RESEARCH INDEX RESEARCH INDEX

       

The Bestselling New Releases in Technology & Market Research

Discrete and Power Products Cost and Price Model
ICK1250
The IC Knowledge - Discrete and Power Products Cost and Price Model (2018)
US$2,300.00
Date of Publication: Nov 27, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.
Wafer Fabrication Costs Model and Equipment Requirements
ICK5280
Strategic Cost and Price Model
US$5,000.00
Date of Publication: Nov 27, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.

Global Market for Nanocellulose to 2030
FM1241
The Global Market for Nanocellulose to 2030
US$1,400.00
Date of Publication: Nov 27, 2018
Many industries including electronics, automotive, aerospace, telecommunications and healthcare are exploring the use of high impact nanomaterials such as nanocellulose, carbon nanotubes and graphene. Other 2-D nanomaterials such as silicene, graphyne, graphdiyne, grapahane and molybdenum disulfide are also under intense study. CNTs and graphene are the strongest, lightest and most conductive fibers known to man, with a performance-per-weight greater than any other material.
Wireless Infrastructure, Applications, and Services Transformation: 5G, Network Slicing, Smart Antennas, and Mobile Edge Computing
MC4430
Wireless Infrastructure, Applications, and Services Transformation: 5G, Network Slicing, Smart Antennas, and Mobile Edge Computing
US$2,995.00
Date of Publication: Nov 21, 2018
This research provides an in-depth assessment of both technical issues (enabling technologies, 5G standardization and research initiatives, spectrum bands, etc.) and business areas (market drivers, challenges, use cases, vertical market applications, regulatory issues, trial commitments, introduction strategies, and impact to CSPs), as well as analysis of the emerging 5G ecosystem.  The report includes specific ecosystem constituent recommendations and forecasts for both 5G investments, subscriptions, and more for the period of 2020 – 2025.
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-620C
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC A-610G Acceptability of Electronic Assemblies
IPC-A-610G
IPC-A-610G Acceptability of Electronic Assemblies
US$190.00
Date of Publication: Mar 15, 2018
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.
MLCC Shortages: FY 2019 Tier-to-Tier Strategies and Alternative Reference Design Solutions
PK4093
MLCC Shortages: FY 2019 Tier-to-Tier Strategies and Alternative Reference Design Solutions
US$3,750.00
Date of Publication: Nov 14, 2018
This global market study offers a fresh look (as of November 2018) at the current market shortage in multilayered ceramic chip capacitors (MLCC) and offers the reader solutions based upon a tier-to-tier analysis of all known MLCC vendors by Case Size; followed by additional suggestions for solutions to the MLCC shortage based upon alternative MLCC case sizes or dielectrics for alternative reference designs.
5G Smart Antenna Market 2018 – 2023
MC2457
5G Smart Antenna Market 2018 – 2023
US$1,995.00
Date of Publication: Nov 12, 2018
This report evaluates the smart antenna market including key players, technologies, and solutions. This includes analysis of product and service strategy for smart antenna vendors. The report evaluates the role and importance of smart antennas in terms of 5G network optimization including data speed enhancement and error rate reduction. The report evaluates and provides forecasts for the smart antenna market by Type (SIMO, MISO, MIMO), connectivity, and application globally and regionally.
Next-Generation Power Semiconductors: Markets Materials, Technologies
TIN4750
Next-Generation Power Semiconductors: Markets, Materials, Technologies
US$2,495.00
Date of Publication: Nov 7, 2018
This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.
Taiwanese Smartphone Industry Report
MIC9850
The Taiwanese Smartphone Industry, 3Q 2018
US$1,200.00
Date of Publication: Oct 24, 2018
This report presents forecast and recent quarter review of mobile phone shipment volume, shipment value, and APS. Analysis of manufacturer volume rankings, shipment by maker, shipment by branded vendor, and price trend. Also provided are shipment breakdowns by system technology, operating system, display, production location and destination.
Worldwide Communications Processor Forecast 2017–2021
IDC-US43829718
Worldwide Communications Processor Forecast, 2018–2022
US$4,500.00
Date of Publication: May 24, 2018
Following the megamergers over the past two years, large-scale M&A and consolidation continued in 2017. Meanwhile, adoption of SDN- and NFV-based architectures, open source technologies, and the migration of workloads to public and private cloud is progressing and these trends are creating opportunities for vendors of communications processors.
Global and China Aluminum Electrolytic Capacitor Industry Report, 2018-2023
RIC7504
Global and China Aluminum Electrolytic Capacitor Industry Report, 2018-2023
US$3,000.00
Date of Publication: Nov 7, 2018
Aluminum electrolytic capacitor, a core electronic component, is widely used in consumer electronics, computers and peripherals, industry, electric power, lighting and automobiles. Global aluminum electrolytic capacitor production clusters in Japan, South Korea, Taiwan and Mainland China, of which Japan shares half the market.