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The Bestselling New Releases in Technology & Market Research

GB-SMC117A
US$5,500.00
Date of Publication: Jun 20, 2019
The global 5G chipset market should grow from $870.0 million in 2019 to reach $10.9 billion by 2024 at a compound annual growth rate (CAGR) of 65.7% for the period of 2019-2024.

ICK5280
US$5,500.00
Date of Publication: Apr 3, 2019

The Strategic Cost and Price Model - 2019 is now available with eight new fabs, expanded logic and DRAM process coverage, updated data and many other enhancements. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.


WG5447
US$4,400.00
Date of Publication: Jul 30, 2019
The 2019 study has 376 pages, 159 tables and figures. Worldwide markets are poised to achieve explosive growth generating several new trillion-dollar markets as the digital economy takes hold. Across the industrial spectrum smart devices and robots provetheirvalue by managing digital informationin real time across enterprise boundaries, encouraging collaborative business efforts. Lowering the costs of manufacturing and logistics management is a key benefit.

IPC-A-620C
US$200.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

IPC-A-610G
US$200.00
Date of Publication: Jun 18, 2019
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

FM8025
US$3,720.00
Date of Publication: Jul 5, 2019
Analysis Of The Following Nanomaterials: Aluminium Oxide Nanoparticles, Antimony Tin Oxide Nanoparticles, Bismuth Oxide Nanoparticles, Carbon Nanotubes, Cerium Oxide Nanoparticles, Cobalt Oxide Nanoparticles, Copper Oxide Nanoparticles, Dendrimers, Fullerenes, Gold Nanoparticles, Graphene, Iron Oxide Nanoparticles, Magnesium Oxide Nanoparticles, Manganese Oxide Nanoparticles, Nanocellulose, Nanoclays, Nanodiamonds, Nanofibers, Nanosilver, Nanowires, Nickel Nanoparticles, Quantum Dots, Silicon Oxide Nanoparticles, Titanium Dioxide Nanoparticles, Zinc Oxide Nanoparticles, Zirconium Oxide Nanoparticles, Nanoprecipitated Calcium Carbonate, Graphene And Carbon Quantum Dots, Hydroxyapatite Nanoparticles, Palladium Nanoparticles, Yttrium Oxide Nanoparticles, Other 2D Materials.

TIN8500
US$2,495.00
Date of Publication: Jul 5, 2019

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


TIN4800
US$2,495.00
Date of Publication: Jul 5, 2019
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

TIN4700
US$2,495.00
Date of Publication: Jul 5, 2019
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits. This report discussed the potential for these products to be the next killer green application.

TIN4200
US$2,495.00
Date of Publication: Jul 5, 2019

This report describes the technology infrastructure of nine Asian countries, detailing each countries' developments in microelectronics, telecommunications, and computing. Market forecasts are also presented in these sectors for associated countries.


TIN8200
US$2,495.00
Date of Publication: Jul 5, 2019
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

TIN4400
US$2,495.00
Date of Publication: Jul 5, 2019

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.