The commercial battle for next-generation power semiconductors is evolving. IGBTs, SiC and other technologies are geared for the niche-oriented markets at 1,700 volts and higher. But what is the best technology for the larger 600- and 1,200-volt markets? both super-junction MOSFETs and IGBTs are ramping up on 300mm wafers, making them less expensive than GaN and SiC. In comparison, SiC MOSFETs are ramping up on 100mm wafers, while GaN-on-silicon is running on 150mm substrates. This report analyzes and forecasts the traditional power semiconductor market as well as next generation devices. Market shares of vendors by type are presented.
This report addresses the markets for Sensors, Microcontrollers, and Wireless Transceivers for Smart Technology segmented by Smart Cities, Smart Transportation, Smart Homes, Smart Industry, and Smart Health. Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.
This report analyzes the wearable industry and markets for the two wearable camps described above. Forecasts are also presented for semiconductor content and markets for MEMs devices, sensors, CPUs and low-power MPUs, GPS, and connectivity chips. Wearables are small electronic devices, often consisting of one or more sensors and having computational capability. They are embedded into items that attach to the body, such as a user’s head, feet, arms, wrists and waist. They can resemble a watch, eyeglasses, clothing, contact lenses, shoes or even jewelery. Wearables either capture data or present data. The types of data collected could be as simple as the number of steps taken in a day or as complex as ECG or brainwave measurements. For output, wearables can convey information to the user through a variety of means, from the blinking of an LED light to a complex display of data.
Hard drive manufacturers Seagate Technology and Western Digital face an uphill battle in attempting to sustain sales of traditional rotating-disk drives in the coming years. It all comes down to the price. Traditional storage drives currently cost around 7 to 8 cents per usable gigabyte, whereas even the best-priced SSDs cost over $0.40 per usable gigabyte. SSD prices have been falling drastically in the last few years as demand has picked up. Prices are likely to continue to drop in the coming years, thereby posing a major threat to hard drive makers such as Seagate and Western Digital. Samsung leads the pack of SSD manufacturers with a commanding 40% share in the SSD market. This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.
A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.
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