DSL Chips

DSL Chips: Market Shares, Strategies, and Forecasts, Worldwide, 2013 to 2018

WinterGreen, Date of Publication: Feb 6, 2013, 232 Pages
US$3,800.00
WG3584

The study is designed to give a comprehensive overview of the DSL CHIP equipment market segment.  Research represents a selection from the mountains of data available of the most relevant and cogent market materials, with selections made by the most senior analysts.  Commentary on every aspect of the market from independent analysts creates an independent perspective in the evaluation of the market.  In this manner the study presents a comprehensive overview of what is going on in this market, assisting managers with designing market strategies likely to succeed.

Worldwide DSL chip markets continue to achieve significant growth in spite of the dire predictions of market demise. According to Susan Eustis, lead author of the study, "Deutsche Telekom, British Telecom, AT&T, Bell Canada, Century/Qwest and many other carriers have made clear they will use DSL, not fiber, for the majority of lines because it's cheaper. Increasingly, that's DSL from a neighborhood DSLAM (FTTN) with short loops that will soon be capable of 100 megabits through bonding and vectoring. There is plenty of copper wire in the telecommunications networks that can be used to provide broadband connectivity from fiber in the neighborhood, DSLAM connectivity to copper wires running into the home."

The rapid advance of end to end optical broadband networks continues to threaten to make xDSL obsolete, but copper will never go away, fiber is too expensive to use it to replace all the copper and the copper works in many cases and does not need to be replaced. xDSL markets will be strong for some long time to come as copper remains a transport line.

Copper is everywhere in the telecommunications network. It is still the primary wireless backbone transport means, meaning it continues to be vital as new wireless systems continue to expand their markets. It predominates in the local loop, creating demand for systems that are able to support high speed signal transport over copper wire.

Both smart phones and tablet devices depend on wire line backhaul, much of which is copper. As copper goes away, xDSL goes away, but this is certainly not happening within the forecast period. The development and growth of the broadband digital subscriber line (DSL) and communications processing markets is assured as carriers seek to leverage their investment in copper wire infrastructure. DSL is the way to do that with its support for high speed communications and video signal transport.

Vendors consider companies that have access to broadband or communications processing technology as potential competitors. Established competitors, suppliers of products based on new or emerging technologies, and customers who choose to develop their own technology.

Deutsche Telekom, British Telecom, AT&T, Bell Canada, Century/Qwest and many other carriers have made clear they will use DSL, not fiber, for the majority of lines because it's cheaper. Increasingly, that's DSL from a neighborhood DSLAM (FTTN) with short loops that will soon be capable of 100 megabits through bonding and vectoring.

Even the DSL customers have a hybrid fiber / copper connection; it is just the last mile that is copper, hence requiring DSL.

The communications consumer end points worldwide are moving to 100% wireless smart phones that can connect to the Internet. The communications infrastructure worldwide will remain wire based to connect the central office to the base stations, and to provide Internet / IP based connectivity to the home. The wire based communications infrastructure worldwide is all moving to fiber so as to handle the increased demand for bandwidth.

The copper is not efficient for the cable companies because of the demand for bandwidth to the home that the cable companies are providing. The copper is not efficient in the wireless backbone connectivity of the central office to the wireless base stations, and hence there is a priority on replacing the copper that is there first. The copper from the curb or from the neighborhood to toe home is efficient; therefore the need for DSL persists.

Worldwide tablet market revenues at $799 million in 2011 are anticipated to reach $1.7 billion by 2018. DSL chip markets are forecast to grow year-over-year throughout the forecast period. This is in the context of a world communications infrastructure that is changing and seeking to leverage the existing plant to hold down costs. Technology is enabling interaction, innovation, and sharing of knowledge in new ways. DSL chips promise to bring significant new broadband for Internet access capability making the Internet available for increasingly productive, efficient use. 

