New Publications

Market research can provide your organization with a thorough understanding of its market, customers, and competitors, and can help your company establish a dominant position in its industry. Through market research, you can increase your market share, boosting revenues by millions and market valuations by billions. You can also reduce your costs and time to market.  Electronics.ca Publication offers company information and comprehensive and intelligent market data information on industry trends, technologies, product, and buyer behavior. This research category provides the list of latest market reports. Subscribe to our RSS feeds to receive excerpts of the latest research reports daily!

US$5,500.00
Date of Publication: Jun 20, 2019
The global 5G chipset market should grow from $870.0 million in 2019 to reach $10.9 billion by 2024 at a compound annual growth rate (CAGR) of 65.7% for the period of 2019-2024.

US$5,500.00
Date of Publication: Apr 3, 2019

The Strategic Cost and Price Model - 2019 is now available with eight new fabs, expanded logic and DRAM process coverage, updated data and many other enhancements. Specifically the model covers: DRAM - Samsung, Micron and SK Hynix, Foundry - TSMC, Global Foundries, Samsung, IDM Logic - Intel MPU and ST Micro, NAND - Samsung, Toshiba, and Intel-Micron and 2D and 3D NAND, 3D XPoint for Intel-Micron.


US$4,400.00
Date of Publication: Jul 30, 2019
The 2019 study has 376 pages, 159 tables and figures. Worldwide markets are poised to achieve explosive growth generating several new trillion-dollar markets as the digital economy takes hold. Across the industrial spectrum smart devices and robots provetheirvalue by managing digital informationin real time across enterprise boundaries, encouraging collaborative business efforts. Lowering the costs of manufacturing and logistics management is a key benefit.

US$200.00
Date of Publication: Feb 1, 2017
IPC/WHMA A-620 revision C is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

US$200.00
Date of Publication: Jun 18, 2019
IPC-A-610G, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

US$3,720.00
Date of Publication: Jul 5, 2019
Analysis Of The Following Nanomaterials: Aluminium Oxide Nanoparticles, Antimony Tin Oxide Nanoparticles, Bismuth Oxide Nanoparticles, Carbon Nanotubes, Cerium Oxide Nanoparticles, Cobalt Oxide Nanoparticles, Copper Oxide Nanoparticles, Dendrimers, Fullerenes, Gold Nanoparticles, Graphene, Iron Oxide Nanoparticles, Magnesium Oxide Nanoparticles, Manganese Oxide Nanoparticles, Nanocellulose, Nanoclays, Nanodiamonds, Nanofibers, Nanosilver, Nanowires, Nickel Nanoparticles, Quantum Dots, Silicon Oxide Nanoparticles, Titanium Dioxide Nanoparticles, Zinc Oxide Nanoparticles, Zirconium Oxide Nanoparticles, Nanoprecipitated Calcium Carbonate, Graphene And Carbon Quantum Dots, Hydroxyapatite Nanoparticles, Palladium Nanoparticles, Yttrium Oxide Nanoparticles, Other 2D Materials.

US$2,495.00
Date of Publication: Jul 5, 2019

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.


US$2,495.00
Date of Publication: Jul 5, 2019
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.

US$2,495.00
Date of Publication: Jul 5, 2019
The high price of oil in the past few years has been a catalyst for development in other alternative energy sources. Semiconductor technology surrounding the alternative energy markets includes advanced IGBT design, optoelectronics, advanced power conversion ICs, digital signal processing, MCUs, and advanced mixed signal and analog circuits. This report discussed the potential for these products to be the next killer green application.

US$2,495.00
Date of Publication: Jul 5, 2019

This report describes the technology infrastructure of nine Asian countries, detailing each countries' developments in microelectronics, telecommunications, and computing. Market forecasts are also presented in these sectors for associated countries.


US$2,495.00
Date of Publication: Jul 5, 2019
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.

US$2,495.00
Date of Publication: Jul 5, 2019

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.


