Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts

Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts

Information Network, Date of Publication: Apr 14, 2016
US$4,995.00
TIN5480

Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts:

The front end equipment market, which grew 18.4% in 2014 based on revenues converted to dollars, the 2015 market was essentially flat as shown in the table below.

Top 10 Semiconductor Front End Equipment Suppliers

 

2013 (a)

2014 (a)

2015 (f)

 

($B)

($B)

($B)

Applied Materials (AMAT)

5.46

6.33

6.61

ASML (ASML)

5.30

5.63

5.02

Tokyo Electron

3.06

4.66

4.74

Lam Research LRCX)

2.94

3.81

4.70

KLA-Tencor (KLAC)

2.14

2.18

1.95

Screen Semiconductor Solutions

1.22

1.13

0.94

Hitachi High-Technologies

0.80

0.94

0.80

Nikon

0.64

0.82

0.82

Hitachi Kokusai Electric

0.50

0.60

0.64

ASM International (ASMI)

0.46

0.56

0.58

  Total

22.52

26.65

26.79

  Change

18.4%

0.5%

Source: The Information Network

 

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions.

These trends include:
  • Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance.
  • Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology
  • Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction. It provides an additional way to extend Moore’s law beyond spending ever-increasing efforts to shrink feature sizes. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); TSV provides the high-bandwidth interconnection between stacked chips. The TSV process is beginning to enter production. In the case of TSV, since multiple chips are connected, the process has to achieve and maintain very high yield levels in order to be economically viable.
  • Shortening of Technology Life Cycles. The technology life cycle of integrated circuits continues to shorten as semiconductor manufacturers strive to adopt new processes that allow a faster transition to smaller, faster and more complex devices. In the past, the technology life cycle was approximately three years; it is now only two years.
  • New materials. Copper metal layers continue to be the key material for the back end of line for advanced integrated circuits in order to increase performance and reduce the cost of integrated circuits. The Industry is continuously searching directions to reduce the effective K of the low K materials and to reduce the barrier thickness and material types. These changes require new processing and metrology equipment and thus represents challenging developments for the semiconductor manufacturing industry. In addition, in order to overcome limitations in the continued shrink of transistor dimensions, leading edge integrated circuit manufacturers are introducing new materials in the transistor gate stack. The adoption of high-k dielectrics is a key element for gate control in the most advanced technology nodes of 28nm, 20nm and 14nm currently in production, while R&D work to implement the next gate control material being done with III-IV materials. These new materials, combined with metal layers, require new processing and metrology equipment and thus represent a challenging development for the semiconductor manufacturing industry.
  • Increasing use of multi patterning lithography. The continuous need for scaling to meet reduced transistor costs combined with delays in EUV lithography is pushing the industry to develop alternative lithography techniques such as multi patterning, DSA and E-Beam. These alternative technology are increasing the Etch and CMP process steps and thus increasing the process control and metrology steps in these areas accordingly.
  • Increase in Foundry Manufacturing. Asa result of the rising investment needed for semiconductor process development and production as well as the proliferation of different types of semiconductors, semiconductor manufacturing is increasingly being outsourced to large semiconductor contract manufacturers, or foundries. A foundry typically runs several different processes and makes hundreds to thousands of different semiconductor product types in one facility, making the maintenance of a constant high production yield and overall equipment efficiency more difficult to achieve. This trend of shifting to foundries for manufacturing needs has progressed even further during recent years.

 

TABLE OF CONTENTS

Chapter 1 

Introduction 

1-1

 

 

 

Chapter 2

Semiconductor Industry Driving Forces

2-1

2.1

Current State of the Global Semiconductor Industry

2-1

2.2

Memory Market Analysis

2-4

2.3

Logic Market Analysis

2-7

2.4

Internet of Things

2-8

2.5

Foundry Analysis

2-9

 

 

 

Chapter 3

Market Business Sectors Shares and Forecast

3-1

3.1

AMHS Market Shares and Forecast

3-1

3.2

CMP Market Shares and Forecast

3-4

3.3

Clean Market Shares and Forecast

3-7

3.3.1

Plasma Strip

3-8

3.3.2

Spray Processors

3-11

3.3.3

Wet Stations

3-14

3.4

Deposition Market Shares and Forecast

3-17

3.4.1

ALD

3-19

3.4.2

Epitaxy

3-22

3.4.3

MOCVD

3-25

3.4.4

LPCVD  (non-tube)

