Active and Passive Electronic Components

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Electronic components market research covers passive electronic components manufacturing and component distribution such as cpacitors, resistors, LEDs, magnetic components and integrated circuits.

US$6,600.00
Date of Publication: Jul 31, 2015

The report is an in-depth study prepared by people who have a deep involvement with the electronic component industry. Each country report is written by locals who have detailed knowledge of the electronic component distribution industry. These reports analyse the market split into semiconductors, passives and electromechanical components and component assemblies. The 2015 report contains details of the overall European and International component distribution scene, with profiles of major pan-European groups: Acal, Arrow, Avnet, Electrocomponents, Future, Farnell, Mouser, MSC, Rutronik and TTI. The 1000 plus page Report, contains the following information for Austria, Benelux, Czech Republic, Denmark, Finland, France, Germany, Hungary, Iberia, Italy, Norway, Poland, Russia, Sweden, Switzerland and UK.


US$10,000.00
Date of Publication: Jul 27, 2015
The semiconductor industry is undergoing an unprecedented number of changes. The electronic systems end market drivers are changing from personal computers to smart phones and tablets. Major consolidation is taking place in the industry particularly in memory. More and more companies are going to Fab lite and fabless companies are rising in importance.  Optical lithography has entered the multi-patterning era and EUV is late. 450mm is on the horizon. Planar transistors are transitioning to 3D FinFETs and FDSOI. New materials are being introduced at an increased pace. DRAM and NAND are facing fundamental barriers to scaling with new solutions needed.

US$4,500.00
Date of Publication: Jul 25, 2015
Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining importance as a highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. 3D TSV devices possess stacked silicon wafers interconnected vertically by employing TSVs. The 3D TSV devices offer numerous benefits in wafer/chip assembly, which include superior performance as compared to conventional techniques, reduction in package size, heterogeneous integration, and superior performance. Driven by the growing demand for innovative, high-performance chip architectures featuring benefits such as superior performance, power consumption and form factor features, 3D TSV technology is making robust progress in the semiconductor industry.

US$4,950.00
Date of Publication: Jun 16, 2015
This report analyzes the worldwide markets for Electronic Components in US$ Million by the following Product Segments: Resistors (Semi-Fixed Variable, Carbon Variable, Other Variable, Carbon Film Fixed, Metal Film Fixed, Metal Oxide Film Fixed, Wire Wound Fixed, Network Resistors, Chip Resistors, & Other Fixed), Capacitors (Variable, Aluminum Electrolytic Fix, Tantalum Electrolytic Fixed, Ceramic Fixed, Organic Film Fixed, Metallized Organic Film & Other Fixed), Transformers (RFTS & IFTS, Audio Frequency, Power, High Frequency Power, High Voltage, Flyback, Deflection Yokes, & Other), Resonators, Connectors (PCB Connectors, Rectangular I/O Connectors, Circular Connectors, RF Coaxial Connectors, & Other Connectors), Relays (Electromechanical Relays (EMRs), & Solid State Relays (SSRs)), Switches (Toggle, Slide, Rotary, Keyboard, & Other Switches), and Printed Wiring Boards (Single Sided Rigid, Double Sided Rigid, Multilayer Rigid, & Flexible). The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of World.

US$595.00
Date of Publication: Jul 9, 2015
DVD-64C identifies all of the important through-hole and surface mount component types – including: through-hole resistors, capacitors, diodes, potentiometers, pin grid arrays, sockets, DIPs, SIPs, transistors, LEDs, inductors, chokes, torroids, filters, fuses, breakers, switches, relays, crystals, voltage regulators, thermistors, connectors, sockets, headers, and jumpers. Also covers SMT component types (QFPs, PLCCs, rectangular chips, MELFs, SOICs, molded tantalum capacitors, SOTs, DPAKs), leadless components, QFNs, DFNs, LGAs, CCGAs and BGAs. Introduces resistor, capacitor and inductor values and tolerances.

US$2,750.00
Date of Publication: Jun 9, 2015
This study addresses the FY 2015 world market for Inductors, Beads and Cores. This new report represents the results of substantial data collection on the subject of magnetic components. The study addresses why the global market for discrete inductors is outperforming other passive components in 2015 and why this trend is expected to continue. The study also addresses the impact the weak yen and strong dollar is having on the current market. 

US$2,495.00
Date of Publication: Aug 1, 2015
High-density packaging offer a host of benefits including performance improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power. This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide markets are analyzed and projected.