Flip-Chip Technologies and Global Markets

Flip-Chip Technologies and Global Markets

BCC, Date of Publication: Jul 20, 2016, 139 Pages
US$6,650.00
GB-SMC089B

The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

This report provides:

  • An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
  • Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.
  • Discussion of the evolution, architecture, and value chain of flip-chip technologies.
  • Examination of market dynamics, including drivers, restraints, and opportunities.
  • Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.
  • Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
  • Profiles of major players in the industry.

The market for flip-chip technology is segmented by the following categories:

  • Wafer bumping process.
    • Copper (Cu) pillar. 
    • Lead (Pb)-free solder. 
    • Tin-lead (Sn-Pb) eutectic solder. 
    • Gold stud + plated solder.
  • Application area.
    • 2-D logic system-on-a-chip (SoC).
    • Memory. 
    • Imaging, high-brightness light-emitting diode (HB-LED) small logic. 
    • Radio-frequency (RF), power, analog, and mixed-signal integrated circuits (ICs). 
    • µ-bumping for 2.5-D/3-D system-in-package/system-on-a-chip (SiP/SoC).
  • End use.
    • Smartphones. 
    • Laptops. 
    • Desktop CPUs. 
    • Graphics processing units (GPUs) and chipsets. 
    • Other computing devices. 
    • Automotive. 
    • Robotics. 
    • Medical devices. 
    • Smart technologies. 
    • High-performance/industrial applications.
  • Region.
    • North America (the U.S., Canada and Mexico).
    • Europe (Italy, France, Germany, U.K., and other countries). 
    • Asia-Pacific (China, Japan, Taiwan, South Korea, India. and other countries). 
    • ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis, and a chapter including company profiles. All estimated values used are based on manufacturers’ total revenues, and are given in current U.S. dollars, unadjusted for inflation.

Flip-Chip Technologies and Global Markets
TABLE OF CONTENTS

INTRODUCTION

  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR CONDUCTING THE STUDY
  • SCOPE OF REPORT
  • INTENDED AUDIENCE
  • INFORMATION SOURCES
  • ANALYST'S CREDENTIALS
  • DISCLAIMER

SUMMARY

  • SUMMARY TABLE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
  • SUMMARY FIGURE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015-2021 ($ MILLIONS)

