In 2017 global smartphone shipment volume is estimated at 1.56 billion units, up 4.2% year-on-year; this is mainly attributed to the rise of the middle class in emerging countries (India, Southeast Asia), which has pushed the replacement demand. Despite the nearly saturated market, the Greater China region continues to be the world's largest smartphone market, accounting for about one-third of the global shipments; the industry's shipment volume peaked at 400 million units in 2014. This report provides global smartphone development overview and the competitiveness analysis of global brands; examines the latest development of the key components like application processor, baseband IC, panel and memory IC; looks into the future development of emerging products and technologies in the areas of the edge-to-edge screen, 3D sensing, and wireless charging.
List of Topics
Apple, ASUS, Broadcom, Cowell, Energous, Ericsson, Exynos, Finisar, Flextronics, Foxconn, Fujuitsu, Genius, Gionee, Heptagon, Himax, HiSilicon, HTC, Huaqin, Huawei, IIVI, InnoTek, Intel, InterDigital, Intex, InvenTec, Kirin, Kyocera, Largan, Lava, Lenovo, LG, Lumentum, MediaTek, Micromax, Motorola, Murata, Nokia, NTK, Oppo, Pegatron, Philips, Pinecone, Powercast, Powermat, Qualcomm, Reliance Jio, Samsung, Sanechips, Sharp, SMIC, Sony, Splashpower, Spreadtrum, STM, Sunny Optical Technology, TI, Tong Hsing, Truly, TSMC, UMC, Viavi, Vivo, Wingtech, Winsemi, Xiaomi, ZTE
Development Trends of the Global Market
Competitive Analysis of Leading Branded Vendors
Development of Key Components
Emerging Products and Technologies