TABLE OF CONTENTS

DSL Chips Executive Summary

DSL Chip Market Driving Forces

Data And Video Traffic Being Added To Voice Traffic In Abundance

DSL Chip Market Shares

DSL Chip Market Forecasts
 

DSL CHIP Market Description and Market Dynamics

1. DSL Chip Market Dynamics and Market Description

1.1   Digital Subscriber Line (DSL) Chips

1.1.1    Demand for Broadband Services and Market

Opportunities for Service Providers

1.1.2    High-Performance Communications Processing

1.1.3    Key Benefits of DSL Technology

1.1.4    Improving Time-To-Market With Programmable

Systems-Level Products

1.1.5    DSL Provides Cost-Effective, High-Performance

Transmission Over Existing Copper Lines

1.1.6    End-to-End DSL Products

1.2   Stability Of Global Credit And Financial Markets

1.3   DSL Design Wins

1.3.1    Semiconductor Components

1.4   Communications Industry

1.4.1    Carrier Networking

1.4.2    Enterprise Networking

1.4.3    Cloud Computing

1.4.4    Increasing Demands for "Next-Generation

Networking" Integrated Circuits

1.5   Communications Strategy

1.6   Internet And Wireless Dominate Communications Technology

1.6.1    Optical Networks

1.6.2    Data And Video Traffic Being Added In

Abundance To Voice Traffic

1.6.3    Semiconductor Companies Design DSL

1.7   Storage Industry

1.8   Mixed Signal Integrated Circuit Market

1.8.1    Network Access Last Mile Of Telecommunications Network

1.8.2    Metropolitan Area Networks

1.8.3    Internet

1.9   Signal Processing

1.10 Product Positioning
 

DSL CHIP Market Shares and Market Forecasts

This section selectively describes market shares, forecasts, segments, and regional revenue.  Numbers are the result of primary research in all cases.  Selected companies are described from an independent analyst perspective with a thumbnail sketch or analysis of their market numbers or commentary on their strengths and weaknesses.  Some of the analysis is focused on looking at the topic segment by segment, including company descriptive analyses by segment and subsegment.

2. DSL Chips Market Shares and Market Forecasts

2.1   DSL Chip Market Driving Forces

2.1.1    Vendor DSL Positioning

2.1.2    Data And Video Traffic Being Added To Voice

Traffic In Abundance

2.2   DSL Chip Market Shares

2.2.1    Broadcom

2.2.2    Ikanos

2.2.3    Ikanos Shipments

2.2.4    Ikanos VDSL

2.2.5    Lantiq Broadband Solutions

2.2.6    MediaTek / Ralink / Trendchip

2.3   DSL Chip Market Forecasts

2.3.1    Digital Subscriber Line (DSL) Subscriber Markets

2.4   Research and Development

2.5   DSL Chip Applications

2.6   DSL Chip Prices

2.7   DSL Chip Regional Market
 

DSL CHIP Product Description

This section describes selected companies and selected products.  Products for this market segment are described with attention to the most significant aspect of features and functions in this category of product.  The juxtaposition of a range of different product descriptions from a single market category provides a really good way to access market directions and achieve market competitive analysis.  This section is arranged in three pieces: immersive products, conference room products, and end point products.  Company products are described in the appropriate sections, meaning a company is mentioned several times in the chapter in different places.

