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The Bestselling New Releases in Technology & Market Research

GB-EGY043B
US$4,950.00
Date of Publication: Dec 12, 2017
The global market for advanced exploration and downhole technology reached $163.2 billion in 2015. This market is estimated to reach $233.4 billion in 2021 from $175.8 billion in 2016 at a compound annual growth rate (CAGR) of 5.8% for 2016-2021.

WG4178
US$4,300.00
Date of Publication: Dec 12, 2017
The study is designed to give a comprehensive overview of the Micro-Electro-Mechanical Systems MEMs Sensors market segment. Research represents a selection from the mountains of data available of the most relevant and cogent market materials, with selections made by the most senior analysts. Commentary on every aspect of the market from independent analysts creates an independent perspective in the evaluation of the market. In this manner the study presents a comprehensive overview of what is going on in this market, assisting managers with designing market strategies likely to succeed.

GB-IFT066C
US$4,950.00
Date of Publication: Dec 12, 2017
Printed Electronics report covers market trends, market sizing and forecast across printed electronic component segments, including printing methods, inks and substrates, and across applications including optoelectronics for displays, energy, sensors and radio frequency devices. The global printed electronics market should reach $26.6 billion by 2022 from $14.0 billion in 2017 at a compound annual growth rate (CAGR) of 13.6%, from 2017 to 2022.

TIN5200
US$2,495.00
Date of Publication: Dec 12, 2017
At the time of the alleged 2010 embargo, Chinese firms accounted for 97 percent of rare-earth oxide production and a large fraction of the processing business that turns these into rare earth metals, alloys, and products like magnets. This near-monopoly was in a market with surging demand and intense political resonance in consuming countries. And the most dependent countries—primarily Japan and the United States, but also several European states—happened to be those over which China most wanted influence. Prices soared in the REE spot market in the wake of China’s 2010 export cuts, especially as downstream users—companies that incorporate REEs into other products—filled inventories to protect themselves from future disruptions. Downstream markets are already adjusting to the changing supply picture through normal market mechanisms. This report presents a forecast of REE for a variety of technologies: semiconductors, HDDs, FPDs, mobile devices, LEDs, and alternative energy

GB- AVM066F
US$4,950.00
Date of Publication: Dec 12, 2017
The report addresses trends in superconductivity technology and the global market for superconductivity applications during the period from  2017 through 2022. The global market for superconductivity applications should reach $8.8 billion by 2022 from $6.1 billion in 2017 at a compound annual growth rate (CAGR) of 7.5%, from 2017 to 2022.

GB-SMC106A
US$5,500.00
Date of Publication: Aug 18, 2017
This report addresses the global market for thermal management products for microchips during the forecast period through 2022. The global market for thermal management products should reach $6.3 billion by 2022 from $4.7 billion in 2017 at a compound annual growth rate (CAGR) of 6.0%, from 2017 to 2022.

A620-STD-0-D-0-SP-C
US$190.00
Date of Publication: May 17, 2017
Esta es la revisión más reciente del único estándar de consenso de la industria sobre los requisitos y la aceptabilidad de ensambles de cables y mazos de cables e incluye nuevas secciones sobre alambres de seguridad, cables de seguridad, pasamuros y bandejas junto a mucha más información actualizada en muchas secciones del libro. 

ICK300
US$1,300.00
Date of Publication: Nov 24, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

ICK1250
US$2,150.00
Date of Publication: Nov 24, 2017
The Discrete and Power Products Cost and Price Model - new revision has now been released with new processes and other enhancements. Easily calculate the cost and price of high power silicon ICs and discrete devices with only 5 required selections/entries. The model supports over 260 processes and over 70 package types. All of our models include twelve month of updates with reasonable email and phone support.

ICK2IM
US$2,150.00
Date of Publication: Nov 24, 2017

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.


ICK5280
US$5,000.00
Date of Publication: Nov 24, 2017

The IC Knowledge - Strategic Cost Model takes the top three companies in each of four segments and provides a detailed look at all of their current and past processes on 300mm and forward forecasts out to the next decade. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron


ICK-2014MCM
US$1,900.00
Date of Publication: Nov 24, 2017
The IC Knowledge - MEMS Cost Model is the industry standard for cost modeling of MEMS products. Very easy to use tech model allows for up to two MEMS and up to two integrated circuit die in the same package providing a full MEMS product solution. The model then presents a detailed analysis of cost. The model supports both pre-defined and user defined products, processes and process steps. Cost includes wafer fabrication, wafer test, packaging and final test..