Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts

Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts

Information Network, Date of Publication: Feb 7, 2018, 278 Pages
US$4,995.00
TIN5480

According to the report, Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts, the front-end equipment market, which grew XX.X% in 2017 based on revenues converted to dollars, the 2017 market decreased X.X%. This report is 278 Pages, forecasts for all WFE equipment. Market shares are updated. Profiles of all equipment vendors.

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. 

These trends include:
  • Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance.
  • Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology
  • Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction. It provides an additional way to extend Moore’s law beyond spending ever-increasing efforts to shrink feature sizes. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); TSV provides the high-bandwidth interconnection between stacked chips. The TSV process is beginning to enter production. In the case of TSV, since multiple chips are connected, the process has to achieve and maintain very high yield levels in order to be economically viable.
  • Shortening of Technology Life Cycles. The technology life cycle of integrated circuits continues to shorten as semiconductor manufacturers strive to adopt new processes that allow a faster transition to smaller, faster and more complex devices. In the past, the technology life cycle was approximately three years; it is now only two years.
  • New materials. Copper metal layers continue to be the key material for the back end of line for advanced integrated circuits in order to increase performance and reduce the cost of integrated circuits. The Industry is continuously searching directions to reduce the effective K of the low K materials and to reduce the barrier thickness and material types. These changes require new processing and metrology equipment and thus represents challenging developments for the semiconductor manufacturing industry. In addition, in order to overcome limitations in the continued shrink of transistor dimensions, leading edge integrated circuit manufacturers are introducing new materials in the transistor gate stack. The adoption of high-k dielectrics is a key element for gate control in the most advanced technology nodes of 28nm, 20nm and 14nm currently in production, while R&D work to implement the next gate control material being done with III-IV materials. These new materials, combined with metal layers, require new processing and metrology equipment and thus represent a challenging development for the semiconductor manufacturing industry.
  • Increasing use of multi-patterning lithography. The continuous need for scaling to meet reduced transistor costs combined with delays in EUV lithography is pushing the industry to develop alternative lithography techniques such as multi patterning, DSA and E-Beam. These alternative technology are increasing the Etch and CMP process steps and thus increasing the process control and metrology steps in these areas accordingly.
  • Increase in Foundry Manufacturing. Asa result of the rising investment needed for semiconductor process development and production as well as the proliferation of different types of semiconductors, semiconductor manufacturing is increasingly being outsourced to large semiconductor contract manufacturers, or foundries. A foundry typically runs several different processes and makes hundreds to thousands of different semiconductor product types in one facility, making the maintenance of a constant high production yield and overall equipment efficiency more difficult to achieve. This trend of shifting to foundries for manufacturing needs has progressed even further during recent years.

Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts:
TABLE OF CONTENTS

Chapter 1 Introduction

Chapter 2 Semiconductor Industry Driving Forces

2.1 Introduction
2.2 Foundries
2.2.1 Foundry Capex Trends
2.2.2 Foundry Revenue Growth
2.2.3 Foundry Market Share
2.2.4 Revenue Growth by Foundry
2.2.5 Global Foundry Market Trend by Application
2.2.6 Global Foundry Market Trend by Customer Type
2.2.7 Global Foundry Market Trend by Device
2.2.8 Foundry Technology Linewidth Roadmap
2.2.9 Capacity trend by linewidth
2.2.10 Capacity ratio by region
2.3 DRAM
2.3.1 Present and Future Capacity of DRAM by Each Manufacturer
2.3.2 DRAM Price Trends Historic and Future
2.3.3 DRAM Manufacturer Market Share
2.3.4 DRAM Demand
2.4 NAND
2.4.1 Present and Future Capacity of NAND by Each Manufacturer
2.4.2 NAND Price Trends Historic and Future
2.4.3 2D transition to 3D NAND by Each Manufacturer
2.4.4 NAND Manufacturer Market Share
2.4.5 NAND Demand
2.5 China
2.5.1 China’s Semiconductor Infrastructure
2.5.2 China’s Semiconductor Market
2.5.3 China’s IC Production
2.5.4 China’s IC Consumption
2.5.5 China’s IC Production/Consumption Ratio
2.5.6 China’s IC Import Requirements
2.5.7 China’s IC Supply/Demand
2.5.8 China’s IC Fab Capacity
2.5.9 China’s IC Fab Capacity by Region
2.5.10 China’s 8- And 12-Inch Fabs and Foundries
2.5.11 China’s IC Fab Capacity by Wafer Size
2.5.12 China’s IC Fab Capacity by Geometry
2.5.13 China’s IC Production by Type