3. DSL Chips: Product Description

3.1   Broadcom

3.1.1    Broadcom BCM6519  Multi-DSL Transceiver

3.1.2    Broadcom BCM6529  Low Power Dual-

Channel Analog Front End Device

3.1.3    Broadcom BCM65300 VDSL2 G.Vector Central Office SoC

3.1.4    Broadcom BCM65x00 Family Central Office

High Density Multi-DSL Chipset

3.1.5    Broadcom BCM6515  High-Performance VoIP Digital

Signal Processor

3.1.6    Broadcom xDSL CPE Solutions

3.1.7    BCM63168  xDSL Integrated Access Device SoC

3.1.8    BCM6338  ADSL2+ Router Solution

3.1.9    BCM6348  Single-Chip ADSL2+ CPE Chip

3.1.10  BCM6358  Single-Chip ADSL2+ Integrated Access

Device Solution

3.1.11  BCM6362  Single-Chip IAD with Integrated ADSL2+,

802.11n and DECT

3.1.12  BCM6368  Residential VDSL2/ADSL2+ Gateway Solution

3.2   Lantiq

3.2.1    Lantiq XWAY™ VRX200

3.2.2    Lantiq XWAY™ VRX200

3.2.3    Lantiq XWAY™ VRX288 / VRX208

3.2.4    Lantiq XWAY™ VRX268 / VRX208

3.2.5    Lantiq XWAY™ VRX288 / VRX208

3.2.6    Lantiq CONVERGATE™

3.2.7    Lantiq MELT

3.2.8    Lantiq VINETIC™-LTC

3.2.9    Lantiq Smart SLIC™-T

3.2.10  Lantiq XWAY™ DANUBE

3.3   Ikanos

3.3.1    Ikanos Chipsets for Central Office Equipment

3.3.2    Ikanos Chipsets for Customer Premises Equipment

3.3.3    • Ikanos Velocity™ A/VDSL CO Chipset

3.3.4    Ikanos Accelity™-2+ 8-Port VDSL2 Central Office Chipsets

3.3.5    Ikanos’ Accelity™ DA87781 VDSL2 CPE chipset

3.3.6    Ikanos Fx™-5 CO

3.3.7    Ikanos FxS™-5 CPE

3.3.8    Ikanos Maxtane™ CX955xx

3.3.9    Ikanos Orion™ Plus CX98124-11Z

3.3.10  Ikanos Fusiv Vx185/183

3.4   Analog Devices

3.5   MediaTek xDSL(Ralink) / Trendchip
 

DSL CHIP Technology

4. DSL Chip Technology

4.1   Delivering Video-Intensive Services

4.2   Ikanos Technologies

4.2.1    Advanced Bonding Capabilities

4.2.2    Flexible Network Interfaces

4.3   Ikanos NodeScale™ Vectoring

4.3.1    Ikanos Quality Video (iQV) technology

4.4   Telecommunications and DSL Standards Organizations

4.4.1    ATIS

4.4.2    Broadband Forum

4.4.3    ETSI

4.4.4    FSAN

4.4.5    Home Gateway Initiative

4.4.6    The International Telecommunications Union

4.4.7    TTC

4.4.8    UNH-IOL

4.4.9    The FTTH Council Europe

4.4.10  The FTTH Council Asia-Pacific

4.4.11  The Broadband Forum

4.4.12  Home Gateway Initiative

4.4.13  Communications Standards Bodies:

 

DSL CHIP Company Profiles

This section selectively describes company strategies, partners, acquisitions, and revenue by segment and regional revenue when available.  Companies are described by looking at what is most interesting about that company.  The descriptions collectively give a sense of market directions within the industry segment.  The alphabetical listing of company thumbnail sketches provides an accessible way to find out what is going on in any particular company.
 

5    DSL Chip Company Profiles

5.1   Analog Devices

5.1.1    Analog Devices Focus On Key Strategic Markets

5.1.2    Analog Devices Broad Line Of High-Performance ICs

5.1.3    Analog Devices Digital Signal Processing Products

5.1.4    Analog Devices Revenue

5.1.5    Analog Devices Revenue Trends by End Market

5.1.6    Analog Devices Industrial –

5.1.7    Analog Devices Automotive –

5.1.8    Analog Devices Consumer –

5.1.9    Analog Devices Communications –

5.1.10  Analog Devices Markets and Applications

5.1.11  Analog Devices Industrial and Instrumentation Segments

5.1.12  Analog Devices Defense/Aerospace Segment

5.1.13  Analog Devices Energy Management Segment

5.1.14  Analog Devices Healthcare Segment

5.1.15  Analog Devices Automotive Segment

5.1.16  Analog Devices Consumer Segment

5.1.17  Analog Devices Communications Segment

5.1.18  Analog Devices Segment Financial Information and

Geographic Information

5.1.19  Analog Devices Revenue Trends by Product Type

5.1.20  Analog Devices Revenue Trends by Geographic Region

5.2   Broadcom

5.2.1    Broadcom Revenue

5.2.2    Broadcom Broadband Communications Solutions

5.2.3    Broadcom Mobile & Wireless (Solutions for the Hand)

5.2.4    Broadcom Infrastructure & Networking

(Solutions for Infrastructure)

