IPC-J-STD-004B Requirements for Soldering Fluxes

J-STD-004B Requirements for Soldering Fluxes - includes Amendment 1

Date of Publication: Nov 1, 2011, 20 Pages

This standard prescribes general requirements for the classification and characterization of fluxes for high-quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 

Date of Publication:
Nov 1, 2011
Number of Pages:
20 Pages