Chapter 3 Market Business Sectors Shares and Forecast

3.1 AMHS Market Shares and Forecast
3.2 CMP Market Shares and Forecast
3.3 Clean Market Shares and Forecast
3.3.1 Plasma Strip
3.3.2 Spray Processors
3.3.3 Wet Stations
3.4 Deposition Market Shares and Forecast
3.4.1 ALD
3.4.2 Epitaxy
3.4.3 MOCVD
3.4.4 LPCVD (non-tube)
3.4.5 LPCVD (tube)
3.4.6 PECVD
3.4.7 PVD
3.5 Ion Implantation Market Shares and Forecast
3.5.1 High-Current
3.5.2 High-Energy
3.5.3 Medium-Current
3.6 Lithography Market Shares and Forecast
3.6.1 Direct-Write E-Beam Lithography
3.6.2 Mask-Making Lithography
3.6.3 Steppers
3.7 Oxidation/Diffusion Market Shares and Forecast
3.8 Photoresist Processing (Track) Market Shares and Forecast
3.9 RTP Market Shares and Forecast
3.10 Plasma Etch Market Shares and Forecast
3.10.1 Dielectric
3.10.2 Conductive
3.11 Process Control Market Shares and Forecast
3.11.1 Lithography Metrology
3.11.2 Thin-Film Metrology
3.11.3 Wafer Inspection and Defect Review
3.12 Wafer-Level Packaging Market Shares and Forecast

Chapter 4 U.S. Semiconductor Equipment Suppliers - Profiles

4.1 Applied Materials
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.2 Axcelis Technologies
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.3 KLA-Tencor
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.4 Lam Research
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.5 Mattson Technology
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.6 Nanometrics
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.7 Rudolph Technologies
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.8 Ultratech
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
4.9 Veeco
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials

Chapter 5 European Semiconductor Equipment Suppliers - Profiles

5.1 Aixtron
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.2 ASM International
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.3 ASML
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.4 Carl Zeiss
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.5 Camtek
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.6 EV Group
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.7 LPE
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.8 Mycronic
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.9 Nova Measuring Instruments
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.10 Oerlikon / Evatec
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
5.11 Semilab
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials

Chapter 6 Asian Semiconductor Equipment Suppliers - Profiles

6.1 Advantest
Business Sectors Covered In The Market Analysis Chapter
Company Profile
6.2 Canon
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.3 Canon Anelva
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.4 Daifuku
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.5 Ebara
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.6 Hermes Microvision
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.7 Hitachi High-Technologies
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.8 Hitachi Kokusai Electric
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.9 JEOL
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.10 Jusung Engineering
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.11 KC Tech
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.12 Lasertec
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.13 Murata Machinery
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.14 Nikon
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.15 Nippon Sanso
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.16 Nissin Ion Equipment
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.17 NuFlare Technology
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.18 PSK
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.19 Screen Semiconductor Solutions
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.20 SEMES
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.21 SEN
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.22 TES
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.23 Tokyo Electron
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.24 Tokyo Seimitsu
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.25 Topcon Technohouse
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.26 Toray Engineering
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.27 Ulvac
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.28 Ushio
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials
6.29 Wonik IPS
Business Sectors Covered In The Market Analysis Chapter
Company Profile
Company Financials