OVERVIEW

  • MARKET DEFINITION
  • EVOLUTION OF FLIP-CHIP WAFER BUMPING TECHNOLOGIES
    • FIGURE 1: DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004
  • SOLDER EVAPORATION
    • FIGURE 2: SOLDER EVAPORATION PROCESS
  • ELECTROPLATING OF SOLDER ALLOYS
    • FIGURE 3: SOLDER ALLOY ELECTROPLATING PROCESS
  • SOLDER PASTE SCREENING
    • FIGURE 4: SOLDER PASTE SCREENING PROCESS
  • SOLDER BALL REPLACEMENT
  • C4NP PROCESS
  • SIGNIFICANT PATENTS ON FLIP-CHIP TECHNOLOGIES
    • METHOD FOR FLIP CHIP PACKAGING CO-DESIGN
      • Abstract
    • USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING
      • Abstract
    • LEADLESS MULTI-LAYERED CERAMIC CAPACITOR STACKS
      • Abstract
    • FLIP-CHIP LED PACKAGE
      • Abstract
    • MEMS SENSOR INTEGRATED WITH A FLIP-CHIP
      • Abstract
    • COPPER PILLAR BUMP WITH COBALT-CONTAINING SIDEWALL PROTECTION LAYER
      • Abstract
    • LOW NOISE FLIP-CHIP PACKAGES AND FLIP-CHIPS THEREOF
      • Abstract
    • COPPER POST SOLDER BUMPS ON SUBSTRATES
      • Abstract
    • MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE
      • Abstract
    • FLIP-CHIP MMIC HAVING MOUNTING STIFFENER
      • Abstract
    • FLIP-CHIP BONDER AND FLIP-CHIP BONDING METHOD
      • Abstract
    • RED FLIP-CHIP LIGHT EMITTING DIODE, PACKAGE AND METHOD OF MAKING THE SAME
      • Abstract
    • FLIP-CHIP TYPE LASER DIODE
      • Abstract
    • SELF-ALIGNED PROTECTION LAYER FOR COPPER POST STRUCTURE
      • Abstract
    • COPPER PILLAR SIDEWALL PROTECTION
      • Abstract
    • ENHANCED FLIP CHIP STRUCTURE USING COPPER COLUMN INTERCONNECT
      • Abstract
    • METHOD OF FORMING COPPER PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP
      • Abstract
    • SUBSTRATES FOR PACKAGING FLIP-CHIP LIGHT EMITTING DEVICE AND FLIP-CHIP LIGHT EMITTING DEVICE PACKAGE STRUCTURES
      • Abstract
    • FLIP-CHIP SOLAR CELL CHIP AND FABRICATION METHOD THEREOF
      • Abstract
    • FLIP CHIP OVERMOLD PACKAGE
      • Abstract
    • FLIP-CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE
      • Abstract
    • ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF FABRICATING THE SAME, AND ELECTRICAL CONNECTING STRUCTURE COMPRISING THE SAME
      • Abstract
    • SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
      • Abstract
    • LEAD-FREE SOLDER ALLOY
      • Abstract
    • DUMMY FLIP CHIP BUMPS FOR REDUCING STRESS
      • Abstract
    • ELECTRONIC ASSEMBLY WITH COPPER PILLAR ATTACH SUBSTRATE
      • Abstract
    • FLIP-CHIP ASSEMBLY COMPRISING AN ARRAY OF VERTICAL CAVITY SURFACE EMITTING LASERS (VCSELSS), AND AN OPTICAL TRANSMITTER ASSEMBLY THAT INCORPORATES THE FLIP-CHIP ASSEMBLY
      • Abstract
    • LEAD-FREE SOLDER BUMP BONDING STRUCTURE
      • Abstract
    • EXPOSED DIE OVERMOLDED FLIP CHIP PACKAGE AND FABRICATION METHOD
      • Abstract
    • APPARATUS FOR LEAD FREE SOLDER INTERCONNECTIONS FOR INTEGRATED CIRCUITS
      • Abstract
    • HIGH VOLTAGE FLIP-CHIP LED STRUCTURE AND MANUFACTURING METHOD THEREOF
      • Abstract
    • FLIP-CHIP INTERCONNECTION STRUCTURE
      • Abstract
    • STUD BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
      • Abstract
    • FLIP-CHIP PACKAGE
      • Abstract
    • LOCALIZED HEATING FOR FLIP CHIP BONDING
      • Abstract
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
      • Abstract
    • CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
      • Abstract
    • FLIP-CHIP PACKAGE FOR MONOLITHIC SWITCHING REGULATOR
      • Abstract

FLIP-CHIP TECHNOLOGY MARKET BY WAFER BUMPING PROCESS

  • INTRODUCTION
  • MARKET DYNAMICS
    • DRIVERS
      • Expansion of Semiconductor Business
      • Application of Flip Chips in Packaging
      • End-User Demand Among Consumers
    • RESTRAINTS
      • Stringent Government Regulations
        • European Union
      • High Investment Cost
      • Structural Problems in Solder Bumps
    • OPPORTUNITIES
      • Lead-Free Flip-Chip Assembly
        • TABLE 1: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
        • FIGURE 5: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
        • TABLE 2: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS)
        • FIGURE 6: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, 2015-2021 (MILLION UNITS)
        • TABLE 3: GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, 2015-2021 ($)
      • Copper Pillar
        • TABLE 4: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 7: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
      • Copper Bumping Features
      • Tin-Lead Eutectic Solder
        • TABLE 5: MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB)
        • TABLE 6: PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB)
        • TABLE 7: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 8: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
      • Advantages of Tin-Lead Eutectic Solder
      • Lead-Free Solder
        • TABLE 8: CHARACTERISTICS OF VARIOUS ELEMENTS
        • TABLE 9: CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS
      • Properties of Some Commonly Used Alloy Systems
        • 58Bi-42Sn
        • 52In-48Sn
          • TABLE 10: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
          • FIGURE 9: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
      • Gold Stud Bumping
        • TABLE 11: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 10: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)