US$2,495.00
Date of Publication: Jul 5, 2019

The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market and prompting some companies to enter.  In order to remain competitive in such circumstances, companies have been strengthening their technological capabilities and creating higher value-added products, as well as provide products at reasonable cost and with a delivery time that satisfies customer demands. Driving the TFT-LCD photomask market are a generation-shift to bigger glass plates and a design-rule cycle of panel technology that changes every 12 months. In this report, the worldwide markets are analyzed and projected, and market shares of vendors presented.


US$2,495.00
Date of Publication: Jul 5, 2019
This technology-marketing report examines and projects the technologies involved in the planarization of semiconductor layers. The emphasis is on Chemical Mechanical Polishing (CMP). This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for CMP equipment and materials and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes the LED Backlight market for Notebook PCs, LCD TVs, Desktop Monitors, Large Others, and Small/Medium LEDs. In analyzes the markets for Lighting, Active Outdoor Displays, Signals, Automotive, Mobile, and others.

US$2,495.00
Date of Publication: Jul 5, 2019
The primary objective of this report is to review the current issues dealing with lithography as applied to the manufacture of VLSI devices.

US$2,495.00
Date of Publication: Jul 5, 2019
This report addresses the strategic issues impacting the mask making, inspection, and repair sectors of the semiconductor industry in the U.S. and the world. The mask market is segmented by geographic region. The mask equipment markets are analyzed and projected and market shares presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes the market for MEMS by devices and systems. The equipment and materials to make them are analyzed and forecast.

US$2,495.00
Date of Publication: Jul 5, 2019

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented. Market shares of competitors for all segment is presented.


US$2,495.00
Date of Publication: Jul 5, 2019
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.

US$2,495.00
Date of Publication: Jul 5, 2019
This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation. Markets are segmented as: 1. Automated transfer tools (robots, elevators, platforms, etc.), 2. Carrier transport (monorail, AGV, AS/RS, etc.), 3. Manufacturing execution systems (MES) software.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes the market for both crystalline and thin film solar cells, equipment to make them, and polysilicon as a starting point. Marker shares of vendors in all these sectors are presented.

US$2,495.00
Date of Publication: Jul 5, 2019
TSV is a vertical electrical connection that passes completely through a silicon wafer or chip to create 3D ICs or packages. The drivers for market adoption of 3D ICs are increased performance, reduced form factor and cost reduction.  This report analyzes the market for TSV ICs, equipment, and materials. A critical element in enabling 3D integration is the Through-Silicon Via (TSV); a large, metal-filled conduit passing through the silicon substrate. TSV provides the high-bandwidth interconnection between stacked chips.

US$2,495.00
Date of Publication: Jul 5, 2019
This report examines the market for flip chip ICs, and the lithography and wet etch tools used in their manufacture.

US$2,495.00
Date of Publication: Jul 5, 2019
In this report we identify and forecast areas of semiconductor-related technologies where a small or mid-sized company can compete. These high-tech applications segmented as those are fabricated on 300mm wafers and those built on non-300mm wafers. The small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.

US$2,495.00
Date of Publication: Jul 5, 2019

In this report we identify and forecast areas of related technologies where a small or mid-sized chemical and material companies can compete: Solar, MEMS, LEDs, HDD, and WLP. As a result, the small business even with their limited resources can better serve these market segments by offering customized offerings, because the products of the big business will often be too generic to suit the needs of a niche market audience.


US$2,495.00
Date of Publication: Jul 5, 2019
The future needs in plasma etching will be for ever tighter control of process variability, higher selectivity and less damage. This report addresses the strategic issues impacting both the user and supplier of plasma etching equipment to the semiconductor industry. Markets for dry etching and stripping are analyzed and projected. Dry etching systems are further segmented by application. Market shares of vendors in each sector are presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report discusses the technology trends, products, applications, and suppliers of materials and equipment. A market forecast for LCDs, equipment and materials is presented along with market share of vendors.

US$4,995.00
Date of Publication: Jul 5, 2019
This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are.

