Semiconductor Manufacturing

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US$2,500.00
Date of Publication: Jul 6, 2015
New technologies have mushroomed in OSAT field, but few of them were commercialized and used on a massive basis in recent years. The most popular new technologies now include FOWLP, 2.5D and TSV, which are afraid to be put into large-scale application after 2017. On the one hand, these new technologies are not sufficiently mature and small in scale, leading to higher cost, like FOWLP attempting to replace FC-CSP. On the other hand, the reason lies in business model. Wafer-level packaging (WLP) has become more and more common, but the business model in which whether Foundry or OSAT dominates WLP still needs to be explored. As business model has not been fully shaped, downstream vendors will adopt a wait-and-see attitude. For future 2.5D and 3D packaging, most of silicon interposer layers may be completed by OSAT companies and part by Foundries. There may be also companies that specialize in silicon interposer layers.

US$2,495.00
Date of Publication: Jun 30, 2015
Hard-disk drives have been the default storage component in desktop and laptop PCs for decades. As a result, the term "hard drive" is now the common...

US$2,495.00
Date of Publication: Jun 30, 2015
High-density packaging offer a host of benefits including performance improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power. This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are. The worldwide markets are analyzed and projected.

US$2,495.00
Date of Publication: Jun 22, 2015
The rapid growth of the power semiconductor market in recent years has been driven by the proliferation of computer and consumer electronics, such as desktop computers, notebooks, netbooks, smartphones, flat panel displays and portable media players that require sophisticated power management to improve power efficiency and extend battery life.  The worldwide markets are analyzed and projected.

US$2,495.00
Date of Publication: Jun 22, 2015
CMP Technology: Competition, Products, Markets Chemical mechanical planarization (CMP) is a very important process in semiconductor manufacturing. The...

US$2,495.00
Date of Publication: Jun 22, 2015
Market Outlook for Nanomaterials for Electronics: Semiconductors, Solar, Displays, Sensors, RFID, Lighting There is a myriad of applications using...

US$2,495.00
Date of Publication: Jun 22, 2015
TFT-LCD Photomask Market Report The growth of the FPD market with the diffusion of digital home appliances is driving the large-format photomask market...