Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

US$4,500.00
Date of Publication: Aug 23, 2016

This report analyzes the worldwide markets for Paper and Plastic Film Capacitors in US$ Million by the following two major Product Segments: AC Film Capacitors, and DC Film Capacitors. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Middle East, and Latin America.


US$3,950.00
Date of Publication: Aug 19, 2016
The market data contained in this report quantify opportunities for PE sensors and ultrasonic transducers. In addition to product types, this report also covers the merits and future prospects of the PE sensors and ultrasonic transducers business, including corporate strategies, information technologies, and the means for providing these highly advanced product and service offerings. This report also covers in detail the economic and technological issues regarded by many as critical to the industry's current state of change. It provides a review of the PE sensors and ultrasonic transducers industry and its structure, and of the many companies involved in providing these products. The competitive positions of the main players in the piezoelectric devices market and their strategic options are also discussed, along with such competitive factors as marketing, distribution and operations.

US$3,750.00
Date of Publication: Aug 1, 2016

This is a 350 page detailed global market analysis with 105 Figures and Graphs on thin film passive components, including thin film capacitors, thin film resistors and thin film inductors and thin film integrated passive devices. This study has all the basic aspects of a market research report including the value of global demand by passive component type, world region and end-use market segment, with detailed competitive analysis, market shares and forecasts to 2021. 


US$2,750.00
Date of Publication: Jul 12, 2016
This new study is a detailed market and competitive analysis covering both the multilayered thick film ceramic chip inductor and thin film ceramic chip inductor markets worldwide. This study begins with a worldwide overview and update on the global inductor markets for FY 2016 and recent changes in the market regarding the global value, volume and pricing.

US$2,750.00
Date of Publication: Mar 18, 2016
This report was designed for end-users of passive electronic components who need to update their supply chain information for capacitors, resistors and inductors on an annual basis. This report offers a granular look at the global and regional markets for 14 sub-types of passive electronic component. This report was designed with input from major purchasers of passive electronic components and in direct response to industry needs. This report forecasts global consumption volume, value and pricing for CAPACITORS: Ceramic, Aluminum, Tantalum, DC Film and AC Film Capacitors; RESISTORS: Thick Film Chip, Network and Array; Nichrome Metal Film, Tin-Oxide, Wirewound, Thin Film, Carbon Film; INDUCTORS: Horizontal Wirewound Inductors; Wirewound Chip Coil inductors, ferrite beads and bead arrays; multilayered chip inductors, axial and radial leaded inductors, ferrite cores, thin film inductor chips. This report was released in March 2016 and documents the impact of the current regional economic conditions on the passive component industry and the end-markets into which capacitors, resistors and inductors are sold. 

US$2,495.00
Date of Publication: Jun 1, 2016
Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications. This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Jun 1, 2016
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.