US$2,495.00
Date of Publication: Jul 5, 2019
This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD. Market forecasts and market shares of vendors is presented.

US$2,495.00
Date of Publication: Jul 5, 2019
Eventually, nanomaterials are likely to affect nearly every industry in every region in the world, including the least developed regions. In fact, there is considerable optimism that nanomaterials will be instrumental in addressing some of the developing world’s most pressing concerns. Forecasts are presented for nanomaterials for solar cells, displays, lighting, and RFIDs devices.

US$2,495.00
Date of Publication: Jul 5, 2019

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.


US$2,495.00
Date of Publication: Jul 5, 2019

This report analyzes the wearable industry and markets for the two wearable camps described above. Forecasts are also presented for semiconductor content and markets for MEMs devices, sensors, CPUs and low-power MPUs, GPS, and connectivity chips.


US$2,495.00
Date of Publication: Jul 5, 2019
This report focuses on the key printer and material technologies and outlines the various leaders across these technologies. Markets are forecast for equipment, materials, service, and parts. Equipment is segmented and forecast by industrial and consumer types. Market share for suppliers is presented.

US$2,495.00
Date of Publication: Jul 5, 2019
This report profiles the top Asian (Japan, Korea, Taiwan) Companies making semiconductor process equipment. The report analyzes market shares for 29 equipment sectors, which includes Asian and Non-Asian manufacturers. Market forecasts are presented for all 29 equipment sectors.

US$4,995.00
Date of Publication: Jul 5, 2019

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.


US$3,995.00
Date of Publication: Jun 27, 2017
This comprehensive research evaluates the smart cities market including leading vendors and strategies (such as a single vendor centric approach), infrastructure, solutions, applications and services. It analyzes market factors driving solution adoption, technology readiness and fitness for use, and other considerations.

US$1,995.00
Date of Publication: Jun 25, 2019
The 6G technology market facilitating substantive improvements in the areas of sensing, imaging, presence and location determination. Higher frequencies will enable much faster sampling rates as well as significantly greater accuracy, down to the centimeter level. This will have big implications for many government and industry solutions in public safety and critical asset protection such as threat detection, health monitoring, feature/facial recognition and decision making (as in law enforcement, social credit systems, and other areas), air quality measurements, gas and toxicity sensing, and much more.

US$2,495.00
Date of Publication: Jun 25, 2019
This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and forecast of the worldwide chemical market; and trends in usage as devices features decrease. Market shares of vendors also presented

US$2,300.00
Date of Publication: Apr 9, 2019
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.

US$1,400.00
Date of Publication: Jun 24, 2019

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.


US$4,500.00
Date of Publication: Jun 20, 2019
This study looks at key developments from the early 5G launches and announced deployment strategies from U.S. carriers and forecasts expected 5G adoption trends among U.S. consumers and businesses. It also provides a detailed examination of the competitive landscape for 5G service among U.S. mobile network operators as they kick off formal 5G launches throughout 2019 and their efforts to encourage adoption that will drive 5G-related revenue.

US$4,500.00
Date of Publication: Jun 20, 2019
This data is provided by device type (mobile phones, tablets) and by discrete application processor versus integrated baseband processor, and data is provided quarterly starting from 1Q16.

US$4,500.00
Date of Publication: Jun 20, 2019
This study presents an outlook on the DRAM market for 2018–2023. The DRAM industry dynamics and the application forecast changes are aggregated, analyzed, and applied to this long-term DRAM forecasts in terms of units, revenue, and content per system for each application segment.

US$4,500.00
Date of Publication: Jun 20, 2019
This study provides data for the wireless connectivity market from 2018 to 2023 with some high-level analysis and commentary.

US$4,500.00
Date of Publication: May 22, 2019
This study presents the five-year forecast for mobile phone shipments worldwide by device type. The worldwide mobile phone market will reach a total of 1,802.3 million unit shipments in 2019, down 4.7% from the 1,891.1 million units shipped in 2018. From there, total mobile phone shipments will dip to 1,778.8 million units worldwide by 2023, resulting in a CAGR of -1.2% from 2018 to 2023.

