2015 IPC International Technology Roadmap for Electronic Interconnections

IPC, Date of Publication: Mar 18, 2015, 642 Pages
US$497.00
IPC-ROADMAP-15

The IPC 2015 International Technology Roadmap provides vision and direction for product and process development and the services required to satisfy current and future needs of companies that design, build, buy or specify electronic equipment and materials. The IPC Roadmap is an invaluable resource for any person or company in or having interest in the global electronics supply chain. It is an essential resource for executives, technologists and strategic planners, who will get unique accees to the knowledge and data of an international team of subject matter experts. Two years of work by this global working group has resulted in the most unprecedented snapshot you will find anywhere of the vision and needs assessments of OEM, ODM and EMS companies. If you want to know where your company needs to be in the years ahead—and how to get there—add the IPC 2015 Technology Roadmap to your marketing, business and technology libraries.


TABLE OF CONTENTS

Part A – General Overview
Section 1 – Roadmap Overview
Section 2 – OEM/Integrator Expectations
Section 3 – Emulator Details
Section 4 – Standards, Specifications, and
Guidelines
Section 5 – Sustainability
Section 6 – Terms and Acronyms

Part B – Technology Trends
Section 1 – Technology Trends - General
Section 2 –Semiconductor Trends and
Packaging Solutions
Section 3 – Technology Trends Summary Data
Section 4 – (Blank, to be re-instituted in 2017)
Section 5 – Connector and Socket Trends
Section 6 – Reliability
Section 7 – Printed Electronics
Section 8 – Embedded Technologies
Section 9 – Emerging Materials

Part C – Design Considerations
Section 1 – Design and Data Considerations –
General
Section 2 – Design Methods and Structure
Section 3 – System and Enclosure Configuration
Section 4 – Component Selection and
Development

Part D – Interconnections and Substrates
Section 1 – Interconnections and Substrates -
General
Section 2 – Interposer and Module Substrates
Section 3 – Portable Boards
Section 4 – Product Boards
Section 5 – Backplane Boards
Section 6 - Electrical and Optical Performance
Section 7 – Interconnection Trends

Part E – Assembly Technology
Section 1 – Assembly Technology - General
Section 2 – Interposer and Module Assembly
Section 3 – Portable Board Assembly
Section 4 – Product Board Assembly
Section 5 – Backplane Assembly
Section 6 – Assembly Trends – Internal and
External

Part F – Appendix
Section 1 – Validation Services
Section 2 – Contributors

Delivery:
CD-ROM
Date of Publication:
Mar 18, 2015
File Format:
PDF
Number of Pages:
642 Pages