Design Analysis Ericsson LTE DUL 20 01 Digital Baseband Unit

EJL Wireless, Date of Publication: Jan 22, 2013, 38 Pages
US$7,500.00
EJL3875

This report covers the design analysis of an Ericsson LTE baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson LTE. The unit was manufactured in Q1 2012.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Broadcom, Ericsson, ETAL Group, Fairchild Semiconductor, Freescale Semiconductor, Infineon Technologies, Integrated Device Technology, Kemet, Lattice Semiconductor, Maxim Integrated Products, Micron Technology, Nichicon, Nihon Denpa Kogyo, NXP Semiconductors, ON Semiconductor, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors.

Features:

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type


Important Note: There is NO component pricing contained within the report.

Pricing:    $7,500 USD for Single user license, encrypted PDF file


TABLE OF CONTENTS

EXECUTIVE SUMMARY
Active/Passive Component Summary  5
Important Note:  5

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM
Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering  6

CHAPTER 2: DUL MECHANICAL ANALYSIS
Mechanical Analysis 9

CHAPTER 3: BASEBAND PROCESSING/CPRI/INTERFACE BOARD SUBSYSTEM
Semiconductor Heat Sinks29
APPENDIX A - PASSIVE CASE SIZE ANALYSIS 33
APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS  37

Table   1:   DUL PCB Top Area A1 Bill of Materials  22
Table   2:   DUL PCB Top Area A2 Bill of Materials  23
Table   3:   DUL PCB Bottom Area B Bill of Materials  27
Table   4:   Passive Component Case Size Distribution by System Subsection  34
Table   5:   Identified Passive Component Supplier Distribution by System Subsection 35
Table   6:   Active/Passive Component Distribution by System Subsection  36
Table   7:   Active Semiconductor/Component Vendor Distribution by System Subsection   38

Exhibit   1: Ericsson RBS620x Macro Cell Indoor BTS System  7
Exhibit   2: Ericsson DUL System Block Diagram  8
Exhibit   3: DUL Unit, Front   9
Exhibit   4: DUL Unit, Back  10
Exhibit   5: DUL Unit, Left Side  10
Exhibit   6: DUL Unit, Top   11
Exhibit   7: DUL Unit, Bottom  12
Exhibit   8: DUL Top Shield, External View  13
Exhibit   9: DUL Top Shield, Internal View   13
Exhibit   10: DUL Bottom Shield, External View 14
Exhibit   11: DUL Bottom Shield, Internal View  14
Exhibit   12: DUL Bottom Shield, Front View 15
Exhibit   13: DUL Bottom Shield, Rear View  15
Exhibit   14: DUL 20 01 System, Exploded Side View 15
Exhibit   15: DUL PCB  Top View  16
Exhibit   16: DUL Baseband Processing/CPRI/Interface PCB Top, Area A   17
Exhibit   17: DUL Baseband Processing PCB Bottom, Area B  18
Exhibit   18: DUL PCB Top Area A1 Component Diagram   19
Exhibit   19: DUL PCB Top Area A2 Component Diagram   20
Exhibit   20: DUL Baseband Processing/CPRI/Interface Block Diagram  21
Exhibit   21: DUL PCB Bottom Area B Component Diagram 26
Exhibit   22: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Front View   29
Exhibit   23: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Side View  29
Exhibit   24: Semiconductor IC Heat Sink Dimensions (27mm, 35mm, 41mm), Bottom View  30
Exhibit   25: Semiconductor IC Heat Sink Dimensions, 27mm 30
Exhibit   26: Semiconductor IC Heat Sink Dimensions, 35mm 31
Exhibit   27: Semiconductor IC Heat Sink Dimensions, 41mm 32
Exhibit   28: Passive Component Case Size Distribution  33
Exhibit   29: Identified Passive Component Market Share by Vendor  36
Exhibit   30: Active Semiconductor Component Share  37
Exhibit   31: High Pin Count IC vs  Discretes   39
Exhibit   32: Active Semiconductor Market Share by Vendor  39
Exhibit   33: High Pin Count (64+) Active Semiconductor Market Share by Vendor  40


Additional Information:
Single User PDF File
Date of Publication:
Jan 22, 2013
File Format:
PDF via E-mail
Number of Pages:
38 Pages
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