3-28

3.4.5

LPCVD (tube)

3-31

3.4.6

PECVD

3-34

3.4.7

PVD

3-37

3.5

Ion Implantation Market Shares and Forecast

3-40

3.5.1

High-Current

3-41

3.5.2

High-Energy

3-44

3.5.3

Medium-Current

3-47

3.6

Lithography Market Shares and Forecast

3-50

3.6.1

Direct-Write E-Beam Lithography

3-51

3.6.2

Mask-Making Lithography

3-54

3.6.3

Steppers

3-57

3.7

Oxidation/Diffusion Market Shares and Forecast

3-61

3.8

Photoresist Processing (Track) Market Shares and Forecast

3-64

3.9

RTP Market Shares and Forecast

3-67

3.10

Plasma Etch Market Shares and Forecast

3-70

3.10.1

Dielectric

3-71

3.10.2

Conductive

3-74

3.11

Process Control Market Shares and Forecast

3-77

3.11.1

Lithography Metrology

3-78

3.11.2

Thin-Film Metrology

3-81

3.11.3

Wafer Inspection and Defect Review

3-84

3.12

Wafer-Level Packaging Market Shares and Forecast

3-87

 

 

 

Chapter 4

U.S. Semiconductor Equipment Suppliers - Profiles

4-1

4.1

Applied Materials

4-1

 

Business Sectors Covered In The Market Analysis Chapter

4-1

 

Company Profile

4-2

 

Company Financials

4-12

4.2

Axcelis Technologies

4-13

 

Business Sectors Covered In The Market Analysis Chapter

4-13

 

Company Profile

4-13

 

Company Financials

4-16

4.3

KLA-Tencor

4-17

 

Business Sectors Covered In The Market Analysis Chapter

4-17

 

Company Profile

4-17

 

Company Financials

4-19

4.4

Lam Research

4-20

 

Business Sectors Covered In The Market Analysis Chapter

4-20

 

Company Profile

4-20

 

Company Financials

4-27

4.5

Mattson Technology

4-28

 

Business Sectors Covered In The Market Analysis Chapter

4-28

 

Company Profile

4-28

 

Company Financials

4-30

4.6

Nanometrics

4-31

 

Business Sectors Covered In The Market Analysis Chapter

4-31

 

Company Profile

4-31

 

Company Financials

4-35

4.7

Rudolph Technologies

4-36

 

Business Sectors Covered In The Market Analysis Chapter

4-36

 

Company Profile

4-36

 

Company Financials

4-39

4.8

Ultratech

4-40

 

Business Sectors Covered In The Market Analysis Chapter

4-40

 

Company Profile

4-40

 

Company Financials

4-43

4.9

Veeco

4-44

 

Business Sectors Covered In The Market Analysis Chapter

4-44

 

Company Profile

4-44

 

Company Financials

4-47

 

 

 

Chapter 5

European Semiconductor Equipment Suppliers - Profiles

5-1

5.1

Aixtron

5-1

 

Business Sectors Covered In The Market Analysis Chapter

5-1

 

Company Profile

5-1

 

Company Financials

5-3

5.2

ASM International

5-4

 

Business Sectors Covered In The Market Analysis Chapter

5-4

 

Company Profile

5-4

 

Company Financials

5-7

5.3

ASML

5-8

 

Business Sectors Covered In The Market Analysis Chapter

5-8

 

Company Profile

5-8

 

Company Financials

5-12

5.4

Carl Zeiss

5-13

 

Business Sectors Covered In The Market Analysis Chapter

5-13

 

Company Profile

5-13

 

Company Financials

5-15

5.5

Camtek

5-16

 

Business Sectors Covered In The Market Analysis Chapter

5-16

 

Company Profile

5-16

 

Company Financials

5-18

5.6

EV Group

5-19

 

Business Sectors Covered In The Market Analysis Chapter

5-19

 

Company Profile

5-19

 

Company Financials

5-21

5.7

LPE

5-22

 

Business Sectors Covered In The Market Analysis Chapter

5-22

 

Company Profile

5-22

 

Company Financials

5-22

5.8

Mycronic

5-23

 

Business Sectors Covered In The Market Analysis Chapter

5-23

 

Company Profile

5-23

 

Company Financials

5-24

5.9

Nova Measuring Instruments

5-25

 

Business Sectors Covered In The Market Analysis Chapter

5-25

 

Company Profile

5-25

 

