RESEARCH INDEX RESEARCH INDEX

       

The Bestselling New Releases in Technology & Market Research

Smart Appliance Technology Analysis and Market Forecast
MC2255
Smart Appliance Technology Analysis and Market Forecast 2016 – 2021
US$995.00
Date of Publication: Jun 21, 2017
This research evaluates the Smart Appliance marketplace including technologies, companies, solutions, products, and services. The report includes analysis of leading companies and their strategies and offerings. The report also provides extensive market projections with forecasts covering the period 2016 to 2021.
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC-J-STD-001F-WAM1
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
US$160.00
Date of Publication: May 12, 2016
IPC J-STD-001F is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This revision includes support for both traditional solder alloys and for lead-free manufacturing. Examples of some of the significant changes are revision to plated-through hole, PTH, minimum fill requirements; criteria for two new SMT termination types; and expanded conformal coating criteria.
IPC-A-610F-FR Acceptabilité des assemblages électroniques
IPC-A-610F-FR
IPC A-610F-FR Acceptabilité des assemblages électroniques (IPC A-610 in French)
US$234.00
Date of Publication: Jul 30, 2015
l'IPC-A-610 est la norme la plus utilisée dans le monde pour les assemblages électroniques. L'IPC-A-610 est incontournable pour tous les services d'assemblage et d'assurance qualité, l’IPC-A-610F illustre les critères de réalisation pratique acceptés par l’industrie pour les assemblages électroniques au travers de points détaillés reflétant les conditions acceptable et défaut grâce à des illustrations et des photographies en couleur. Cette révision inclut deux nouveaux types de terminaisons TMS, ainsi que des changements pour les critères de remplissage des trous métallisés et les vides dans les BGA. En outre, chaque fois que cela a été possible, les points ont été modifiés pour une meilleure lisibilité et une compréhension améliorée - sans supprimer aucune exigence.
IPC-T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-T-50M
IPC-T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits
US$160.00
Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
Connected Home and Smart Appliances 2017 - 2022
MC1273
Connected Home and Smart Appliances 2017 - 2022
US$2,995.00
Date of Publication: Jun 20, 2017
This research assesses the Connected Home and Smart Appliance marketplace, including major industry players, and solutions. The role of IoT and supporting technologies is evaluated with analysis of current market inhibitors and solutions. The report provides market forecasts for major market segments, sub-segments, and regional expectations for the period 2017 through 2022.
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-620C
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.
IPC 7711/21C Rework, Modification and Repair of 7711/21BElectronic Assemblies
IPC-7711/21C
IPC 7711/21C Rework, Modification and Repair of Electronic Assemblies
US$330.00
Date of Publication: Jun 12, 2017
IPC 7711/21C has been completely updated to meet 2017 best industry practices, common procedures and general information on rework, modification and repair of electronic assemblies. New procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.
IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-4101D-WAM1
IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
US$158.00
Date of Publication: Mar 17, 2017
If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Service Robotics Industry - Global Strategic Business Report
GIA-MCP6565
Service Robotics - Global Strategic Business Report
US$4,950.00
Date of Publication: Jun 19, 2017
This report analyzes the worldwide markets for Service Robotics in US$ Thousand and Units by the following Product Categories: Personal Use Robots, and Professional Use Robots. The global market for Personal Use Robots Service Robotics market is analyzed by the following Application Segments: Domestic Robots, Entertainment Robots, and Others. The global market for Processional Use Robots Service Robotics market is analyzed by the following Application Segments: Defense, Field, Logistics, Medical, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.
Smart Sensors Market Report
GIA-MCP1234
Smart Sensors - Global Strategic Business Report
US$4,950.00
Date of Publication: Jun 19, 2017
This report analyzes the worldwide markets for Smart Sensors in US$ Thousand by the following Product Segments: Smart Flow Sensors, Smart Pressure Sensors, Smart Temperature Sensors, Smart Position Sensors, and Smart Load Cells. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2016 through 2024.
Smartphone 3D Cameras
GIA-MCP7650
Smartphone 3D Cameras - Global Strategic Business Report
US$4,500.00
Date of Publication: Jun 19, 2017
This report analyzes the worldwide markets for Smartphone 3D Cameras in US$. The Global market is further analyzed by the following resolution types - Up to 16 MP, and Above 16 MP. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2024.
Worldwide Major Mobile Phone Vendor Performance
MIC5480
Worldwide Major Mobile Phone Vendor Performance, 2Q 2017
US$880.00
Date of Publication: Jun 19, 2017
This research report presents worldwide mobile phone shipment volume forecast and recent quarter review of major mobile phone vendor performance. The report includes major vendors' shipment volume and growth, shipment revenue and growth, operating profit and ASP.