Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

US$4,500.00
Date of Publication: Oct 15, 2015
This report analyzes the worldwide markets for Discrete Capacitors in US$ Million by the following End-Use Segments: Telecommunication, Computers & Peripherals, Consumer Electronics, Automotive, Aerospace & Defense, and Industrial & Other Applications. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual estimates and forecasts are provided for the period 2014 through 2020. Also, a seven-year historic analysis is provided for these markets.

US$2,750.00
Date of Publication: Nov 30, 2016
The study provides market data on the global capacitor industry and establishes the value, volume and pricing of capacitors consumed in the automotive segment and forecasts their consumption out until 2020. The study also offers deep dive analysis for Automotive Ceramic Capacitors, Automotive Tantalum Capacitors, Automotive Aluminum Capacitors, Automotive DC Film Capacitors, Automotive AC Power Film Capacitors; and Automotive Supercapacitors. Each appendix is dedicated to the individual capacitor dielectrics consumed in the automotive segment by type and configuration with detaiuled market shares for vendors who compete in the stringent automotive sector.

US$2,750.00
Date of Publication: Sep 6, 2016
This study is a detailed global market analysis for linear resistors and their respective sub-categories. The market study includes a deep dive analysis on the global market for chip resistors, multichip resistor arrays, SIP and DIP resistor networks; wirewound resistors, nichrome resistors, tin-oxide resistors, carbon film resistors, and bulk metal foil resistors. A detailed competitive analysis is also given, as is global market share data for linear resistors by world region. Global market forecasts are given in terms of value, volume and pricing for each resistor product by type and sub-category for each year to 2021.

US$3,950.00
Date of Publication: Oct 25, 2016
Investigating the effect new and innovative technology has, or will have, on the electronic interconnect industry is covered in this new research report,...

US$2,750.00
Date of Publication: Oct 5, 2016
The study addresses electric double layer carbon, lithium-ion, polyacene and mixed metal hybrid supercapacitor markets for FY 2016 with detail forecasts to 2016. This research covers global market assessment and developments in FY 2015 and FY 2016 and the shift in markets in FY 2017 with forecasts to FY 2021. The study is broken into ten main chapters and a producer profile section.

US$2,495.00
Date of Publication: Oct 6, 2016
Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications. This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Oct 6, 2016
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.