IPC Standards

Whether you need a complete collection of IPC documents, a custom collection of standards that you choose, or the entire set of training videos covering electronics assembly, IPC A-610 training, ESD Control, lead-free manufacturing, soldering, wire harness, rework, SMT, through hole, component identification, quality and safety, Electronics.ca Publications has a solution to meet your needs.
US$119.00
Date of Publication: Oct 12, 2011
本标准为用于制造挠性印制电路和挠性扁平电缆的挠性覆金属箔介质材料,建立了分类系统、鉴定和质量符合性要求。本标准包含12张挠性覆金属箔介质材料的规 格单,挠性覆金属箔介质材料由各种覆铜箔、聚合物基底介质(选自至少两种聚酯、多种聚酰亚胺或液晶聚合物的),以及至少7种聚合物粘合剂与无胶粘合剂组...

US$85.00
Date of Publication: Sep 10, 2014
This document provides the designer/user with guideline information related to the use of pressure sensitive adhesives (PSAs) for fabrication and assembly...

US$119.00
Date of Publication: Jun 6, 2013
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component...

US$160.00
Date of Publication: Nov 6, 2013
This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board...

US$75.00
Date of Publication: Mar 5, 2008
Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state...

US$160.00
Date of Publication: Mar 5, 2014
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to increase reliability of electronic devices by two methods: alleviate coefficient of thermal expansion (CTE) mismatch (between the electronic package and the assembly substrate) and/or increase mechanical strength. Underfill materials are also used for environmental protection, mechanical shock or vibration, and anti-tampering uses.

US$85.00
Date of Publication: Feb 2, 2012
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive...

US$152.00
Date of Publication: Aug 7, 1992
Provides information on multichip module technology, including parametric data, design and manufacturing information and a proposed categorization of...

US$85.00
Date of Publication: Dec 17, 2014
Provides requirements for dielectric adhesives to hold components in place from the mounting to the soldering process and identifies test methods to ensure...

US$85.00
Date of Publication: Mar 2, 2006
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation...

US$119.00
Date of Publication: Mar 10, 2010
This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical...

US$85.00
Date of Publication: Mar 10, 2010
This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity...

US$119.00
Date of Publication: Mar 17, 2010
This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and...

US$119.00
Date of Publication: Aug 26, 2014
This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards...

US$119.00
Date of Publication: Oct 9, 2013
This standard establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to...

US$160.00
Date of Publication: Jul 1, 2011
IPC CS-65B updated for new technologies including lead-free, no-clean and environmentally friendly chemistries. This is a collection of information...