This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.
The specifications of Revision C cover end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline and mixed dielectric/multilayer stripline applications, including updates for: