IPC-4104  Specifications for High Density Interconnect (HDI) and Microvia Materials

IPC-4104 Specifications for High Density Interconnect (HDI) and Microvia Materials

Date of Publication: May 1, 1999, 92 Pages
US$119.00
IPC-4104

IPC-4104 covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC-JPCA-4104 cover the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC-JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials. 92 pages. Released May 1999.

Date of Publication:
May 1, 1999
File Format:
Non-Printable CD-ROM
Number of Pages:
92 Pages
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