5.2.5    Broadcom Customers and Strategic Relationships

5.3   BroadLight

5.4   Cavium

5.4.1    Cavium Customers and Target Markets

5.5   Freescale Semiconductor

5.5.1    Freescale Embedded Innovation

5.6   Ikanos

5.6.1    Ikanos Outsourcing and Value Chain

5.6.2    Ikanos Net Loss

5.6.3    Service Provider Platform Deployments

5.6.4    Ikanos Revenue

5.6.5    Ikanos Revenue

5.6.6    Ikanos Revenue by Country as a Percentage of Total Revenue

5.6.7    Ikanos Acquired from Conexant Systems, its

Broadband Access Product Line

5.6.8    Ikanos Product Lines

5.6.9    Ikanos Solution

5.6.10  Key Features of Ikanos Technology

5.6.11  Ikanos Major Service Provider Customers

5.6.12  Ikanos Service and Support for Customers and Service Providers

5.6.13  Sales, Business Development and Product Marketing

5.6.14  Ikanos Go to Market Strategy

5.6.15  Ikanos / Aricent

5.6.16  Ikanos  / ASSIA, Inc.

5.6.17  Ikanos / Atheros

5.6.18  Ikanos / DSP Group

5.6.19  Ikanos / D2 Technologies

5.6.20  Ikanos / Gatespace

5.6.21  Ikanos / Jungo

5.6.22  Ikanos / picoChip

5.6.23  Ikanos / Ralink

5.6.24  Ikanos / SoftAtHome

5.6.25  Ikanos / Sunrise Telecom

5.6.26  Ikanos / Wintegra

5.7   Infineon Technologies

5.7.1    Infineon Technologies Revenue

5.8   IXYS Integrated Circuits Division

5.8.1    IXYS Integrated Circuits Distribution Channels

5.8.2    IXYS Integrated Circuits / Clare

5.9   Lantiq

5.10 Marvell

5.11 MediaTek / Ralink Technology

5.11.1  MediaTek / Ralink / Trendchip xDSL

5.11.2  MediaTek xDSL(Ralink)

5.12 PMC-Sierra

5.13 Pulse

5.14 Shantou New Tideshine Electron

5.15 Shenzhen Chaoyue Electronics Co., Ltd.

5.16 Shenzhen Sky Foundation

5.17 Shenzhen Tianxiaowei Electronics Co., Ltd.

5.18 Other xDSL Chip Based Products and Market Participants

 

List of Tables and Figures

DSL CHIP Executive Summary

DSL Chips Executive Summary

DSL Chip Market Driving Forces

Data And Video Traffic Being Added To Voice Traffic In Abundance

DSL Chip Market Shares

DSL Chip Market Forecasts


DSL CHIP Market Description and Market Dynamics



Table 1-1

Highly-Integrated Chip Solutions

Table 1-2

Digital DSL Product Positioning

Table 1-3

Digital DSL Advantages

 

DSL CHIP Market Shares and Market Forecasts

 

Table 2-1

DSL Chip Market Driving Forces

Table 2-2

Vendor Competitive Positioning Factors

Figure 2-3

DSL Chip Market Shares, Dollars, 2012

Table 2-4

DSL Component Shipments Dollars, Units Worldwide, 2012

Figure 2-5

DSL Chip Market Shipments Forecasts Dollars, Worldwide, 2013-2018

Table 2-6

Broadband DSL Market Forecasts, Units and Dollars, Worldwide, 2013-2018

Table 2-7

Broadband DSL Market Forecasts, Low End, Mid Range, and

High End Units and Dollars, Worldwide, 2012

Figure 2-8

DSL Subscriber Forecasts, Number, Worldwide, 2013-2018

Table 2-9

Broadband DSL, Cable Modem, Wireless Device, and

Fiber to the Home Subscribers Worldwide, 2012

Figure 2-10

Broadband Services Typical Speed in Mbps

Table 2-11

Broadband Fiber Cost Per Household to Build Out

Table 2-12

DSL Chip Applications

Figure 2-13

DSL Regional Market Segments, Dollars,  2012

Table 2-14

DSL Regional Market Segments, 2012

Table 2-15

xDSL Component Regional Shipments by Company,

Dollars, Worldwide, 2012

 