US$4,500.00
Date of Publication: Jun 20, 2019
The need to invest in next-generation network (NGN) infrastructure technologies is an urgent imperative beyond preparing for 5G wireless. NGN infrastructure is the future of the provider franchise and is both a competitive necessity for survival and a strategic enabler of new revenue sources.

US$5,550.00
Date of Publication: Jun 20, 2019
The global market for thin-layer deposition technologies should grow from $32.1 billion in 2017 to $60.7 billion by 2022 at a compound annual growth rate (CAGR) of 13.6% for the period of 2017-2022.

US$485.00
Date of Publication: Jun 18, 2019
The Germany Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Germany.

US$485.00
Date of Publication: Jun 18, 2019
The Danish Electronics Industry Report provides essential market intelligence for all sizes of a company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Denmark.

US$485.00
Date of Publication: Jun 18, 2019
The Finnish Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Finland.

US$485.00
Date of Publication: Jun 18, 2019
The French Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in France.

US$485.00
Date of Publication: Jun 18, 2019
The Italian Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Italy.

US$485.00
Date of Publication: Jun 18, 2019
This report is designed to provide the user with access to individual country data or product information. The full report will be supplied in PDF and Excel format to allow you to customise the data to meet your specific needs.

US$485.00
Date of Publication: Jun 18, 2019
The Norwegian Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Norway.

US$485.00
Date of Publication: Jun 18, 2019
The Spanish Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Spain.

US$485.00
Date of Publication: Jun 18, 2019
The Swedish Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in the Sweden.

US$485.00
Date of Publication: Jun 18, 2019
The Swiss Electronics Industry Report provides essential market intelligence for all sizes of company from small enterprises to major global groups and for financial/management consultancies, government agencies and academia requiring a reliable overview of the electronics industry in Switzerland.

US$1,345.00
Date of Publication: Jun 18, 2019

The Yearbook highlights market trends and opportunities and offers corroborative evidence for individual research. Each new edition is fully revised and updated. Trade statistics are analysed in detail, with over 500 separate categories being employed. Production statistics are collected from Government and Manufacturer's Association sources where these are available. Extensive use is also made of research reports, company reports, news items and work by other consultants to supplement and cross check the official and semi-official sources.


US$485.00
Date of Publication: Jun 18, 2019

The industrial sector will be a key driver for the UK electronics industry and is structured around a large number of small and medium-sized companies which are supported by a relatively small number of larger UK and foreign multinational. Components accounted for 18.0% of electronics output in 2017 and in 2017 and 2018 benefited from increased production to offset the global shortage in components.


US$1,500.00
Date of Publication: Apr 1, 2019
The global surface haptics market is segmented into electrotactile, thermal and mechanical feedback technologies including Variable-friction surfaces, Pin arrays, Deformable devices, Electrostatic, Microfluidic, Shape memory, Magneto-Rheological, Electroactive polymers (EAPs), Haptic jamming, Ultrasonic vibration 28, Electromagnetic: ERMS, LRAS, VCMS, Acoustic vibration and Tactile overlays.

US$1,000.00
Date of Publication: Jun 6, 2019
Large-scale industrial production of single-walled carbon nanotubes (SWCNTs) has been initiated, promising new market opportunities in transparent conductive films, transistors, sensors and memory devices. Market volume for SWCNTs will increase in the coming years due to multi-volume production methods coming on stream and reduction in price. This will allow for penetration in high volume markets such as polymer composites, coatings, rubber and tires, batteries, construction materials, power cables and plastics.

US$2,400.00
Date of Publication: May 28, 2019

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon-based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The IC Model is very easy to use, the user only has to make eight selections or entry's and there is help for many of them. The model then presents a detailed analysis of cost and pricing and offers over seventy options for customization. Cost includes wafer fabrication, wafer test, packaging and final test.