Printed Circuit Board Photo Album

Printed Circuit Board Photo Album

Date of Publication: Mar 20, 2012
US$165.00
BW-PHA5

The defect and photo albums provide a collection of the most common process defects for use in inspection standards, posters, training manuals and technical articles. Each file is stored on the CD in a tiff file format. Just think of the process defects and they will be on the disks.

Printed Circuit Board Photo Album Listing

1. Microsection of plated through hole
2. Microsection of inner layer
3. Microsection with laminate voids
4. Microsection of pad with tin/lead
5. Manual microsectioning
6. Microsection plated through hole
7. Microsection of copper voids
8. Horizontal microsection of resin smear
9. Microsection with poor solderability
10. Horizontal section hole misalignment
11. Cracking on corner of PTH
12. Tin/lead overhang and undercutting
13. Section showing ring voiding
14. Section showing burring on through hole
15. Voiding on through hole plating
16. Poor solderability on knee of the hole
17. Copper hole pull away after soldering
18. Resin voiding on inner track layer
19. Section of copper nodules
20. Void in silver polymer through connections
21. Multi layer junction failure
22. Resin contamination in copper plating
23. Poor solderability of through hole
24. Section showing voiding in multi layer
25. Section showing tented via hole
26. Marking ink contamination on resist
27. Resist lift and contamination under mask
28. Poor solder resist application
29. Cracking of solder resist coating
30. Solder mask ring in through hole
31. Variation of tin/lead coverage on PTH
32. Section showing poor drilling
33. Poor solderability of through hole
34. Poor solderability on knee of the hole
35. Section of tin/lead sliver
36. Section showing corner cracking
37. Electroless copper coverage of PTH
38. Section of multi layer junction
39. Section of multi layer junction
40. Close up of electroless copper coverage
41. Poor electroless copper back light test
42. Good electroless copper back light test
43. Voids in copper through hole plating
44. Cracked copper plating
45. Electroless copper coverage of PTH
46. Section of through hole plating
47. Damage to through hole plating
48. Good electroless copper back light test
49. Resist in plated through holes
50. Exposed tracks due to resist size
51. Misalignment of solder mask
52. Resist in plated through hole
53. Resist wrinkling after wave soldering
54. Solder pick-up after wave solder
55. Tented via hole blown out
56. Solder pick up after wave solder
57. Misaligned solder mask image
58. Example of resist side walls
59. Solder mask overlapping tin/lead pad
60. Solder resist lift after assembly
61. Example of resist side walls
62. Section through resist and track
63. Section through resist and track
64. Solder resist sliver
65. Excessive resist aperture
66. Excessive resist aperture
67. Resist overlap
68. Solder mask cracking
69. Solder mask cracking
70. Resist overlap
71. Contamination under mask
72. Solder mask cracking
73. Poor solderability
74. Poor solderability
75. Poor solderability
76. Poor solderability
77. Poor PTH solderability
78. Resist wrinkle
79. Plating failure
80. Uneven solder coating
81. Uneven solder coating
82. Resist wrinkle
83. Uneven solder coating
84. Poor pad solderability
85. Poor pad solderability
86. Poor PTH solderability
87. Poor pad solderability
88. Poor pad solderability
89. PCB heatsink bonding
90. SIPAD solder coating
91. Carbon contact pads
92. Polymer through hole
93. Polymer through holes
94. SIPAD solder coating
95. SIPAD solder coating
96. Polymer through hole
97. Legend pad contamination
98. Legend pad contamination
99. Welded track repair
100. Routed multilayer repair
101. Final track repair
102. Final track repair
103. Poor tin/lead strip
104. Poor tin/lead strip
105. Poor tin/lead coverage
106. Copper dendrite
107. Copper dendrite
108. Copper dendrite
109. Delamination
110. Local delamination
111. Tooling hole damage
112. Poor edge bevelling
113. Poor electroless copper
114. Poor copper etching
115. Multilayer X-ray
116. Via outgassing
117. Via outgassing
