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The Bestselling New Releases in Technology & Market Research

PT4750
US$3,650.00
Date of Publication: Jul 28, 2015
The report also addresses Visible Light Communications (VLC) as an advanced technology for the ITS development, emphasizing that VLC is defined by the industry as a 5G technology. Details of VLC technological advances, its multiple ITS-related applications, market data and the survey of major industry players are also included. The report is also analyzing advances in driverless car developments as a part of ITS progress related to the 5G evolution. Major driverless car features, standardization and the most important projects with multiple players’ products are analyzed. Benefits and issues of such cars commercial introduction are addressed. It is expected that by 2040 about 65%-70% of all cars on the roads will be driverless.

IDT6448
US$4,495.00
Date of Publication: Feb 5, 2015
Industrial and Commercial electric vehicles will be a similar market to Cars but innovating faster and frequently more profitable for all in the value chain. The most important sector is Buses, the subject of this report, where innovation often comes before cars because they are less price sensitive. In this report we show how the Chinese are now dominating the league table, buying the most buses and innovating rapidly already creating the lowest cost base by far. We examine the different power trains and the move from chassis to integrated manufacture often with no chassis and later structural electronics as bodywork will come.

WG7540
US$4,000.00
Date of Publication: Jul 27, 2015
The 2015 study has 1022 pages, 258 tables and figures.  Worldwide Industrial Robot markets are poised to achieve significant growth as the  automotive early adopter base provides a way for other industries to leverage economies of scale.  Industrial Robot infrastructure in one industry makes it easier to extend product sets so that they are more available across all industries, remaking all manufacturing everywhere.

ICK4500
US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

GIA-MCP7927
US$4,500.00
Date of Publication: Jul 25, 2015
Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining importance as a highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. 3D TSV devices possess stacked silicon wafers interconnected vertically by employing TSVs. The 3D TSV devices offer numerous benefits in wafer/chip assembly, which include superior performance as compared to conventional techniques, reduction in package size, heterogeneous integration, and superior performance. Driven by the growing demand for innovative, high-performance chip architectures featuring benefits such as superior performance, power consumption and form factor features, 3D TSV technology is making robust progress in the semiconductor industry.

RIC2287
US$2,200.00
Date of Publication: Jul 24, 2015
This report provides: Analysis of global semiconductor market and industry, Analysis of Chinese semiconductor market and industry, Analysis of global and China foundry industry, Study of 16 foundry vendors. Global foundry industry was worth about USD46.1 billion in 2014, up 18.2% from 2013, and is expected to reach USD52.8 billion in 2015, a year-on-year growth of 14.5%, and USD58.3 billion in 2016, rising by 6.4% against 2015, and increase by just 3.7% in 2017.

MA-SE3552
US$4,650.00
Date of Publication: Jul 24, 2015
4D printing is defined for this market study as the technology in which the fourth dimension entails a change in form or function after the 3D printing of Programmable Material (PM). In other words, 4D printing allows objects to be 3D printed and then to self-transform in shape and material property when exposed to a pre-determined stimulus such as submersion in water, or exposure to heat, pressure, current, ultraviolet light, or some other source of energy.

RIC1282
US$2,300.00
Date of Publication: Jul 24, 2015
China Semiconductor Industry Report Covers: 1. Global Semiconductor Market and Industry; 2. China Semiconductor Market and Industry; 3. Eleven Chinese...

GB-MFG021C
US$6,650.00
Date of Publication: Jul 24, 2015
This report provides an overview of the global markets for electronics contract manufacturing services; Analyses of global market trends, with estimates for 2015 and 2016, and projections of compound annual growth rates (CAGRs) through 2021;  Discussion covering electronics contract manufacturing services operations which may include designing, manufacturing, testing, distributing, and providing repair services for electronic assemblies required by original equipment manufacturers (OEMs).

RIC4875
US$2,500.00
Date of Publication: Jul 24, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

IDT8780
US$4,975.00
Date of Publication: Jul 24, 2015
This report explains the materials and performance achievements and objectives of the 80 manufacturers of supercapacitors and supercabatteries. It reveals, in easily accessed form, the performance, formulation and morphology of the key materials used and planned for the future. It concerns materials work both by the device manufacturers and by the many third party developers and suppliers across the world. The structure of a supercapacitor and supercabattery is introduced together with the materials and parameters needed.

GB-SMC071C
US$6,650.00
Date of Publication: Jul 24, 2015

This report provides: An overview of the global market for thermal interface materials, which have experienced growing demand with the increased need for thermal management technologies. Analyses of global market trends, with data from 2014, estimates for 2015, and projections of compound annual growth rates (CAGRs) through 2020. Identification of thermal interface materials (TIM) technologies and products with the greatest commercial potential in the near to mid-term, and of companies that are best positioned to meet this demand because of proprietary technologies, strategic alliances, or other advantages.  The global market for thermal interface materials reached $715.9 million in 2014. This market is forecasted to grow at a compound annual growth rate (CAGR) of 7.4% to reach nearly $1.1 billion in 2020.