BGA Inspection and Lead-Free Defect Guide

BGA Inspection and Lead-Free Defect Guide CD-ROM

Date of Publication: Aug 14, 2013
US$165.00
BW-CD19

Interactive CD-ROM covering optical and X-ray inspection of solder joints. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and X-ray showing you how to do it. Inspection criteria are included for X-ray and visual criteria on different lead-free terminations and pad surfaces. The CD also includes many defect examples and causes as well as illustrating the reflow of different terminations with Bob Willis's unique micro video clips.

CD-ROM will include - Modern Lead-Free Assembly Processes, Lead-free Alloys, BGA - Area Array Reflow, Inspection Techniques, Inspection Procedures, Optical Inspection, X-Ray Inspection, Defect Guide, Inspection Criteria.

Date of Publication:
Aug 14, 2013
File Format:
CD-ROM
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