Semiconductor Manufacturing

Date of Publication: Feb 10, 2017

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.

Date of Publication: Jan 23, 2017
The IC Knowledge - 300mm watch database provides detailed coverage of all of the operating and announced 300mm fabs in the world. Details around location, products, key dates, investment and output versus year are all provided. There are also a number of graphs summarizing and analyzing output, capacity and cost out through 2025.

Date of Publication: Jan 23, 2017

The IC Cost and Price Model allows users to easily estimate the cost and price of most low power silicon based ICs such as SOCs, microprocessors, ASICs, DRAM, NAND and more. The 2016 revision 00 adds 10nm processes and includes a number of other improvements and updates.

Date of Publication: Jan 23, 2017
The report addresses the global market for new electronic materials during the period from 2016 through 2026. The report quantifies new electronic materials produced for use in the production of electronic materials (transistors, semiconductors, displays, etc). The global market for advanced electronic materials totaled nearly $4.9 billion in 2016. This market should total $10.3 billion in 2021 and $24.1 billion by 2026 at a five-year compound annual growth rate (CAGR) of 18.5%, for the period of 2021-2026.

Date of Publication: Nov 23, 2016
The global market for atomic layer deposition and other ultrathin film fabrication processes was valued at $1.1 billion and $1.3 billion in 2014 and 2015, respectively. This market is expected to increase from $1.5 billion in 2016 to nearly $3.7 billion in 2021 at a compound annual growth rate (CAGR) of 19.1% for 2016-2021

Date of Publication: Dec 30, 2016
According to this new report, the total market for printed, flexible and organic electronics will grow from $29.28 billion in 2017 to $73.43 billion in 2027. The majority of that is OLEDs (organic but not printed) and conductive ink used for a wide range of applications. On the other hand, stretchable electronics, logic and memory, thin film sensors are much smaller segments but with huge growth potential as they emerge from R&D.

Date of Publication: Jan 7, 2017
Chemicals and materials are used in every processing step in the fabrication of silicon and gallium arsenide integrated circuits. Technological advances in Si and GaAs ICs have resulted in more stringent requirements in the purity and quality of processing chemicals and materials for cleaning, etching, and deposition. As linewidths decrease, the level and size of contaminants in both chemicals and the manufacturing cleanroom become increasingly important as it directly impacts device yield. This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and forecast of the worldwide chemical market; and trends in usage as devices features decrease. Market shares of vendors also presented.