 15, 2018
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.