FLIP-CHIP TECHNOLOGY MARKET BY APPLICATION

  • INTRODUCTION
    • FIGURE 11: MARKET SEGMENTATION BY APPLICATION
  • MARKET DYNAMICS
    • DRIVERS
      • New and Improved 3-D Integrated Circuits
      • Invention of Double Data Rate Fourth-Generation (DDR4) Memory
    • RESTRAINTS
      • Challenges in Transition
    • OPPORTUNITIES
      • DDR5 Memory for the Future
        • TABLE 12: GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, THROUGH 2021 ($ MILLIONS)
        • FIGURE 12: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, 2015-2021 ($ MILLIONS)
    • 2-D LOGIC SYSTEM-ON-A-CHIP
      • FIGURE 13: STRUCTURE OF MULTI-CHIP MODULE
      • FIGURE 14: STRUCTURE OF SYSTEM-ON-CHIP
      • TABLE 13: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, 2015-2021 ($ MILLIONS)
    • MEMORY
      • TABLE 14: COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY
      • TABLE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • IMAGING
      • TABLE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, 2015-2021 ($ MILLIONS)
    • HIGH-BRIGHTNESS LIGHT-EMITTING DIODE (HB-LED)
      • FIGURE 18: STRUCTURE OF HB-LED
      • TABLE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • SMALL LOGIC, RADIO FREQUENCY, POWER, ANALOG, AND MIXED-SIGNAL INTEGRATED CIRCUITS
      • TABLE 18: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 20: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
    • 2.5-D AND 3-D SYSTEM-IN-PACKAGE/SYSTEM-ON-A-CHIP
      • FIGURE 21: ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT
      • FIGURE 22: STRUCTURE OF 3-D INTEGRATED CIRCUIT
      • TABLE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
      • FIGURE 23: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)

FLIP-CHIP TECHNOLOGY MARKET BY END USE

  • INTRODUCTION
  • MARKET DYNAMICS
    • DRIVERS
      • Increased Application of Flip Chip in Automotive
      • Application of Smart Technologies
      • Extensive Research and Development
    • RESTRAINTS
      • Time Consumption for New Innovation
    • OPPORTUNITIES
      • Household Robots in the Future
        • TABLE 20: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH 2021 ($ MILLIONS)
        • FIGURE 24: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021 ($ MILLIONS)
    • SMARTPHONES
      • TABLE 21: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 25: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • LAPTOPS
      • TABLE 22: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 26: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • DESKTOP CENTRAL PROCESSING UNITS
      • TABLE 23: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 27: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • GRAPHICS PROCESSING UNIT AND CHIPSETS
      • TABLE 24: GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 28: GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • OTHER COMPUTING DEVICES
      • TABLE 25: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 29: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • AUTOMOTIVE
      • TABLE 26: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 30: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • ROBOTICS
      • TABLE 27: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 31: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • MEDICAL DEVICES
      • TABLE 28: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 32: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • SMART TECHNOLOGIES
      • TABLE 29: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 33: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
    • INDUSTRIAL APPLICATIONS
      • TABLE 30: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
      • FIGURE 34: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)