Company Financials

5-29

5.10

Oerlikon / Evatec

5-30

 

Business Sectors Covered In The Market Analysis Chapter

5-30

 

Company Profile

5-30

 

Company Financials

5-31

5.11

Semilab

5-32

 

Business Sectors Covered In The Market Analysis Chapter

5-32

 

Company Profile

5-32

 

Company Financials

5-33

 

 

 

Chapter 6 

Asian Semiconductor Equipment Suppliers - Profiles

6-1

6.1

Advantest

6-1

 

Business Sectors Covered In The Market Analysis Chapter

6-1

 

Company Profile

6-1

6.2

Canon

6-5

 

Business Sectors Covered In The Market Analysis Chapter

6-5

 

Company Profile

6-5

 

Company Financials

6-7

6.3

Canon Anelva

6-9

 

Business Sectors Covered In The Market Analysis Chapter

6-9

 

Company Profile

6-9

 

Company Financials

6-10

6.4

Daifuku

6-11

 

Business Sectors Covered In The Market Analysis Chapter

6-11

 

Company Profile

6-11

 

Company Financials

6-12

6.5

Ebara

6-13

 

Business Sectors Covered In The Market Analysis Chapter

6-13

 

Company Profile

6-13

 

Company Financials

6-15

6.6

Hermes Microvision

6-17

 

Business Sectors Covered In The Market Analysis Chapter

6-17

 

Company Profile

6-17

 

Company Financials

6-18

6.7

Hitachi High-Technologies

6-19

 

Business Sectors Covered In The Market Analysis Chapter

6-19

 

Company Profile

6-19

 

Company Financials

6-21

6.8

Hitachi Kokusai Electric

6-22

 

Business Sectors Covered In The Market Analysis Chapter

6-22

 

Company Profile

6-22

 

Company Financials

6-23

6.9

JEOL

6-24

 

Business Sectors Covered In The Market Analysis Chapter

6-24

 

Company Profile

6-24

 

Company Financials

6-25

6.10

Jusung Engineering

6-26

 

Business Sectors Covered In The Market Analysis Chapter

6-26

 

Company Profile

6-26

 

Company Financials

6-27

6.11

KC Tech

6-28

 

Business Sectors Covered In The Market Analysis Chapter

6-28

 

Company Profile

6-28

 

Company Financials

6-29

6.12

Lasertec

6-30

 

Business Sectors Covered In The Market Analysis Chapter

6-30

 

Company Profile

6-30

 

Company Financials

6-31

6.13

Murata Machinery

6-32

 

Business Sectors Covered In The Market Analysis Chapter

6-32

 

Company Profile

6-32

 

Company Financials

6-33

6.14

Nikon

6-34

 

Business Sectors Covered In The Market Analysis Chapter

6-34

 

Company Profile

6-34

 

Company Financials

6-35

6.15

Nippon Sanso

6-37

 

Business Sectors Covered In The Market Analysis Chapter

6-37

 

Company Profile

6-37

 

Company Financials

6-38

6.16

Nissin Ion Equipment

6-39

 

Business Sectors Covered In The Market Analysis Chapter

6-39

 

Company Profile

6-39

 

Company Financials

6-39

6.17

NuFlare Technology

6-40

 

Business Sectors Covered In The Market Analysis Chapter

6-40

 

Company Profile

6-40

 

Company Financials

6-41

6.18

PSK

6-42

 

Business Sectors Covered In The Market Analysis Chapter

6-42

 

Company Profile

6-42

 

Company Financials

6-43

6.19

Screen Semiconductor Solutions

6-44

 

Business Sectors Covered In The Market Analysis Chapter

6-44

 

Company Profile

6-44

 

Company Financials

6-46

6.20

SEMES

6-47

 

Business Sectors Covered In The Market Analysis Chapter

6-47

 

Company Profile

6-47

 

Company Financials

6-48

6.21

SEN

6-49

 

Business Sectors Covered In The Market Analysis Chapter

6-49

 

Company Profile

6-49

 

Company Financials

6-50

6.22

TES

6-51

 

Business Sectors Covered In The Market Analysis Chapter

6-51

 

Company Profile

6-51

 

Company Financials

6-52

6.23

Tokyo Electron

6-53

 

Business Sectors Covered In The Market Analysis Chapter

6-53

 

Company Profile

6-53

 

Company Financials

6-56

6.24

Tokyo Seimitsu

6-57

 

