2014 CMP Equipment Components - Critical Materials Report

2014 CMP Equipment Components - Critical Materials Report

Techcet, Date of Publication: Nov 20, 2014
US$3,280.00
TC4875

The CMP Equipment Components Report reviews in detail the markets and technology as it applies to materials related to Chemical Mechanical Polishing, such as P-CMP Clean Chemistry, Brushes, Filters and Equipment.

TABLE OF CONTENTS

1.0 CMP Polishing Pad Conditioner Suppliers

1.1 CMP Polishing Pad Conditioner Suppliers ­ List
1.2 Executive Summary
1.3 Business Environment
1.4 Company Profiles of CMP Polishing Pad Conditioner Suppliers
1.5 Other Companies related to this Market Segment

2.0 CMP Post-CMP PVA Brushes

2.1 CMP Post-CMP PVA Brush Suppliers ­ List
2.2 Executive Summary
2.3 Business Environment
2.4 Company Profiles of CMP PVA Brush Suppliers
2.5 Other Companies Related to this Market Segment

3.0 CMP Polishing Slurry Filter Suppliers

3.1 CMP Polishing Slurry Filter Suppliers ­ List
3.2 Executive Summary
3.3 Business Environment
3.4 Company Profiles of CMP Slurry Filter Suppliers
3.5 Other Companies Related to this Market Segment

4.0 CMP Wafer Carrier Retaining Rings

4.1 CMP Wafer Carrier Retaining Ring Suppliers ­ List
4.2 Executive Summary
4.3 Business Environment
4.4 Company Profiles of CMP Retaining Ring Suppliers
4.5 Other Companies Related to this Market Segment

5.0 Post-CMP Cleaning Chemistries

5.1 Post-CMP Cleaning Chemistries Suppliers ­ List
5.2 Executive Summary
5.3 Business Environment
5.4 Company Profiles of Post-CMP Cleaning Chemistries
Suppliers
5.5 Other Companies Related to this Market Segment

6.0 CMP Support Products and Services Suppliers

6.1 CMP Support Products and Services Suppliers ­ List
6.2 Executive Summary
6.3 Business Environment
6.4 Company Profiles of Support Products and Services Suppliers
6.5 Other Companies related to this Market Segment

7.0 University Programs

8.0 CMP Equipment Suppliers

8.1 CMP Equipment Suppliers ­ List
8.2 Executive Summary
8.3 Business Environment
8.4 Company Profiles of CMP Equipment Suppliers
8.5 Other Companies Related to this Market Segment

9.0 CMP Process Flows

9.1 FEOL
9.1.1 STI
9.1.2 Pre-Metal Dielectric
9.1.3 Poly Open Polish for Metal Gates
9.1.4 Aluminum for Metal Gates
9.1.5 Tungsten Contacts
9.1.6 Poly Contacts
9.2 BEOL
9.2.1 Copper
9.2.2 Copper Barrier
9.2.3 Tungsten
9.2.4 ILD
9.3 TSV
9.3.1 TSV Front Side
9.3.2 TSV Back Side


MAIN TABLE OF FIGURES

4.0 CMP Conditioners
4.1 Conditioner Market Share
4.2 Kinik conditioner
4.3 Saesol conditioners
4.4 3M conditioner
4.5 3M Trizact conditioner
4.6 3M B5-M990
4.7 3M B75-2990
5.0 CMP PVA Brushes
5.1 PVA Brush Market
Shares
5.2 PVA Brushes
5.3 PVA Brushes
5.4 Entegris Brushes
6.0 CMP Slurry Filters
6.1 CMP Filter Market Shares
6.2 Large Particle Counts
6.3 Depth Filter ­ Flow Path
6.4 Depth Filter - multilayer
6.5 Depth Filter ­ PALL
6.6 Membrane Filter - Path
6.7 Membrane Filter-Millipore
6.8 How Slurry is Made-
filters
7.0 CMP Retaining Ring
8.0 Cleaning Chemistry
8.1 P-CMP Market Shares
8.2 Dendrite formation
9.0 Support/Services
10.0 University Programs
11.0 Equipment
11.1 Equipment Market
Shares
11.2 Ebara F*REX 300
11.3 Ebara polishing chamber
11.4 AMAT Reflexion LK
11.5 AMAT Reflexion GT
11.6 Mfg. by Wafer Size
11.7 Brush Cleaner Mkt. Share
12.0 CMP Process Flows
12.1 Corollary to Moore's Law
12.1.1 STI Process
1st Gen HkMG
12.1.2a
2nd Gen HkMG
12.1.2b
12.1.2c HkMG Multi-Step
12.1.2d HkMG
12.1.3 Poly Open
12.1.4 Al Polish for MG
12.1.5 W Contacts
12.2.1a Copper CMP
12.2.1b Cu issues
12.2.1c Cu interconnect
12.2.4 Inter-Level Ox
12.3 TSV
12.3.1a Stack Specs
12.3.1b Process Flows
12.3.1c Cross Section
12.3.1d MEOL Flow
12.3.1e Post Bonding


TABLES

3.1 Compound Annual Growth Rate (CAGR)
7.0 CMP Retaining Ring
7.1 Edge Exclusion Surface Area
12.0 12.1 CMP Process Steps and their Impact Yield Process Flows


Date of Publication:
Nov 20, 2014
File Format:
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