Semiconductor Manufacturing

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High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends
US$4,995.00
Date of Publication: Mar 24, 2021
This report discusses the packaging trends for higher performance and density driving advanced packaging technology solutions for mobile and IoT applications. One of the key enabling technologies to achieve these goals is thin 3D-packaging with integration. Developments have lately been made with various embedding technologies, such as eWLB/Fan out WLP and embedded devices. Higher integration levels and lower profiles are also achieved with wafer-level processes, at which most R&D is concentrated in the commercialization of 2.5D IC´s (with silicon interposer) & 3D ICs, as well as coreless substrate. Furthermore, there is tremendous pressure to decrease overall package height even with the additional dies stacking through innovation in wafer thinning, TSV, and ultrathin interconnects.
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
US$7,495.00
Date of Publication: Oct 16, 2020

This report describes the semiconductor equipment markets for more than 30 different sectors and profiles 49 leading equipment suppliers in the U.S., Europe, and Asia. Market shares for each company for each sector are presented, and each sector is forecast. *Includes excel spreadsheet of market revenues of each competitor in 27 segments from 2012 to 2019.

Chemicals And Materials For Sub-100nm IC Manufacturing
Chemicals And Materials For Sub-100nm IC Manufacturing
US$4,995.00
Date of Publication: Jun 29, 2020
This report addresses a number of important factors that will impact the consumption of chemicals and materials for manufacturing ICs with feature sizes <100nm: Technological issues and trends; Purity and particulate requirements; Chemical dispensing practices; Acid reprocessing; Strategic considerations for chemical users; Analysis and forecast of the worldwide chemical market; and trends in usage as devices features decrease. Market shares of vendors also presented
The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industries: Market Analysis And Processing Trends
The Hard Disk Drive (HDD) and Solid State Drive (SSD) Industry: Market Analysis And Processing Trends
US$4,995.00
Date of Publication: Jul 14, 2020

This report focuses on the entire hard disk drive market food chain, analyzing the markets for hard disk drives, substrates, and thin film heads. Processing issues in the manufacture of each of these sectors in included and the report details the CMP and Lithography sectors of thin film head processing. Market forecasts and market shares of all sectors are detailed. The SSD market is also analyzed.

300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
300/450mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis
US$4,995.00
Date of Publication: Jun 29, 2020
Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts.
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
Indium Tin Oxide (ITO) and Replacement Markets: Insight for End Users and Material and Equipment Suppliers
US$4,995.00
Date of Publication: Jun 29, 2020
This report presents a market and technical forecast for ITO and replacements for LCD panels, plasma display panels (PDP), touch panels, e-paper, solar cells and organic electroluminescent (EL) panels.
Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues
Mainland China’s Semiconductor and Equipment Markets: A Complete Analysis of the Technical, Economic, and Political Issues
US$4,995.00
Date of Publication: Jun 29, 2020

Mainland China represents a huge opportunity for semiconductor manufacturers and equipment and materials suppliers. Massive investments in China’s semiconductor industry is paying off as internal production is making inroads on demand. The emerging semiconductor market will exhibit growth far in excess of any other country. This report analyzes Mainland China’s semiconductor and equipment industries, examining the technical, economic, and political issues that are shaping this nascent industry.

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