The Bestselling New Releases in Technology & Market Research

Date of Publication: Sep 12, 2018

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.

Date of Publication: Jan 4, 2019
Carbon fiber (CF) is used as a reinforcement material in composites. Carbon fiber reinforced plastic (CFRP) composites, offer a higher strength-to-weight ratio and stiffness-to-weight ratio than many structural materials. Lightweight, high-strength, and high-stiffness composite materials are crucial for the development of an energy efficient transportation industry, enabling vastly improved power generation, new mechanisms for storing and transporting reduced carbon fuels, and enhancing renewable power production.

Date of Publication: Mar 15, 2018
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

Date of Publication: Nov 27, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

Date of Publication: Jan 3, 2019

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.

Date of Publication: Nov 27, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.

Date of Publication: Sep 12, 2018
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test.

Date of Publication: Dec 27, 2018
This study outlines IDC Canada's market size and forecast for the Canadian information technology (IT) market by industry for the 2018–2022 forecast period. This document includes data on enterprise IT markets including hardware, software, and services — it does not encompass the connectivity market.

Date of Publication: Jan 2, 2019
 5G Solutions and Market Opportunities 2018 – 2023 represents the most comprehensive research available covering 5G technology, strategies, solutions, challenges and opportunities. This research covers core 5G technologies and operational issues as well as network slicing, smart antennas, security, and edge computing in support of 5G. It also assesses the market potential for Voice over 5G (Vo5G) as well as leading 5G enabled applications.

Date of Publication: Jan 2, 2019
This report provides comprehensive analysis of the quantum technology market. It assesses companies/organizations focused on quantum technology including R&D efforts, and potential gaming-changing quantum tech enabled solutions. The report evaluates the impact of quantum technology upon other major technologies and solution areas including AI, Edge Computing, Blockchain, IoT, and Big Data Analytics. The report provides analysis of quantum technology investment, R&D, and prototyping by region and within each major country globally.

Date of Publication: Jan 7, 2019
The scope of this report covers various types of security systems used for airport security globally which are access control, cyber security, perimeter security, screening, surveillance, and others, classified in terms of their utility at airports, applications and regional markets. The report also discusses the major market players in various regions. Revenue forecasts are given for 2018 to 2023.

Date of Publication: Dec 13, 2018
This report provides an updated review of ceramic capacitor technology, including materials and production processes, and identifies current and emerging applications for this technology. The global market for ceramic capacitors should grow from $14.8 billion in 2018 to $30.7 billion by 2023 at a compound annual growth rate (CAGR) of 15.7% for the period of 2018-2023.