FLIP-CHIP TECHNOLOGY MARKET BY REGION

  • INTRODUCTION
    • FIGURE 35: REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET
  • MARKET SNAPSHOT
    • TABLE 31: GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH 2021 ($ MILLIONS)
    • TABLE 32: GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH 2021 ($ MILLIONS)
  • NORTH AMERICA
    • OVERVIEW
      • TABLE 33: NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 34: NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 35: NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 36: NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • RULES AND REGULATIONS IN NORTH AMERICA
  • EUROPE
    • OVERVIEW
      • TABLE 37: EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 38: EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 39: EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 40: EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • RULES AND REGULATIONS IN EUROPE
      • RoHS
        • RoHS 2
  • ASIA-PACIFIC REGION
    • OVERVIEW
      • TABLE 41: ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 42: ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
      • TABLE 43: ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 44: ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
    • RULES AND REGULATIONS OF VARIOUS ASIA-PACIFIC ECONOMIES
      • China
  • REST OF THE WORLD
    • OVERVIEW
      • TABLE 45: ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
      • TABLE 46: ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)

INDUSTRY STRUCTURE AND COMPETITIVE ANALYSIS

  • INDUSTRY STRUCTURE
    • INFLUENTIAL FACTORS
    • FORECAST COMPONENTS
      • FIGURE 36: INDUSTRY REVENUE MODEL
    • MARKET SHARE ANALYSIS
      • TABLE 47: GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%)
  • FACTORS IMPACTING THE FLIP-CHIP MARKET
    • SUPPLIERS' POWER
    • BARGAINING POWER OF BUYERS
    • THREAT FROM SUBSTITUTES
    • THREAT FROM NEW ENTRANTS
    • DEGREE OF COMPETITION
  • PATENT ANALYSIS
    • PATENTS BY REGION
      • FIGURE 37: REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER 2015
    • PATENTS BY YEAR
      • FIGURE 38: NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015 (NO OF PATENTS)

COMPANY PROFILES

  • AMKOR TECHNOLOGY INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Innovation in Product Portfolio Through Research and Development
    • RECENT DEVELOPMENTS
  • ASE GROUP
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Licensing Agreement
    • RECENT DEVELOPMENTS
  • FARADAY TECHNOLOGY CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • FLIPCHIP INTERNATIONAL LLC
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Expanding Business Portfolio Through Agreements
    • RECENT DEVELOPMENTS
  • GIGPEAK INC.
    • OVERVIEW
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion by Acquisition
    • RECENT DEVELOPMENTS
  • GLOBALFOUNDRIES INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • IBM CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Acquisition
    • RECENT DEVELOPMENTS
  • INTEL CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Acquisitions to Extend Product Portfolio
    • RECENT DEVELOPMENTS
    • KYOCERA AMERICA INC.
  • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • NANIUM SA
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
      • Business Expansion Through Partnership
    • RECENT DEVELOPMENTS
  • NICHIA CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Expanding Business Through Agreements
    • RECENT DEVELOPMENTS
  • NTK TECHNOLOGIES INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion
    • RECENT DEVELOPMENTS
  • PHILIPS LUMILEDS LIGHTING CO.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Innovation in Product Portfolio
    • RECENT DEVELOPMENTS
  • POWERTECH TECHNOLOGY INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Agreements
    • RECENT DEVELOPMENTS
  • RENESAS ELECTRONICS AMERICA INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • SAMSUNG ELECTRONICS CO. LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
      • Business Expansion Through Acquisition
    • RECENT DEVELOPMENTS
  • SIGNETICS CORP.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion
    • RECENT DEVELOPMENTS
  • SILICONWARE PRECISION INDUSTRIES CO. LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strategic Business Agreement
    • RECENT DEVELOPMENTS
  • SK HYNIX INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
      • Research and Development
    • RECENT DEVELOPMENTS
  • STATS CHIPPAC PTE. LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • STMICROELECTRONICS NV
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • SUSS MICROTEC AG
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion Through Collaboration
    • RECENT DEVELOPMENTS
  • TEKTRONIX COMPONENT SOLUTIONS INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • TESSERA TECHNOLOGIES INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • TEXAS INSTRUMENTS INC.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS
  • TOKYO ELECTRON LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio Through New Product Development
    • RECENT DEVELOPMENTS
  • TOSHIBA ELECTRONICS EUROPE GMBH
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • New Product Development
    • RECENT DEVELOPMENTS
  • UNISEM (M) BERHAD
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Business Expansion
    • RECENT DEVELOPMENTS
  • UTAC HOLDINGS LTD.
    • OVERVIEW AND PRIMARY BUSINESS
    • FINANCIALS
    • BUSINESS STRATEGIES
      • Strengthening Product Portfolio
    • RECENT DEVELOPMENTS

