IPC-2315  Design Guide for High Density Interconnects and Microvias

IPC-2315 Design Guide for High Density Interconnects and Microvias

Date of Publication: Jun 1, 2000, 32 Pages
US$119.00
IPC-2315

Published jointly with the Japan Printed Circuits Association, IPC-JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures. Addresses various considerations when designing an HDI printed wiring board including design examples and processes, selection of materials, general descriptions, and various microvia technologies. Offers designers and manufacturers one source for reliable design and manufacturability information for commonly produced HDI boards. Includes over 30 full color illustrations. 33 pages.

Date of Publication:
Jun 1, 2000
File Format:
Non-Printable CD-ROM
Number of Pages:
32 Pages
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