DSL CHIP Product Description

 

Table 3-1

Broadcom BCM6519 Multi-DSL Transceiver Features

Table 3-2

Broadcom BCM6529 Low Power Dual-Channel Analog

Front End Device Features

Table 3-3

Broadcom BCM65300 VDSL2 G.vector Central Office SoC Features

Table 3-4

Broadcom's new BCM65x00 Family Central Office SoC Features

Table 3-5

Broadcom  BCM6515 High-Performance VoIP Digital Signal

Processor  Features

Figure 3-6

Ikanos 496pix_Velocity_Chipset2

Table 3-7

Ikanos Communications Processors

Table 3-8

Ikanos DSL Chipsets

Figure 3-9

Ikanos Velocity Chip Architecture

Table 3-10

Ikanos Velocity™ A/VDSL CO Chipset Key Features

Figure 3-11

Ikanos Accelity-2+ AD11008

Table 3-12

Ikanos Accelity-2+ AD11008 Key Features

Table 3-13

Ikanos Accelity-2+ AD11008 Applications

Table 3-14

Ikanos Accelity™ DA87781 Applications

Table 3-15

Accelity DA87781 Family product Key Features

Figure 3-16

Ikanos Fx100100-5/Fx10050-5 System Architecture

Table 3-17

Ikanos Fx100100-5/Fx10050-5 System Key Features

Figure 3-18

Ikanos Fx100100S-5/Fx10050S-5 System Architecture

Table 3-19

Ikanos FxS™-5 CPE Key Features

Figure 3-20

Ikanos Maxtane CX95516/CX95524 System Architecture

Table 3-21

Ikanos Maxtane™ CX955xx  Key Features

Figure 3-22

Ikanos Orion™ Plus CX98124-11Z Block Diagram

Table 3-23

Ikanos Orion™ Plus CX98124-11Z Key Features

Table 3-24

Ikanos Fusiv Vx185/183 Key Features

Table 3-25

MediaTek Product Advantages

Table 3-26

MediaTek / Ralink Comprehensive Product Portfolio

 

 

DSL CHIP Technology

 

Figure 4-1

Broadband Services Typical Speed in Mbps

Table 4-2

Ikanos NodeScale Vectoring Product Key Features

Table 4-3

Ikanos Quality Video (iQV) technology Key Features

 

DSL CHIP Company Profiles

 

Table 5-1

Analog Devices Embedded In Electronic Equipment

Table 5-2

Analog Devices Industrial And Instrumentation Market Applications

Table 5-3

Analog Devices Defense/Aerospace Products

Table 5-4

Analog Devices Energy Management Segment Products

Table 5-5

Analog Devices Healthcare Segment Innovative

Crosspoint Switch Technologies

Table 5-6

Analog Devices Green Automotive Segment

Table 5-7

Analog Devices Safety Automotive Segment

Table 5-8

Analog Devices Comfort Automotive Segment

Table 5-9

Analog Devices Consumer Segment Products

Table 5-10

Analog Devices Communications Segment Systems

Table 5-11

Analog Devices Crosspoint Switches

Table 5-12

Broadcom Broadband Communications Solutions

Table 5-13

Broadcom Customers and Strategic Relationships

Table 5-14

Ikanos Product Lines

Table 5-15

Ikanos Works Directly With Various Major Service Providers

Figure 5-16

MediaTek Revenue

Table 5-17

MediaTek Industry Leadership

Figure 5-18

MediaTek Product Portfolio

Table 5-19

MediaTek Product Advantages

Table 5-20

MediaTek / Ralink Comprehensive Product Portfolio

 

 

Date of Publication:
Feb 6, 2013
File Format:
PDF via E-mail
Number of Pages:
232 Pages
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