CMP Slurry and Pads - Critical Materials Report

CMP Slurry and Pads - Critical Materials Report

Techcet, Date of Publication: Nov 20, 2014
US$4,890.00
TC8645

The CMP Equipment Components Report reviews in detail the markets and technology as it applies to materials related to Chemical Mechanical Polishing, such as Slurries, Abrasives, Pads, and Conditioners.

TABLE OF CONTENTS

1.0 Historical Perspective plus a Look Ahead

1.1 A brief Early History of CMP use in Semiconductor Device Fabrication
1.2 Looking for "Adam"
1.3 Adapting to the Expanding Role of CMP
1.4 A View of the Year that has Passed, and a View of the Years to Come

2.0 CMP Slurries and Abrasives

2.1 CMP Slurry and Abrasive Suppliers - List
2.2 Executive Summary
2.3 Business Environment
2.4 Company Profiles of CMP Slurry and Abrasive Suppliers
2.5 Other Companies Related to this Market Segment

3.0 CMP Polishing Pad Suppliers

3.1 CMP Polishing Pad Suppliers ­ List
3.2 Executive Summary
3.3 Business Environment
3.4 Company Profiles of CMP Polishing Pad Suppliers
3.5 Other Companies Related to this Market Segment

MAIN TABLE OF FIGURES

SECTION ONE
1.1 Moore and More
1.2 New Structures
1.3 More CMP Steps
1.4 CMP Update
1.5 Resistance Rising
1.6 Barrier Scaling
1.7 Patterning Issues
1.8 RC Delay
1.9 Emerging Interconnects
1.10 Interconnect Apps
1.11 Equip. & Consumables
1.12 Total CMP Passes
1.13 Packaging Innovation
1.14 More than Moore
1.15 Market Drivers
1.16 Logic Starts
1.17 More than Moore examples
1.18 More than Moore examples
1.19 More than Moore examples
1.20 Trends

SECTION TWO
2.1 Slurry Revenue
2.2 Slurry Market Shares
2.3 Slurry Volumes POU
2.4 Revenue Share - Process
2.5 Revenue Share ­Process
2.6 Market Share - ILD
2.7 Market Share - STI
2.8 Market Share - Tungsten
2.9 Market Share - Copper
2.10 Market Share ­ Cu Barrier
2.11 TSV Packaging

SECTION THREE
3.1 Pad Market Shares
3.2 Pad Revenue by Process
3.3 Pad Rev. by Wafer Size
3.4 Pads by Application
3.5 Pads for 200mm
3.6 Pads for 300mm
3.7 Pads for 450mm
3.8 AMAT Reflexion
3.9 Ebara F*REX
3.10 innoPad samples
3.11 "K" Groove Pad

TABLES

SECTION TWO
2.1 Compound Annual Growth Rate (CAGR)
2.2 Abrasive Supplier Business Environment
3.0 CMP Polishing

SECTION THREE
Pads 3.1 Compound Annual Growth Rate (CAGR)

Date of Publication:
Nov 20, 2014
File Format:
PDF via E-mail
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