IPC-TR-585  Time, Temperature and Humidity Stress of Final Board Finish Solderability

IPC-TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability

Date of Publication: May 5, 2006, 54 Pages
US$114.00
IPC-TR-585

IPC-TR-585 Technical Report details the investigations into identifying stress tests that distinguish between robust and non-robust surface finishes. A robust finish will pass a test for solderability whereas a non-robust finish will fail. The stress tests identified do not necessarily duplicate real world environment (fabrication of the bare printed board through assembly), but they must correlate to solderability performance. The Sequential Electrochemical Reduduction Analysis (SERA) was used extensively to evaluate the solderability performance of the finishes after stress exposure. 54 pages. Released May 2006.

Date of Publication:
May 5, 2006
File Format:
Non-Printable CD-ROM
Number of Pages:
54 Pages
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