This Addendum supplements or replaces specifically identified requirements of IPC J-STD-001, Revision F, for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space.
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC J-STD-001F to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space.
When required by procurement documentation/drawings, this Addendum supplements or replaces specifically identified requirements of IPC J-STD- 001, Revision F of July 2014.
The contract takes precedence over this Addendum, referenced standards and User-approved drawings. In the event of a conflict between this Addendum and the applicable documents cited herein, this Addendum takes precedence. Where referenced criteria of this Addendum differ from the published IPC J-STD-001F, this Addendum takes precedence. In the event of conflict between the requirements of this Addendum and the applicable assembly drawing(s)/documentation, the applicable User approved assembly drawing(s)/documentation take precedence. See Table 1 of this Addendum, clauses 1.7 Order of Precedence and 1.7.1 Conflict.
0.1.3 Existing or Previously Approved Designs
This Addendum shall not constitute the sole cause for the redesign of previously approved designs. When drawings for existing or previously approved designs undergo revision, they should be reviewed and changes made that allow for compliance with the requirements of this Addendum.
0.1.4 Use This Addendum is not to be used as a standalone document. Where criteria are not supplemented, the Class 3 requirements of IPC J-STD-001F shall apply. Where IPC J-STD- 001F criteria are supplemented or new criteria are added by this Addendum, the clause is listed in J-STD-001FS, Table 1, Space Applications Requirements, and the entire IPC J-STD-001F clause is replaced by this Addendum except as specifically noted. The clauses modified by this Addendum do not include subordinate clauses unless specifically stated, e.g., 1.4 does not include 1.4.1. Clauses, Tables, Figures, etc., in IPC J-STD-001F that are not listed in this Addendum are to be used as-published.
Tin For the purpose of this document, lead-free tin is defined as tin containing less than 3 percent lead by weight as an alloying constituent. Solder alloy SnAg3.7 is exempt from this requirement. See Table 1 of this Addendum, clause 3.2. 0.1.6 Use of Lead-Free Tin The use of components, assemblies, packaging technology, mechanical hardware,