IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.  

 

US$152.00
Date of Publication: Nov 6, 2013
This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board...

US$75.00
Date of Publication: Mar 5, 2008
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state...

US$160.00
Date of Publication: Mar 5, 2014
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses.

US$85.00
Date of Publication: Feb 2, 2012
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive...

US$152.00
Date of Publication: Aug 7, 1992
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of...

US$85.00
Date of Publication: Dec 17, 2014
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure...

US$85.00
Date of Publication: Mar 2, 2006
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation...