Electronics Manufacturing

US$500.00
Date of Publication: May 22, 2015
Based on data from 83 manufacturers supplying electronics to the military and aerospace market, this study covers the current use of lead-free materials and components in mil/aero electronics. It examines how manufacturers required to use lead in their assemblies are coping with the trend toward lead-free electronics, including the use of reballing. It assesses the added costs of producing leaded assemblies and identifies the tipping points that are expected to move military electronics toward lead free. The report includes historical data on the ratio of lead-free to tin/lead solder consumption and a 10-year forecast.

US$4,000.00
Date of Publication: Sep 30, 2015
This Pivot Table covers quarterly revenue by region and product segment for all electronics manufacturing services (EMS) and original design manufacturing (ODM) companies in IDC's EMS database, from 1Q08 through 1Q15. This Pivot Table also provides updated market sizes for the two sectors of the EMS industry, the nine product segments for each sector, and the three regions for each sector.

US$5,550.00
Date of Publication: Jul 24, 2015
This report provides an overview of the global markets for electronics contract manufacturing services; Analyses of global market trends, with estimates for 2015 and 2016, and projections of compound annual growth rates (CAGRs) through 2021;  Discussion covering electronics contract manufacturing services operations which may include designing, manufacturing, testing, distributing, and providing repair services for electronic assemblies required by original equipment manufacturers (OEMs).

US$2,500.00
Date of Publication: Mar 9, 2015
Global and China Rigid PCB Industry Report, 2014-2015 highlights the followings: 1. PCB industry 2. PCB downstream market 3. Horizontal comparison of PCB...

US$160.00
Date of Publication: Nov 6, 2013
This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board...

US$75.00
Date of Publication: Mar 5, 2008
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state...

US$160.00
Date of Publication: Mar 5, 2014
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses.