This study includes market forecast data and analysis on a worldwide basis for the mobile phone semiconductor market for 2014–2019. This document provides segmentation by various air interface standards in 2G, 2.5G, 3G, 3.5G, and 4G technologies; by major semiconductor device type; and by geographic region. It also provides comprehensive data on semiconductor BOM costs by air interface standard. Key forecast assumptions are identified, and their potential impact on the mobile phone semiconductor market is discussed. A comparison of the current forecast with the prior forecast is also noted.
Worldwide mobile phone semiconductor revenue grew by 11% in 2014 to reach $83.8 billion. By 2019, mobile phone semiconductor revenue will cross the $100 billion milestone. A number of factors are at play in the market including a move to in-house silicon by major smartphone OEMs, pricing pressure in the low-end segment of the market, an upgrade cycle to higher functionality and premium smartphones in the Chinese market, added functionality to the silicon BOM in the form of increased NAND and DRAM content, increasing attach rate of fingerprint and motion sensors, and sensor hubs and connectivity such as NFC and Bluetooth LE.
TABLE OF CONTENTS
In This Study
Methodology
Situation Overview
Future Outlook
Forecast and Assumptions
Table: Worldwide Mobile Phone Semiconductor Revenue by Device, 2014–2019 ($M)
Transition to LTE Is Well Under Way; LTE Mobile Phone Semiconductor Revenue Accounts for 64% of the Total Opportunity in 2015
Table: Worldwide Mobile Phone Semiconductor Revenue by Air Interface Standard, 2014–2019 ($B)
Smartphone Unit Growth at the High End and Ultra High End May Be Better Than Previously Anticipated Over the Forecast Period, Driven by Chinese Consumers Upgrading to High-End Phones
Apple and iOS Momentum — Apple in Focus
In-House Silicon Strategies Are Real — Samsung in Focus
Chinese Mobile OEMs Are Preparing for a Heightened Global Presence in 2015 and Beyond
Increased Competition in LTE Silicon in 2015; Disruptions to Existing Foundry Relationships Expected
RF Front Ends (Integrated Front Ends and FBAR) Will Be One of the Highest Growth Segments of the Mobile Phone Semiconductor Market
Increasing Embedded NAND Content in Mobile Phones Through the Forecast Horizon
Increasing Embedded DRAM Content in Mobile Phones Through the Forecast Horizon
China Remains the Largest Market for Mobile Phone Semiconductors Over the Forecast Period
Table: Worldwide Mobile Phone Semiconductor Revenue Share by Region, 2014–2019 (%)
Slower-Than-Expected 4G Rollouts in India; Smartphone Penetration Is Still Low
BOM Cost Pressure Is Mitigated by the Higher Mix of LTE Handsets Over the Forecast Horizon
Table: Worldwide Weighted Average Mobile Phone Semiconductor BOM Cost by Air Interface Standard, 2014–2019 ($)
Assumptions
Table: Top 3 Assumptions for the Worldwide Mobile Phone Semiconductor Market, 2015–2019
Table: Key Forecast Assumptions for the Worldwide Mobile Phone Semiconductor Market, 2015–2019
Market Context
Table: Worldwide Mobile Phone Semiconductor Revenue, 2010–2019: Comparison of May 2014 and June 2015 Forecasts ($B)
Figure: Worldwide Mobile Phone Semiconductor Revenue, 2010–2019: Comparison of May 2014 and June 2015 Forecasts
Essential Guidance
For the Low-End Smartphone Segment
For the Midrange and High-End Smartphone Segments
For the RF Front-End Market
For the Connectivity Market
In-House Silicon Strategies Could Drive Further Consolidation; Touch Controller/LCD Driver and Sensor Spaces Could See Further Consolidation
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Related Research
Definitions
Subsystems
Semiconductor Components
Systems
Cellular Air Interface Standards
Table: Worldwide Cellular Air Interface Standards
Methodology
Historical Market Values and Exchange Rates
Table: Exchange Rates, 2006–2014 (%)
Synopsis