Active and Passive Electronic Components

Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

Date of Publication: Jan 15, 2016
The study addresses global market drivers and market challenges for this unique dielectric over the next five years. The study breaks down global value and volume of demand for tantalum capacitors from both an historical and forecast perspective in terms of value, volume and average unit pricing. The study addresses demand by end-use market segment in the computer, telecommunications infrastructure, automotive, consumer AV, wireless handset, defense, medical, instrumentation, industrial and oil& gas industries worldwide. The study also addresses global demand and forecasts by world region; as well as demand by channel of distribution.

Date of Publication: Jan 5, 2016

The scope of this report covers many IGBT applications used globally in various types of end industries. The market is broken down into major packaging types, regions, property, applications and end-user industries. Revenue forecasts from 2015 through 2020 are given for each major IGBT type, with their applications and regional market. The report also includes a discussion of the major players in each of the regional markets and explains the major global drivers, the current trends, major challenges and the regional dynamics of the market. The report concludes with a special focus on the supplier landscape. It includes detailed profiles of the major vendors in the global IGBT industry, and it discusses the market share of the major players by region.

Date of Publication: Dec 28, 2015
The study employs multiple back studies on various individual component markets and their use in automotive electronic sub-assemblies, including ceramic capacitors, tantalum capacitors, aluminum capacitors, DC film capacitors, AC film capacitors, EDLC supercapacitors; high frequency ceramics; thick film chip resistors, resistor networks and arrays, nichrome film resistors, wirewound resistors, tin oxide resistors, carbon resistors, integrated passive devices; discrete inductors including ferrite beads, SMD chip coils and throughole inductors; as well as non linear resistors such as PTC and NTC thermistors and metal oxide varistors. 19 Individual component product lines that are critical to the future of the automobile are discussed in this report.

Date of Publication: Dec 15, 2015
DVD-64C-K identifies all of the important through-hole and surface mount component types – including: through-hole resistors, capacitors, diodes, potentiometers, pin grid arrays, sockets, DIPs, SIPs, transistors, LEDs, inductors, chokes, torroids, filters, fuses, breakers, switches, relays, crystals, voltage regulators, thermistors, connectors, sockets, headers, and jumpers. Also covers SMT component types (QFPs, PLCCs, rectangular chips, MELFs, SOICs, molded tantalum capacitors, SOTs, DPAKs), leadless components, QFNs, DFNs, LGAs, CCGAs and BGAs. Introduces resistor, capacitor and inductor values and tolerances.

Date of Publication: Dec 18, 2012

The new Revision H contains updated information on small shrink outline package (SSOP), thin small outline package (TSOP), quad flat pack (QFP), low-profile quad flat pack (LQFP), plastic quad flat package (PQFP), leadless chip carrier (LCC), quad flat no-lead (QFN), and ball grid array (BGA)-related packages, including all the variations within those groups. New components include dual flat no-lead (DFN), quad flat no-lead (QFN) multi-row, package on package (PoP), chip scale package (CSP), chip on board (COB), bare die, and flip chip. In addition, a new section has been added that stresses the dangers of cross contamination when using lead-free components and assemblies. 


Date of Publication: Jan 12, 2016
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

Date of Publication: Jan 12, 2016
Light-emitting diodes (LEDs) are on the verge of revolutionizing the lighting market. As a general illumination lighting source, LED products surpass many conventional lighting technologies (including incandescent and fluorescent light sources) in energy efficiency, lifetime, and versatility and rival them in color and light quality. Having already significantly penetrated several colored light applications, such as traffic signals and exit signs, white-light LED products have recently been commercialized. LEDs can be found in directional lamp fittings such as downlights, display, accent, under-cabinet lighting, as well as in area light fittings such as parking, roadway, and troffer lighting applications. This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.