Semiconductor Manufacturing

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Global Trends in SiP Technology Development
Global Trends in SiP Technology Development
US$1,600.00
Date of Publication: Feb 25, 2016
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in the development of packaging technology. This report provides an in-depth analysis of global SiP development from three dimensions: technology development, market application development, and industry trends; examines how SiP shapes up and influences the semiconductor industry, particularly packaging and testing service providers, IC substrate manufacturers, and foundries.
Graphene: Technologies, Applications, and Markets
Graphene: Technologies, Applications and Markets
US$2,750.00
Date of Publication: Feb 10, 2016

Potential electronics applications of graphene include ultrasmall transistors, superdense data storage, touchscreens and wearable electronics. In the energy field, potential applications include ultracapacitors to store and transmit electrical power as well as highly efficient solar cells. Some researchers argue that the greatest potential for graphene lay in its ability to conduct light as well as electricity. They believe that graphene can improve the efficiency of light-emitting diodes (LEDs) and aid in the production of next-generation devices like flexible touchscreens, photodetectors and ultrafast lasers.

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Semiconductors: Global Market Outlook to 2022
Global Semiconductor Market Outlook 2022
US$1,500.00
Date of Publication: Jan 12, 2016
The report provides an in-depth analysis of the global semiconductor market on the basis of its segments. The market by segments is classified into integrated circuits, discrete semiconductors, optoelectronics and sensors. In addition, the report also covers a detailed analysis of the global semiconductor equipment market, which is further segmented into wafer processing, assembly & packaging, and testing equipment; and the global semiconductor materials market which has further segments, such as wafer fabrication and packaging.
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Electronic Chemicals and Materials: The Global Market
Electronic Chemicals and Materials: The Global Market
US$5,550.00
Date of Publication: Jan 12, 2016

This report provides an overview of the global markets for electronic chemicals and materials, covering the entire range of chemicals and materials that are used in the fabrication of ICs and PCBs. The global electronic chemicals and materials market was nearly $22.0 billion in 2014. The market is projected to grow at a compound annual growth rate (CAGR) of 5.9% from $22.9 billion in 2015 to $30.5 billion by 2020.

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Semiconductor Packaging & Testing Industry
Worldwide and Taiwanese Semiconductor Packaging & Testing Industry, 2015 and Beyond
US$2,000.00
Date of Publication: Jun 17, 2014
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.
Wafer-Level Packaging: WLP Technologies and Global Markets
Wafer-Level Packaging: Technologies and Global Markets
US$5,550.00
Date of Publication: Sep 23, 2015
Global markets and technologies for wafer-level packaging. The report provides analyses of global market trends, with data from 2013, 2014, and projections of CAGRs through 2019. Coverage of technologies including: Flip-Chip, 3-D WLP, Conventional CSP, Wafer Level CSP, Compliant WLP, Nano WLP, and others. Information on integration techniques including Fan-out WLP, Fan-in WLP, TSV, IPD.


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High k and ALD/CVD Metal Precursors - A Semiconductor Materials Report
ALD/CVD High K and Metal Precursors For the Semiconductor IC Market
US$4,279.00
Date of Publication: Mar 25, 2015
The High K / ALD Precursors report provides information on the applications and markets associated with front end and back end of line precursors used to produce high dielectric constant (K) dielectrics and atomic layer deposition dielectrics and metals. Market size, growth, and market share statistics are provided.
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