118. Poor tin/lead coverage
119. C pad design
120. Via hole breakout
121. Cover layer delamination
122. Flexible ring voiding
123. Flexible etch defects
124. Flexible track break
125. Flexible resin contamination
126. Flexible resin contamination
127. Poor solder coating
128. Copper contamination
129. Etching defects
130. Tin/lead smearing
131. Poor resist development
132. Poor resist stripping
133. Poor gold adhesion
134. Poor tin/lead plating
135. Poor solderability
136. Poor tin/lead coverage
137. Poor tin/lead coverage
138. Poor tin/lead coverage
139. Poor gold adhesion
140. Track etching defect
141. Legend ink section
142. Legend ink contamination
143. Legend ink contamination
144. Static ink whiskers
145. Punch out panel
146. Break out tab
147. Test pin damage
148. Test pin marks
149. Resist lifting
150. Gold pad contamination
151. Gold pad contamination
152. BSI test coupon panel
153. BSI test coupon panel
154. Plastic moulded PCB
155. Plastic moulded PCB
156. Plastic moulded PCB
157. Single side resin smear
158. Solder level skip
159. Bowed PCB
160. Laminate measelling
161. Surface contamination
162. Resin starvation
163. Poor SIPAD process
164. Poor SIPAD process
165. Photo resist defect
166. Incomplete coverlay removal
167. Solder mask ghosting
168. Legend smudging
169. Plastic moulded PCB
170. Loose glass strands
171. Burnt gold tabs
172. Etching faults
173. Etching faults
174. Thin solder mask
175. Measelling/lifted mask
176. Bowed PCB
177. Gold with solder dots
178. Solder ball pick up
179. Solder mask lift
180. Gold tab blooming
181. Local bond defects
182. Excess mask penetration
183. Over etching
184. Filmwork defects
185. Tin/lead strip residue
186. Poor legend cure
187. Resist ghost/Image defect
188. Tooling hole platting
189. Incorrect bevelling
190. Plating short
191. PTH voiding
192. Test pin marks
193. Legend contamination
194. Resist residues and plating slivers
195. Close up of above resist residues
196. Misaligned hole leading to pad breakout
197. Surface damage to tin/lead surface on pads
198. Contamination under resist coating
199. Surface contamination on solder mask
200. Resist residues on the surface of the board
201. Resist residues on the surface of the laminate
202 Poor registration
203 Poor registration
204 Under etched copper
205 Solder mask residues
206 Track etching faults
207 Poor registration
208 Solder resist mis-registration
209 Laminate damage
210 Copper pad burrs
211 Poor cleaning of copper surface,  marks in copper
212 Spurious copper under solder mask
213 Solder mask contamination on the surface of board
214 Etching fault around through hole
215 As above on land area
216 Missing legend
217 Legend ink bleeding
218 Plating residues on the surface of flexible circuit
219 Spurious copper under flexible coverlay
220 Open circuit track
221 Copper shorting
222 Misaligned via hole leading to breakout
223 Poor surface coating of tin/lead
224 Legend ink spatter on flex circuit
225 Surface scratch/damage
226 Surface damage to solder mask
227 Mechanical damage to surface of board
228 Excess copper due to imaging faults
229 Contamination under flexible coverlay
230 Poor wetting of copper during solder levelling
231 Etch faults due to imaging
232 Contamination under solder mask coating
234 Crease in copper under flexible coverlay
235 Misaligned cover lay on flexible circuit
236 Incomplete etching of copper on flexible
237 Breakout damage
238 Breakout damage
239 Incomplete etching of copper on PCB
240 Masking tape contamination on edge fingers
241 Surface pad contamination
242 Missing resist coating
243 Surface damage
244 Surface pad contamination
245 Legend ink contamination, poor legend design rules
246 Legend ink contamination
247 Missing resist on surface tracking
248 Legend printing smear
249 Solder on gold contacts. Poor taping
250 Etching fault on flexible circuit
251 Metallic contamination under flexible coverlay
252 Metallic contamination under flexible coverlay
253 Surface contamination on track under solder mask
254 Surface contamination on board surface
255 Tooling hole damage
256 Flux residues on surface of resist
