IPC-7525B Stencil Design Guideline

Date of Publication: Oct 3, 2011, 14 Pages

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included. 14 pages.

Date of Publication:
Oct 3, 2011
File Format:
Non-Printable CD-ROM & Print Copy
Number of Pages:
14 Pages