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The Bestselling New Releases in Technology & Market Research

IPC-A-620C
US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

IPC-A-610G
US$190.00
Date of Publication: Mar 15, 2018
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

PK4093
US$3,750.00
Date of Publication: Nov 14, 2018
This global market study offers a fresh look (as of November 2018) at the current market shortage in multilayered ceramic chip capacitors (MLCC) and offers the reader solutions based upon a tier-to-tier analysis of all known MLCC vendors by Case Size; followed by additional suggestions for solutions to the MLCC shortage based upon alternative MLCC case sizes or dielectrics for alternative reference designs.

MC2457
US$1,995.00
Date of Publication: Nov 12, 2018
This report evaluates the smart antenna market including key players, technologies, and solutions. This includes analysis of product and service strategy for smart antenna vendors. The report evaluates the role and importance of smart antennas in terms of 5G network optimization including data speed enhancement and error rate reduction. The report evaluates and provides forecasts for the smart antenna market by Type (SIMO, MISO, MIMO), connectivity, and application globally and regionally.

TIN4750
US$2,495.00
Date of Publication: Nov 7, 2018
This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.

MIC9850
US$1,200.00
Date of Publication: Oct 24, 2018
This report presents forecast and recent quarter review of mobile phone shipment volume, shipment value, and APS. Analysis of manufacturer volume rankings, shipment by maker, shipment by branded vendor, and price trend. Also provided are shipment breakdowns by system technology, operating system, display, production location and destination.

IDC-US43829718
US$4,500.00
Date of Publication: May 24, 2018
Following the megamergers over the past two years, large-scale M&A and consolidation continued in 2017. Meanwhile, adoption of SDN- and NFV-based architectures, open source technologies, and the migration of workloads to public and private cloud is progressing and these trends are creating opportunities for vendors of communications processors.

RIC7504
US$3,000.00
Date of Publication: Nov 7, 2018
Aluminum electrolytic capacitor, a core electronic component, is widely used in consumer electronics, computers and peripherals, industry, electric power, lighting and automobiles. Global aluminum electrolytic capacitor production clusters in Japan, South Korea, Taiwan and Mainland China, of which Japan shares half the market.

MIC6785
US$800.00
Date of Publication: Sep 27, 2018
The report finds that the Taiwanese semiconductor manufacturing industry comprising mainly of foundry, DRAM, flash memory, and IDM sectors grew both year-on-year and sequentially in the second quarter of 2018.

RIC7842
US$3,400.00
Date of Publication: Nov 7, 2018
Battery management system (BMS), a key part of battery electric and hybrid vehicles, is primarily composed of battery electronics (BE) and battery control unit (BCU), with the former being responsible for collecting current, voltage and temperature data of battery and transmitting them to BCU and the latter for information exchange with other control units.

MIC8287
US$1,500.00
Date of Publication: Sep 10, 2018
The global wafer foundry industry is highly concentrated with the top-five players taking up about 76% of the total shipments. The increasing share of orders released by IDMs and the proliferation of emerging application ICs such as CPUs, GPUs, FPGAs, and ASICs have been major growth factors to drive the industry's growth over the years.

RIC5240
US$3,200.00
Date of Publication: Aug 22, 2018
Miniaturization of electronic products conduces to components of all sorts being smaller and smaller and spurs the growing demand for automated inspection equipment. In the wake of a transfer of electronic components production capacity to China, the AOI equipment has been developing by leaps and bounds over the past several years.