IPC-J-STD-005-JP Requirements for Soldering Pastes

IPC-J-STD-005-JP Requirements for Soldering Pastes - includes Amendment 1 - Japanese Language

IPC, Date of Publication: Jan 8, 1995, 24 Pages
US$123.00
IPC-J-STD-005-JP

This is the Japanese language version of J-STD-005A

DOD Adopted 1995

Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995. 

 

Date of Publication:
Jan 8, 1995
Number of Pages:
24 Pages
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