IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Date of Publication: Sep 8, 2016
US$160.00
IPC-6018C

This specification covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. Revision C incorporates many new requirements in areas such as HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, PTFE smear and dielectric removal. For use with IPC-6011. Supersedes IPC-6018B and IPC-6016.

The specifications of Revision C cover end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline and mixed dielectric/multilayer stripline applications, including updates for:

  • hole registration
  • marking requirements
  • laminate imperfections such as measling, crazing and delamination
  • ENEPIG coatings
  • hot air solder leveling (HASL)/solder coating
  • resin smear on PTFE laminates
  • cap plating of filled holes
  • copper filled microvias
  • microvia target land requirements

 

Date of Publication:
Sep 8, 2016
File Format:
PDF Download, CD-ROM, Print Copy