257 Copper track damage prior to resist/legend application
258 Lifted pad after solder touch-up
259 Solder resist skipping on tracking
260 Metallic contamination under resist coating
261 Exposed tracking due to poor design rules
262 Damage to resist coating
263 Surface damage to resist coating
264 Surface damage to resist coating and tracking
265 Poor solder levelling
266 Contamination under resist coating
267 As above
268 Resist contamination and damage to coating
269 Contamination under resist coating
270 As above
271 Variation in resist insulation layer for crossover
272 Exposed tracking
273 Damage to solder coating after levelling
274 Example of via plugging
275 Poor Solderability
276 Excessive thickness on legend/poor design rules
277 Contamination under solder mask coating
278 Nicks in tracking
279 Film plotting scallops
280 Contamination under resist coating
281 Thick temporary mask adjacent to surface mount pads
282 Poor application of temporary mask
283 Misalignment of ridged on flex circuit
284 Damage to solder mask coating during handling
285 Copper etch shorts under coverlay
286 Solder contamination on gold contacts
287 Misalignment of coverlay before bonding rigid to flex
288 Surface damage to coverlay
289 Drill mis-registration
290 Damage to solder coating after solder levelling
291 Close up of above
292 Solder slivers across through holes
293 Resist contamination across gold tabs
294 Handling contamination
295 Copper surface damage due to poor handling
296 Copper track burnt out during operation of circuit
297 SSD with solder pressed into resist coating
298 Etching defects on around copper pads
299 Etching defects on around copper pads
300 Damage to resist and gold plated pad
301 Damage to resist and gold plated pad
302 Hole breakout caused by incorrect design rules
303 Hole breakout caused by incorrect design rules
304 Damaged surface tracking
305 Damage to resist coating
306 Poor solderability of copper pads
307 Damage to laminate through over heating
308 Damage to laminate through over heating
309 Damage to laminate through over heating
310 Damage to laminate through over heating
311 Damage to gold plated pads
312 Etch faults on copper pads
313 Poor legend printing and poor design
314 Etching faults on rigid board
315 Test pin probe marks and legend contamination
316 Legend contamination
317 Open circuit track
318 Contamination under resist, poor legend printing
319 Poor alignment of coverlay and rigid board on flex
320 Edge damage to laminate
321 Gold/nickel plate out on laminate
322 Legend contamination on solder pads
323 Resist misalignment
324 Missing tracks due to over etching
325 Smearing of legend ink
326 Burnt out tracking
327 Etch defects with spurious copper
328 Poor solderability of copper pads
329 Damage to copper tracking
330 Gold/nickel plating out on to laminate
331 Resist contamination on gold pads
332 Etching faults on rigid board
333 Damage to solder mask
334 Under etched copper
335 Routing damage
336 Routing damage
337 Routing damage
338 Etching faults on PTFE boards
339 Poor solder coating on flexible rigid circuit
340 Damage to gold pads, etch hole in tab
341 Resist damage on copper tracking
342 Surface damage to resist
343 Damage to PCB laminate
344 Resist skipping on copper tracks
345 Nicked tracking
346 Routing damage
347 Resist damage and poor touch up of mask coating
348 Voids under copper in plated through hole
349 Surface contamination
350 Drill mis-registration
351 Poor mechanical surface cleaning on copper pads
352 Poor mechanical surface cleaning on copper pads
353 Resist coating on surface mount pads
354 Section showing copper wicking into laminate
355 Via hole partly filled with solder mask
356 Solder mask over the copper land of via hole
357 Via hole sections example
358
359 Warped printed board assembly
360 Warped printed board assembly
361 Poor through hole drilling
362 Separation of copper from barrel
363 Poor through hole drilling causing copper voids
364 Poor through hole drilling
365 Delamination/blistering during soldering



Date of Publication:
Mar 20, 2012
File Format:
CD-ROM
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