IPC-9703 IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

IPC-9703 IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Date of Publication: Mar 4, 2009, 42 Pages
US$152.00
IPC-9703

IPC-9703 establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests. 42 pages. Released March 2009.

Date of Publication:
Mar 4, 2009
File Format:
Non-Printable CD-ROM & Print Copy
Number of Pages:
42 Pages
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