Active and Passive Electronic Components


Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

Date of Publication: Jun 15, 2015
Each year, a new slew of terms and definitions become common place in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.

Date of Publication: Aug 31, 2015
The timing devices market includes legacy crystal clocks, clock generation ICs such as multipliers, PLLs, and synchronizers, and clock distribution ICs.  A relatively technology includes CMOS oscillators and MEMs resonators and these two products are rapidly displacing older technology. This tracker provides forecasts for timing ICs and crystals. Forecasts are provided by region, market segment, application, and by product type. Market share is also provided.

Date of Publication: Aug 11, 2015
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

Date of Publication: Aug 11, 2015
Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications. This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

Date of Publication: Aug 3, 2015

This market research study analyzes the global markets for both AC plastic film and DC plastic film capacitors. For AC film capacitors the study focuses on the global value of demand for small and large can polypropylene dielectric plastic film capacitors, including both dry and oil-filled designs for use in electrical systems (power transmission and distribution capacitors; motor run capacitors, industrial drive capacitors; renewable energy capacitors; power film capacitors; microwave oven capacitors, magnetic ballast capacitors, and specialty power film capacitors. The second part of the study focuses on DC film capacitors for printed circuit board applications in power supply, lighting ballast, and consumer AV applications, and includes value and volume of demand for 5 mm pitch PET film capacitors; AC & Pulse film capacitors, interference suppression film capacitors and PPS, PEN and PET film chip capacitors; as well as specialty film capacitors for consumption in high temperature electronics.

Date of Publication: Jul 31, 2015

The report is an in-depth study prepared by people who have a deep involvement with the electronic component industry. Each country report is written by locals who have detailed knowledge of the electronic component distribution industry. These reports analyse the market split into semiconductors, passives and electromechanical components and component assemblies. The 2015 report contains details of the overall European and International component distribution scene, with profiles of major pan-European groups: Acal, Arrow, Avnet, Electrocomponents, Future, Farnell, Mouser, MSC, Rutronik and TTI. The 1000 plus page Report, contains the following information for Austria, Benelux, Czech Republic, Denmark, Finland, France, Germany, Hungary, Iberia, Italy, Norway, Poland, Russia, Sweden, Switzerland and UK.

Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.