A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.
This report analyzes the wearable industry and markets for the two wearable camps described above. Forecasts are also presented for semiconductor content and markets for MEMs devices, sensors, CPUs and low-power MPUs, GPS, and connectivity chips. Wearables are small electronic devices, often consisting of one or more sensors and having computational capability. They are embedded into items that attach to the body, such as a user’s head, feet, arms, wrists and waist. They can resemble a watch, eyeglasses, clothing, contact lenses, shoes or even jewelery. Wearables either capture data or present data. The types of data collected could be as simple as the number of steps taken in a day or as complex as ECG or brainwave measurements. For output, wearables can convey information to the user through a variety of means, from the blinking of an LED light to a complex display of data.
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