Semiconductor Manufacturing

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GaAs IC Markets
The GaAs IC Markets
US$2,495.00
Date of Publication: Feb 4, 2019
This report will provide the reader with an in-depth understanding of the technological and market factors determining the evolution of GaAs ICs.
Convergence of Semiconductors and Smart Technology Market Analysis
Convergence of Semiconductors and Smart Technology - Market Analysis
US$2,495.00
Date of Publication: Feb 4, 2019

Microcontrollers (MCUs) used in Smart Cities, Smart Homes, Smart Industry, Smart Health, and Smart Transport (a subset of the Internet of Things (IoT)), represented just 10% of the overall MCU market in 2014. But in 2020, $10 billion in MCUs, representing 40% of the total market, will be used in these applications.

Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts
Asian Semiconductor Equipment Suppliers: Markets, Market Shares, Market Forecasts
US$2,495.00
Date of Publication: Feb 4, 2019
This report profiles the top Asian (Japan, Korea, Taiwan) Companies making semiconductor process equipment. The report analyzes market shares for 29 equipment sectors, which includes Asian and Non-Asian manufacturers. Market forecasts are presented for all 29 equipment sectors.
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts
US$4,995.00
Date of Publication: Feb 4, 2019

A number of technical and operational trends within the semiconductor manufacturing industry are strengthening the need for more effective advanced equipment solutions. These trends include: Development of Smaller Semiconductor Features. The development of smaller features, now as small as 20nm in production and 10nm in R&D, enables semiconductor manufacturers to produce larger numbers of circuits per wafer and to achieve higher circuit performance. Transition to 3D device structures. Foundries are adopting 3D FinFET transistors starting at 14/16 nm technology nodes to get improved performance and use less power in 1x technology nodes. Memory makers will move to 3D NAND and vertical structures for next generation NAND technology. Transition to 3D Integration Technology. Three-dimensional (3D) integration of active devices, directly connecting multiple IC chips, offers many benefits, including power efficiency, performance enhancements, significant product miniaturization, and cost reduction.

Packaging Cost and Price Model
Assembly and Test Cost and Price Model
US$1,400.00
Date of Publication: Sep 12, 2018

The Assembly and Test Cost and Price model covers wafer sorts, assembly of leadframe and organic substrates packages including EMIB, wafer level packaging and InFO and class test. The model is user customizable and we are continually adding new features.

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Discrete and Power Products Cost and Price Model
The IC Knowledge - Discrete and Power Products Cost and Price Model (2018)
US$2,300.00
Date of Publication: Nov 27, 2018
The IC Knowledge - Discrete and Power Products Cost and Price Model is the industry standard for cost and price modeling of high power silicon integrated circuits and discrete devices.
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Wafer Fabrication Costs Model and Equipment Requirements
Strategic Cost and Price Model
US$5,500.00
Date of Publication: Nov 27, 2018

Strategic Cost and Price Model - a forward looking model that projects Logic processes out to 13.5nm, DRAM and 2D NAND out to 1z plus 3D NAND and 3D XPoint. The model covers the top 3 DRAM, Foundry,and NAND manufacturers and leading logic manufacturers by node and produces detailed process flows, equipment requirements, materials requirements and wafer cost projections. The model is fully pre populated but also customizable customizable for process, equipment and materials. The model is wafer cost only and does not include packaging or test.

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