LIST OF TABLES

SUMMARY TABLE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)TABLE 1: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
TABLE 2: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, THROUGH 2021 (MILLION UNITS)
TABLE 3: GLOBAL FLIP-CHIP TECHNOLOGY AVERAGE PRICE PER UNIT BY WAFER BUMPING PROCESS, 2015-2021 ($)
TABLE 4: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
TABLE 5: MECHANICAL PROPERTIES OF TIN-LEAD (SN-PB)
TABLE 6: PHYSICAL PROPERTIES OF TIN-LEAD (SN-PB)
TABLE 7: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
TABLE 8: CHARACTERISTICS OF VARIOUS ELEMENTS
TABLE 9: CHARACTERISTICS OF VARIOUS MIXED COMPOSITIONS
TABLE 10: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
TABLE 11: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, THROUGH 2021 ($ MILLIONS)
TABLE 12: GLOBAL MARKET DEMAND FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, THROUGH 2021 ($ MILLIONS)
TABLE 13: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 14: COMPARATIVE ANALYSES OF VARIOUS TYPES OF MEMORY
TABLE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 18: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 20: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, THROUGH 2021 ($ MILLIONS)
TABLE 21: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 22: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 23: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 24: GLOBAL FLIP-CHIP MARKET IN GRAPHIC PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 25: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 26: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 27: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 28: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 29: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 30: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, THROUGH 2021 ($ MILLIONS)
TABLE 31: GLOBAL MARKET FOR FLIP-CHIP PRODUCTION BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 32: GLOBAL MARKET FOR FLIP-CHIP END-USE DEMAND BY REGION, THROUGH 2021 ($ MILLIONS)
TABLE 33: NORTH AMERICAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 34: NORTH AMERICAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 35: NORTH AMERICAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 36: NORTH AMERICAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
TABLE 37: EUROPEAN MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 38: EUROPEAN MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 39: EUROPEAN FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 40: EUROPEAN FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
TABLE 41: ASIA-PACIFIC MARKET FOR FLIP-CHIP PRODUCTION BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 42: ASIA-PACIFIC MARKET FOR FLIP-CHIP END-USE DEMAND BY COUNTRY, THROUGH 2021 ($ MILLIONS)
TABLE 43: ASIA-PACIFIC FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 44: ASIA-PACIFIC FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
TABLE 45: ROW FLIP-CHIP MARKET BY END-USE DEMAND, THROUGH 2021 ($ MILLIONS)
TABLE 46: ROW FLIP-CHIP MARKET BY APPLICATION, THROUGH 2021 ($ MILLIONS)
TABLE 47: GLOBAL FLIP-CHIP MARKET SHARES BY KEY PLAYERS, 2014 (%)

