IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or the entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead-free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.
 
Please note that IPC site licenses are no longer available, all IPC standards must be purchased as single-user licenses, but you can select as many quantities (single user licenses) as you need based on the number of end-users.  The number of licenses can be modified by going to the "View Cart" option.
US$125.00
Date of Publication: Jun 1, 2000
Published jointly with the Japan Printed Circuits Association, IPC-JPCA-2315 provides an easy to follow tutorial on the selection of HDI and microvia design rules and structures.

US$160.00
Date of Publication: Mar 1, 2007
IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications.

US$125.00
Date of Publication: Jul 3, 2000
The definitive standard on printed board dimensioning and tolerancing is finally here! IPC-2615 comprehensively covers dimensioning and tolerancing of electronic packaging and is consistent with other IPC printed board standards such as IPC-6012A and IPC-2221A.

US$89.00
Date of Publication: Jul 1, 1996
IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics manufacturing as solder alternatives. The process...

US$89.00
Date of Publication: Nov 1, 1996
IPC-3408 document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components.

US$130.00
Date of Publication: Nov 17, 2017
IPC-4103B standard covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline and high speed digital electrical and electronic circuits.

US$200.00
Date of Publication: Jun 14, 2016
The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information.

US$160.00
Date of Publication: Feb 1, 2012
IPC-AJ-820, Assembly and Joining Handbook, has been updated to give users up-to-date information on everything from handling to design to soldering and testing. This handbook (includes CD-ROM) contains general information and descriptions of proven techniques for assembly and soldering electronic assemblies.

US$125.00
Date of Publication: Oct 22, 1990
Provides guidelines for the design, selection and application of soldered surface mount connectors for all types of printed boards, rigid, flexible-rigid...

US$89.00
Date of Publication: Jan 1, 1995
IPC-CA-821 covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and...

US$89.00
Date of Publication: Oct 1, 2008
This is the industry standard for qualification and quality conformance of conformal coating. Its intent is to show how to obtain maximum information with minimum test redundancy. Includes requirements and evaluations of material properties using standardized test vehicles. Amendment 1 updates include new qualification, retention and conformance inspection requirements for FTIR, MIR and hydrolytic stability.

US$125.00
Date of Publication: Mar 1, 1998
IPC CF 152B covers the requirements for copper-invar-copper (CIC), copper-molybdenum- copper (CMC) and three-layer composites for use in electronic applications. IPC-CF-152B includes specification sheets, which outline engineering and performance data for each type of composite metallic materials.

US$160.00
Date of Publication: Jul 1, 2011
IPC CS-65B updated for new technologies including lead-free, no-clean and environmentally friendly chemistries. This is a collection of information...

US$160.00
Date of Publication: Jan 1, 2004
IPC-CM-770E revision provides effective guidelines in the preparation and attachment of components for printed circuit board assembly and reviews pertinent...

US$160.00
Date of Publication: Jul 1, 1996
IPC-D-279 establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations.

US$125.00
Date of Publication: Jun 1, 1991

IPC-D-310C document provides manufacturing and design considerations, input data requirements, test coupons, process control, tape and preform artwork, cut and strip artwork, vector photoplotting, rasterplotting, direct imaging, measurement and quality assurance.