Semiconductor Manufacturing

Date of Publication: Mar 29, 2016
This report analyzes the worldwide markets for Semiconductor Automated Test Equipment (ATE) in terms of spending (US$) for the following Application Areas: Consumer Electronics, Telecom & IT, and Others. The global market for Semiconductor Automated Test Equipment (ATE) is projected to reach US$3.16 billion by 2022, driven by the "digitalize or die" challenge faced by industries and the ensuing significance of semiconductors. Surviving the digital disruption is the compelling new reality for industries across the globe. The Internet, Web 2.0, robotics, artificial intelligence, Internet of Things, and big data analytics are changing the flavor of modern industries. Digital transformation of industries and companies is inevitable in the emerging digital economy. The imminent mass adoption of digital technologies will amplify the commercial opportunity in semiconductor manufacturing as the computational muscle required to power the digital age will be provided by the semiconductor industry. Taiwan represents the largest and the fastest growing independent regional market worldwide with annual spending on semiconductor ATE waxing at a CAGR of 3.3% over the analysis period. Growth in the market is primarily led by huge electronics and semiconductor manufacturing industry established in the country over the years.

Date of Publication: Apr 1, 2016
The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region. Consumer electronics application is expected to be the fastest-growing segment in the flip chip technology market during the forecast period, followed by automotive application.

Date of Publication: Mar 16, 2016

The global market for thermal management products will grow from about $10.7 billion in 2015 to nearly $11.2 billion in 2016 and $14.7 billion by 2021, representing a compound annual growth rate (CAGR) of 5.6% between 2016 and 2021. The scope of this report is broad, covering several product areas. The individual materials, hardware, and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issues for that product segment, and are projected through 2021. The application sections feature forecasts for the most important applications by product.

Date of Publication: Feb 25, 2016
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.

Date of Publication: Feb 16, 2016

GaN Power Devices Market by Technology (Semiconductor Materials, Transistor Application Technologies), Wafer (Wafer Processes, Wafer Size, and Design Configuration), Device (Power Discrete, Power ICS), Products, Application & Geography - Global Forecast to 2022. The GaN power devices market is anticipated to reach USD 2.60 billion by 2022, at a CAGR of 24.5% from 2015 to 2022. Factors such as emerging technologies such as High-Electron Mobility Transistor technology, leading to GaN HEMTs, quantum dots, e-GaN FET among others are driving the growth of the GaN power devices market. Moreover, the RF semiconductor devices industry is also a driving factor. RF electronics industry, has slightly different requirements with respect to characteristics of its electronic devices, components, and semiconductor devices as compared to other segments of the global electronics sector. 

Date of Publication: Feb 10, 2016

Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.

Date of Publication: Feb 1, 2016
The thin wafer market was valued USD 6.76 Billion in 2015 and estimated to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. Factors such as growth in the semiconductor industry, reduction in the size of electronic devices, growing mobile and consumer electronic markets, and high amount of material saving are key drivers for the growth of the thin wafer market. Moreover, the growing IC industry in China and high adoption of portable devices provide a huge opportunity for further growth of this market.