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The Bestselling New Releases in Technology & Market Research

Next Generation Smart Factories: Industrial Robotics, IIoT, 3D Printing, and Advanced Data Management
MC3447
Next Generation Smart Factories: Industrial Robotics, IIoT, 3D Printing, and Advanced Data Management
US$2,995.00
Date of Publication: Jul 18, 2017
This research evaluates the impact of industrial robotics, IIoT, 3D Printing, and Advanced Data Management upon the manufacturing as well as other product and service creation industries.  The research covers how the Smart Factory of the future will bring digitization to heavy industry.  The research includes forecasts for 2017 through 2021 for each technology area in terms of market value expectations and penetration. 
IPC-6010-FAM, Printed Board Performance Specifications
IPC-6010-FAM
IPC-6010-FAM, Printed Board Performance Specifications
US$613.00
Date of Publication: Jul 17, 2017

IPC-6010-FAM, "Printed Board Performance Specifications" includes qualification and performance specification standards for all major types of printed boards.

Semiconductors for Alternative Energy Technologies: Opportunities and Markets
TIN4700
Semiconductors for Alternative Energy Technologies: Opportunities and Markets
US$2,495.00
Date of Publication: Jul 18, 2017
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits.  This report discussed the potential for these products to be the next killer green application.
Asia Microelectronics Market: China, Hong Kong, India, Indonesia, Japan, Korea, Malaysia, Singapore, and Taiwan
TIN4200
Asia’s Microelectronics Market: China, Hong Kong, India, Indonesia, Japan, Korea, Malaysia, Singapore, and Taiwan
US$2,495.00
Date of Publication: Jul 18, 2017
Asia’s going to be a very big part of driving the global recovery from the current financial crisis. With the emergence of a “billion new middle class consumers in India, in China, in Indonesia, and other parts of Asia,” the spending versus savings patterns of these new consumers will define the direction of the global economy in years to come. This report describes the technology infrastructure of nine Asian countries, detailing each countries’ developments in microelectronics, telecommunications, and computing.  Market forecasts are also presented in these sectors for associated countries.
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-620C
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC/WHMA-A-620C-FR Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles (French Language)
IPC/WHMA-A-620C-FR
IPC/WHMA-A-620C-FR: Exigences et Critères d’Acceptabilité pour l’Interconnexion des Faisceaux de Fils et de Câbles
US$280.00
Date of Publication: Jul 18, 2017
Ceci est la révision la plus récente de l’unique norme de consensus industriel sur les Exigences et Critères d’Acceptation pour l’Interconnexion des Faisceaux de Fils et de Câbles, et elle inclut de nouveaux chapitres sur le câblage de sécurité, les câbles de sécurité, les passe câbles et les chemins de câbles ainsi que des informations mises à jour dans de nombreux chapitres. 
IPC-2220-FAM: Design Standards for Printed Boards
IPC-2220-FAM
IPC-2220-FAM: Design Standards for Printed Boards
US$572.00
Date of Publication: Jul 17, 2017

This is a family of specification for board design. Put IPC's design library at your fingertips! The IPC-2220-FAM series is built around the IPC-2221, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology.

Printed Electronics Sepcs PtdEleFAM IPC Standards for PE
IPC-PtdEleFAM
PtdEleFAM, Printed Electronics Family
US$338.00
Date of Publication: Jul 17, 2017
PtdEleFAM, "Printed Electronics Family" is a set of IPC documents for printed electronics.
IPC-4550-FAM, Plating Specifications
IPC-4550-FAM
IPC-4550-FAM, Plating Specifications
US$533.00
Date of Publication: Jul 17, 2017
IPC-4550-FAM is a family of IPC specifications for plating for printed boards. This document collection includes IPC-4552 and IPC-4553 Specification for Immersion Silver Plating for Printed Boards and other IPC Plating Specs.
IPC-SolMatFAM
IPC-SolMatFAM
SolMatFAM: Solder Materials Family
US$515.00
Date of Publication: Jul 17, 2017
This is a family of specifications on soldering materials and solderability testing used in the printed board assembly processes.
IPC Coating Specifications for Boards and Assemblies
IPC-CoatBdsAssyFAM
Coating Specifications for Boards and Assemblies
US$420.00
Date of Publication: Jul 17, 2017

CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies. This is a family of IPC documents for coatings used in the printed board fabrication and assembly processes.

IPC 7090-FAM: Packages for PCBs and Assemblies
IPC 7090-FAM
IPC-7090-FAM: Packages for PCBs and Assemblies
US$533.00
Date of Publication: Jul 17, 2017
7090-FAM, IPC 7090-FAM is a family of specifications for design and assembly process implementation for SMT components.