List Of Tables

2.1 Foundry Capex ($ Billions) And Shares (%)
2.2 Foundry Forecast
2.3 Pure Play Foundry Revenue Shares
2.4 Global Foundry Market By Application
2.5 Global Foundry Market By Customer Type
2.6 Global Foundry Market By Device Type
2.7 Technology Roadmaps For China Foundries
2.8 Global Foundry Market By Linewidth
2.9 Foundry Capacity By Region
2.10 Present And Future Capacity Of Dram By Manufacturer
2.11 DRAM Wafer Capacity
2.12 DRAM Output And Price Metrics Forecast
2.13 Mobile Dram Market Share
2.14 Dram Demand Forecast By Application
2.15 NAND Capacity By Supplier
2-16 NAND Capacity Forecast By Supplier
2-17 NAND Output And Price Metrics Forecast
2-18 2D Vs 3D NAND FORECAST
2-19 NAND Market Share By Manufacturer
2-20 NAND Manufacturer Market Share
2-21 NAND Market By Application
2-22 China’s 8- And 12-Inch Fabs and Foundries
3.1 AMHS Market Forecast
3.2 CMP Market Forecast
3.3 Plasma Strip Market Forecast
3.4 Spray Processors Market Forecast
3.5 Wet Stations Market Forecast
3.6 ALD Market Forecast
3.7 Epitaxy Market Forecast
3.8 MOCVD Market Forecast
3.9 LPCVD (non-tube) Market Forecast
3.10 LPCVD (tube) Market Forecast
3.11 PECVD Market Forecast
3.12 PVD Market Forecast
3.13 High-Current Ion Implantation Market Forecast
3.14 High-Voltage Ion Implantation Market Forecast
3.15 Medium-Current Ion Implantation Market Forecast
3.16 Direct-Write E-Beam Lithography Market Forecast
3.17 Mask-Making Lithography Market Forecast
3.18 Steppers Market Forecast
3.19 Oxidation Market Forecast
3.20 Photoresist Processing (Track) Market Forecast
3.21 RTP Market Forecast
3.22 Dielectric Etch Market Forecast
3.23 Conductive Etch Market Forecast
3.24 Lithography Metrology Market Forecast
3.25 Thin-Film Metrology Market Forecast
3.26 Wafer Inspection and Defect Review Market Forecast
3.27 Wafer-Level Packaging Market Forecast

List Of Figures

2.1 China’s IC Production Forecast
2.2 China’s IC Consumption
2.3 China’s IC Production/Consumption Ratio
2.4 China’s IC Import Requirements
2.5 China’s IC Supply/Demand
2.6 China’s IC Fab Capacity
2.7 China’s IC Fab Capacity by Region
2.8 China’s IC Fab Capacity by Wafer Size
2.9 China’s IC Fab Capacity by Geometry
2.10 China’s IC Production by Type
3.1 AMHS Market Shares
3.2 CMP Market Shares
3.3 Plasma Strip Market Shares
3.4 Spray Processors Market Shares
3.5 Wet Stations Market Shares
3.6 ALD Market Shares
3.7 Epitaxy Market Shares
3.8 MOCVD Market Shares
3.9 LPCVD (non-tube) Market Shares
3.10 LPCVD (tube) Market Shares
3.11 PECVD Market Shares
3.12 PVD Market Shares
3.13 High-Current Ion Implantation Market Shares
3.14 High-Voltage Ion Implantation Market Shares
3.15 Medium-Current Ion Implantation Market Shares
3.16 Direct-Write E-Beam Lithography Market Shares
3.17 Mask-Making Lithography Market Shares
3.18 Steppers Market Shares
3.19 Oxidation Market Shares
3.20 Photoresist Processing (Track) Market Shares
3.21 RTP Market Shares
3.22 Dielectric Etch Market Shares
3.23 Conductive Etch Market Shares
3.24 Lithography Metrology Market Shares
3.25 Thin-Film Metrology Market Shares
3.26 Wafer Inspection and Defect Review Market Shares
3.27 Wafer-Level Packaging Market Shares

Date of Publication:
Feb 7, 2018
File Format:
PDF via E-mail
Number of Pages:
278 Pages