Multi-core processors are now the norm for most computing applications (notebooks, desktops, and servers). A consequence of the expected demise of the traditional scaling of semiconductors is the increased need for improved cooling and operating junction temperature reduction due to large leakage currents. The consumer’s demand for thin multifunctional products has led to increased pressure on alternative high-density packaging technologies. High-density 3D packaging of complete functional blocks has become the major technology challenge.
- System-in-package (SiP) applications have become the technology driver for small components, packaging, assembly processes and high-density substrates.
- The use of motion-gesture sensors in various consumer and portable devices has expanded the MEMS gyroscope market, and three-axis integrated sensors are becoming the norm.
- Performance and size requirements are driving the adoption of 3D IC designs and the first applications of through-silicon vias are now in production.
Internet traffic, especially video content, is driving traffic up approximately 50% per year now and in the foreseeable future. The telecommunications system and everything down to semiconductor chips must grow proportionally (from both a capacity and performance viewpoint) to support that traffic. In addition, new mobile applications, such as Apple’s Siri, require large amounts of computing power, resulting in warehouse computers that consume 50+ megawatts. These changes drive optical technologies.
As data rates increase, optical methods are replacing copper/electronic methods at ever shorter distances. The current transition point is at data rates of 10 Gb/s and distances of 10-100 meters. When data rates or distances greater than those are needed, optical methods are attractive because they often reduce both power consumption and physical size up to 75%. Soon, 25 Gb/s technology will be available in CMOS technology resulting in ever-wider use of optical methods at still shorter distances.
The 2015 Roadmap was developed by five Product Emulator Groups (PEGs) and 19 Technology Working Groups (TWGs). The TWGs responded to the inputs and requirements outlined by representatives of OEMs in the five Product Emulator Groups (PEGs). These groups included more than 500 direct participants from over 280 private corporations, consortia, government agencies, and universities in 20 countries.
The iNEMI Roadmap has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years.
Through its roadmaps, iNEMI charts future opportunities and challenges for the electronics manufacturing industry. These widely utilized roadmaps:
• Help OEMs, EMS providers and suppliers prioritize investments in R&D
and technology deployment
• Influence the focus of university-based research
• Provide guidance for government investment in emerging technologies
The complete report provides a full coverage of emerging and disruptive technologies across the electronics industry: Order 2015 iNEMI Roadmap today.