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US$85.00
Date of Publication: Jun 23, 2011
本文件旨在描述元器件板级互连的断裂强度特性,它详细说明了确定板级器件互连对非周期板组装和测试操作过程中可能发生的弯曲载荷的抗断裂力的常用方法。本 文件适用于采用常规再流焊接技术连接到印制板上的表面贴装元器件,并补充了有关运输、装卸或现场操作过程中的机械冲击或撞击的现有标准。全文共14...

US$152.00
Date of Publication: Feb 8, 2012
应变测试可以对SMT封装在组装过程、测试和操作中受到的应变和应变率水平进行客观分析。对于不同的焊料合金、封装类型、表面处理或层压板材料,过大的应变都会导致各种模式的失效。 本文件对印制板制造过程中PCAs的应变测试制定了详细的指南,这些制造过程包括组装、测试、系统集成以及其他可能导致印制板弯曲的操作方式。...

US$1,295.00
Date of Publication: Feb 9, 2015
Independent 5-year Consumer Electronics Industry Forecasts for China The outlook for consumer electronics spending growth in China is strong over the...

US$1,295.00
Date of Publication: Feb 16, 2015
Independent 5-year Consumer Electronics Industry Forecasts for Israel Israel has one of the most mature consumer electronics markets in the region,...

US$173.00
Date of Publication: Dec 18, 2012
Cette norme couvre les définitions et les propriétés des circuits imprimés rigides, incluant les simple-faces, les double-faces,...

US$304.00
Date of Publication: Nov 15, 2007
 IPC-7711/21B-SP Retrabajo, Modificación y Reparación de Ensamble Electrónicos This is the Spanish language translation of...

US$223.00
Date of Publication: Apr 16, 2010
これは明確に記述されたプリント回路板の受け入れ基準の指標である。この4色の文章は、対象の実装されていないプリント板の外部又は内部の写真・説明図、 受け入れ基準及び基準不適合を示している。作業者、検査者、技術者は、最新の知られている技術情報を知る様にしなければならない。改訂H版は、90以上の...