Electronics Manufacturing

US$305.00
Date of Publication: Feb 1, 2017
이것은 케이블 및 와이어 하네스 어셈블리들의 요건들 및 수용을 위한 가장 최신 개정의 산업계가 합의한 유일의 표준으로서, 많은 섹션들에 걸쳐 있는 최신으로 갱신된 정보와 함께 안전 와이어링, 안전 케이블, 그로밋(grommet)들, 및 전선관(raceway)들에 대한 새로운 섹션들을 포함한다. 700개 이상의 사진들 및 삽화들이 있어, 이 표준은 케이블 및 하네스 어셈블리들과 관련하여, 크림프되어, 기계적으로 고정되고, 솔더링된 상호연결(interconnection)들을 생산해 내고, 관련된 어셈블리 활동들을 위한 물질들, 방법들, 테스트들 및 수용 기준들을 설명한다.

US$200.00
Date of Publication: Jun 18, 2019
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$2,180.00
Date of Publication: Jan 15, 2019
Europe will continue to provide significant opportunities for companies already involved in the European EMS industry. It will also offer opportunities for companies in Asia and the Americas who are looking to expand geographically into new markets. The European EMS Industry report allows you to track these developments in a single cost-effective study providing both detailed market and company analysis.

US$1,350.00
Date of Publication: Feb 14, 2019
PCB Technology Trends 2018 is based on data from 74 companies (52 electronics OEMs and 22 PCB fabricators) worldwide. PCB Technology Trends 2018 presents data on the current state (2018) of PCB fabrication and OEM's PCB requirements and their use of emerging technologies.

US$2,495.00
Date of Publication: Feb 4, 2019
This report focuses on the key printer and material technologies and outlines the various leaders across these technologies. Markets are forecast for equipment, materials, service, and parts. Equipment is segmented and forecast by industrial and consumer types. Market share for suppliers is presented.

US$2,495.00
Date of Publication: Feb 4, 2019

This report describes the technology infrastructure of nine Asian countries, detailing each countries' developments in microelectronics, telecommunications, and computing. Market forecasts are also presented in these sectors for associated countries.


US$4,995.00
Date of Publication: Feb 4, 2019
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.