IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or the entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead-free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.
 
Please note that IPC site licenses are no longer available, all IPC standards must be purchased as single-user licenses, but you can select as many quantities (single user licenses) as you need based on the number of end-users.  The number of licenses can be modified by going to the "View Cart" option.
US$190.00
Date of Publication: Nov 28, 2017
本文件是唯一的、行业一致认可的线缆和线束组件的要求和验收标准的最新版本,增加了锁线、保险索、索环和线槽的新章节,并更新了许多章节的信息。该标准包含了700多张照片和插图,描述了压接、机械固定和焊接互连所用的材料、方法、测试和验收标准以及与电缆和线束组件相关组装活动。 IPC/WHMA-A-620C 由IPC和线束制造商协会(WHMA)开发。2017年5月翻译

US$190.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

US$190.00
Date of Publication: Nov 18, 2016
印制板可接受性的权威指南!...

US$608.00
Date of Publication: Jul 17, 2017

This is a family of specification for board design. Put IPC's design library at your fingertips! The IPC-2220-FAM series is built around the IPC-2221, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology.


US$160.00
Date of Publication: Feb 19, 2018
The intent of IPC/PERM-2901 design guide is to assist design engineers in developing electronics that are completely Pb-free and meet the demanding requirements of ADHP systems and products. Coverage is given to Pb-free solders and solder joints, tin whiskers, printed board defects, product qualification, supply chain management, obsolescence mangement, and COTS assembly, selection and use

US$160.00
Date of Publication: May 1, 2003
This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic products. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or subassembly.

US$420.00
Date of Publication: Jul 17, 2017

Coating Specifications for Boards and Assemblies. This is a family of IPC documents for coatings used in the printed board fabrication and assembly processes.


US$85.00
Date of Publication: Apr 3, 2000
Choosing an Information Technology provider for a PWB manufacturing facility can be cumbersome and confusing. Most software systems do not have fields...

US$89.00
Date of Publication: Aug 17, 2016
The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal.

US$125.00
Date of Publication: Mar 10, 2004
Controlled impedance is the maintenance of some specified tolerance in the characteristic impedance of an interconnect line (transmission line) that is used...

US$160.00
Date of Publication: May 1, 2012
IPC-2221B is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer.

US$125.00
Date of Publication: Dec 1, 2010
This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections.

US$160.00
Date of Publication: Oct 18, 2016
Revision D provides new design guidance and requirements for material selection and construction, selective (button) plating, minimum bending for flexible circuits with coverlay, impedance and capacitance control, unsupported edge conductors/fingers and copper filled vias/microvias.

US$125.00
Date of Publication: Dec 1, 1998
Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies.

US$125.00
Date of Publication: May 1, 2003
Designers and manufacturers looking for the next level of guidance on building high density interconnect (HDI) boards will welcome IPC-2226. Used in conjunction with IPC-2221A, this standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and its forms of component mounting and interconnecting structures.

US$125.00
Date of Publication: Nov 1, 2013
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation.

US$89.00
Date of Publication: Jun 5, 2002
This design guideline provides RF and microwave circuit design engineers, printed circuit board engineers, packaging engineers and drafters with the information necessary to design practical, functional and cost effective microwave circuit boards in the frequency range of 100 MHz to 30 GHz.

US$125.00
Date of Publication: Jun 1, 2000
Published jointly with the Japan Printed Circuits Association, IPC-JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures.

US$160.00
Date of Publication: Mar 1, 2007
IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications.

US$125.00
Date of Publication: Jul 3, 2000
The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A.

US$89.00
Date of Publication: Jul 1, 1996
IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process...

US$89.00
Date of Publication: Nov 1, 1996
IPC-3408 document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components.

US$158.00
Date of Publication: Mar 17, 2017
If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.

US$130.00
Date of Publication: Nov 17, 2017
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits.

US$328.00
Date of Publication: Aug 1, 2012
Artwork for assessing printed board manufacturer capabilities per IPC-6012 requirements. Features test specimen A,B,D,E,F,L,G,H,M,N,R and S per IPC-2221. Includes master drawings (IPC-100103) and universal hole and profile drawing (IPC-100002) in electronic .pdf format. Artwork files in Gerber format.

US$109.00
Date of Publication: Apr 3, 2006
The Cleanliness and Residue Evaluation Test Board is designed to give the manufacturing process professional a tool to help assess the impact of cleanliness and residues on bare boards and finished assemblies, as well as a tool to assess the impact of changing manufacturing parameters on cleanliness.

US$190.00
Date of Publication: Jun 14, 2016
The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information.

US$234.00
Date of Publication: Jul 30, 2015
l'IPC-A-610 est la norme la plus utilisée dans le monde pour les assemblages électroniques. L'IPC-A-610 est incontournable pour tous les services d'assemblage et d'assurance qualité, l’IPC-A-610F illustre les critères de réalisation pratique acceptés par l’industrie pour les assemblages électroniques au travers de points détaillés reflétant les conditions acceptable et défaut grâce à des illustrations et des photographies en couleur. Cette révision inclut deux nouveaux types de terminaisons TMS, ainsi que des changements pour les critères de remplissage des trous métallisés et les vides dans les BGA. En outre, chaque fois que cela a été possible, les points ont été modifiés pour une meilleure lisibilité et une compréhension améliorée - sans supprimer aucune exigence.

US$160.00
Date of Publication: Feb 1, 2012
IPC-AJ-820, Assembly and Joining Handbook, has been updated to give users up-to-date information on everything from handling to design to soldering and testing. This handbook (includes CD-ROM) contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies.

US$125.00
Date of Publication: Oct 22, 1990
Provides guidelines for the design, selection and application of soldered surface mount connectors for all types of printed boards, rigid, flexible-rigid...

US$89.00
Date of Publication: Jan 1, 1995
IPC-CA-821 covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and...

US$89.00
Date of Publication: Oct 1, 2008
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic stability.