LIST OF FIGURES

SUMMARY FIGURE: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015-2021 ($ MILLIONS)FIGURE 1: DEVELOPMENT OF WAFER BUMPING TECHNOLOGIES, 1960-2004
FIGURE 2: SOLDER EVAPORATION PROCESS
FIGURE 3: SOLDER ALLOY ELECTROPLATING PROCESS
FIGURE 4: SOLDER PASTE SCREENING PROCESS
FIGURE 5: GLOBAL MARKET SHARES FOR FLIP-CHIP TECHNOLOGY BY WAFER BUMPING PROCESS, 2015 AND 2021 (%)
FIGURE 6: GLOBAL FLIP-CHIP UNIT SALES BY WAFER BUMPING PROCESS, 2015-2021 (MILLION UNITS)
FIGURE 7: GLOBAL MARKET FOR COPPER (CU) PILLAR FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
FIGURE 8: GLOBAL MARKET FOR TIN-LEAD (SN-PB) FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
FIGURE 9: GLOBAL MARKET FOR LEAD (PB)-FREE FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
FIGURE 10: GLOBAL MARKET FOR GOLD STUD BUMPED FLIP CHIPS BY END USE, 2015-2021 ($ MILLIONS)
FIGURE 11: MARKET SEGMENTATION BY APPLICATION
FIGURE 12: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGIES BY APPLICATION, 2015-2021 ($ MILLIONS)
FIGURE 13: STRUCTURE OF MULTI-CHIP MODULE
FIGURE 14: STRUCTURE OF SYSTEM-ON-CHIP
FIGURE 15: GLOBAL MARKET FOR FLIP CHIPS USED IN 2-D LOGIC SYSTEM-ON-CHIP BY REGION, 2015-2021 ($ MILLIONS)
FIGURE 16: GLOBAL MARKET FOR FLIP CHIPS USED IN MEMORY APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
FIGURE 17: GLOBAL MARKET FOR FLIP CHIPS USED IN IMAGING TECHNOLOGIES BY REGION, 2015-2021 ($ MILLIONS)
FIGURE 18: STRUCTURE OF HB-LED
FIGURE 19: GLOBAL MARKET FOR FLIP CHIPS USED IN HB-LED APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
FIGURE 20: GLOBAL MARKET FOR FLIP CHIPS USED IN RF APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
FIGURE 21: ARCHITECTURE OF 2.5-D INTEGRATED CIRCUIT
FIGURE 22: STRUCTURE OF 3-D INTEGRATED CIRCUIT
FIGURE 23: GLOBAL MARKET FOR FLIP CHIPS USED IN 2.5-D/3-D APPLICATIONS BY REGION, 2015-2021 ($ MILLIONS)
FIGURE 24: GLOBAL MARKET FOR FLIP-CHIP TECHNOLOGY BY END USE, 2015-2021 ($ MILLIONS)
FIGURE 25: GLOBAL FLIP-CHIP MARKET IN SMARTPHONES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 26: GLOBAL FLIP-CHIP MARKET IN LAPTOPS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 27: GLOBAL FLIP-CHIP MARKET IN DESKTOP CENTRAL PROCESSING UNITS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 28: GLOBAL FLIP-CHIP MARKET IN GRAPHICS PROCESSING UNITS AND CHIPSETS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 29: GLOBAL FLIP-CHIP MARKET IN OTHER COMPUTING DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 30: GLOBAL FLIP-CHIP MARKET IN AUTOMOTIVE APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 31: GLOBAL FLIP-CHIP MARKET IN ROBOTICS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 32: GLOBAL FLIP-CHIP MARKET IN MEDICAL DEVICES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 33: GLOBAL FLIP-CHIP MARKET IN SMART TECHNOLOGIES BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 34: GLOBAL FLIP-CHIP MARKET IN INDUSTRIAL APPLICATIONS BY BUMPING PROCESS, 2015-2021 ($ MILLIONS)
FIGURE 35: REGIONAL SEGMENTATION OF THE FLIP-CHIP MARKET
FIGURE 36: INDUSTRY REVENUE MODEL
FIGURE 37: REGIONAL ANALYSIS OF PATENTS, DECEMBER 2012-DECEMBER 2015
FIGURE 38: NUMBER OF PATENTS FILED BY YEAR, DECEMBER 2012-DECEMBER 2015 (NO OF PATENTS)

Date of Publication:
Jul 20, 2016
File Format:
PDF via E-mail
Number of Pages:
139 Pages
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