Business Sectors Covered In The Market Analysis Chapter

6-57

 

Company Profile

6-57

 

Company Financials

6-58

6.25

Topcon Technohouse

6-59

 

Business Sectors Covered In The Market Analysis Chapter

6-59

 

Company Profile

6-59

 

Company Financials

6-59

6.26

Toray Engineering

6-60

 

Business Sectors Covered In The Market Analysis Chapter

6-60

 

Company Profile

6-60

 

Company Financials

6-61

6.27

Ulvac

6-62

 

Business Sectors Covered In The Market Analysis Chapter

6-62

 

Company Profile

6-62

 

Company Financials

6-63

6.28

Ushio

6-64

 

Business Sectors Covered In The Market Analysis Chapter

6-64

 

Company Profile

6-64

 

Company Financials

6-64

6.29

Wonik IPS

6-65

 

Business Sectors Covered In The Market Analysis Chapter

6-65

 

Company Profile

6-65

 

Company Financials

6-65

 

List Of Tables

3.1

AMHS Market Forecast

3-2

3.2

CMP Market Forecast

3-5

3.3

Plasma Strip Market Forecast

3-9

3.4

Spray Processors Market Forecast

3-12

3.5

Wet Stations Market Forecast

3-15

3.6

ALD Market Forecast

3-20

3.7

Epitaxy Market Forecast

3-23

3.8

MOCVD Market Forecast

3-26

3.9

LPCVD  (non-tube) Market Forecast

3-29

3.10

LPCVD (tube) Market Forecast

3-32

3.11

PECVD  Market Forecast

3-35

3.12

PVD Market Forecast

3-38

3.13

High-Current Ion Implantation Market Forecast

3-42

3.14

High-Voltage Ion Implantation Market Forecast

3-45

3.15

Medium-Current Ion Implantation Market Forecast

3-48

3.16

Direct-Write E-Beam Lithography Market Forecast

3-52

3.17

Mask-Making Lithography Market Forecast

3-55

3.18

Steppers Market Forecast

3-58

3.19

Oxidation Market Forecast

3-62

3.20

Photoresist Processing (Track) Market Forecast

3-65

3.21

RTP Market Forecast

3-68

3.22

Dielectric  Etch Market Forecast

3-72

3.23

Conductive Etch Market Forecast

3-75

3.24

Lithography Metrology  Market Forecast

3-79

3.25

Thin-Film Metrology Market Forecast

3-82

3.26

Wafer Inspection and Defect Review Market Forecast

3-85

3.27

Wafer-Level Packaging Market Forecast

3-89

 

List Of Figures

 

3.1

AMHS Market Shares - 2014

3-3

3.2

CMP Market Shares - 2014

3-6

3.3

Plasma Strip Market Shares - 2014

3-10

3.4

Spray Processors Market Shares - 2014

3-13

3.5

Wet Stations Market Shares - 2014

3-16

3.6

ALD Market Shares - 2014

3-21

3.7

Epitaxy Market Shares - 2014

3-24

3.8

MOCVD Market Shares - 2014

3-27

3.9

LPCVD  (non-tube) Market Shares - 2014

3-30

3.10

LPCVD (tube) Market Shares - 2014

3-33

3.11

PECVD  Market Shares - 2014

3-36

3.12

PVD Market Shares - 2014

3-39

3.13

High-Current Ion Implantation Market Shares - 2014

3-43

3.14

High-Voltage Ion Implantation Market Shares - 2014

3-46

3.15

Medium-Current Ion Implantation Market Shares - 2014

3-49

3.16

Direct-Write E-Beam Lithography Market Shares - 2014

3-53

3.17

Mask-Making Lithography Market Shares - 2014

3-56

3.18

Steppers Market Shares - 2014

3-59

3.19

Oxidation Market Shares - 2014

3-63

3.20

Photoresist Processing (Track) Market Shares - 2014

3-66

3.21

RTP Market Shares - 2014

3-69

3.22

Dielectric  Etch Market Shares - 2014

3-73

3.23

Conductive Etch Market Shares - 2014

3-76

3.24

Lithography Metrology  Market Shares - 2014

3-80

3.25

Thin-Film Metrology Market Shares - 2014

3-83

3.26

Wafer Inspection and Defect Review Market Shares - 2014

3-86

3.27

Wafer-Level Packaging Market Shares - 2014

3-90

 

 

Date of Publication:
Apr 14, 2016
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