System-in-Package (SiP) Die Technologies and Global Markets

System-in-Package (SiP) Die Technologies and Global Markets

BCC, Date of Publication: Feb 26, 2014, 173 Pages
US$6,650.00
GB-SMC091A
System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format.
 
SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex.
 
SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP’s simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.

This report attempts to weigh the positives of SiP with the negatives in quantitative as well as qualitative contexts.

STUDY GOALS AND OBJECTIVES

This study has the following goals and objectives:

  • Measuring and forecasting the global market size for SiP-based chipsets in value (dollar sales) and volume (shipment sales) terms.
  • Breaking down the market for global SiP-enabled chipsets components along the following end applications in value and volume terms: telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others.
  • Breaking down individual SiP-enabled chipset end-use applications along the following die compositions in value and volume terms: compound semiconductors and silicon (Si).
  • Breaking down individual SiP-enabled chipset end-use applications along the following regions in value and volume terms: the Americas; Europe, Middle East and Africa (EMEA); and Asia–Pacific (APAC).
  • Breaking down individual SiP-enabled chipset end-use applications along the following countries in value and volume terms: U.S., Brazil, Canada, Mexico, Germany, U.K., France, Italy, Spain, Russia, the Netherlands, Turkey, China, Japan, India, Indonesia and South Korea.
  • Analyzing the stakeholder landscape in the SiP-enabled chipset value chain.
  • Analyzing the patenting activity involving SiP-enabled chipsets.

REASONS FOR DOING THE STUDY

SiP is unique in its ability to combine the principles of electronic circuit design along with that of semiconductor packaging. It is also the only packaging technique that is pitted against SoC, a completely different methodology of integrating multiple functionalities. The simplicity of SiP makes it possible to combine diverse functionalities that SoC cannot cater to.
 
SiP thus caters to a wide array of uses across application areas. This report is an effort to quantify the market in terms of dollar sales and shipment volumes—a departure from the predominantly service-focused coverage of the semiconductor-packaging market.
 
SiP-based chipsets are essentially systems or subsystems that combine multiple passive components and active dies. The quantification of such subsystems is not the mainstream tracking mode. Most market studies track the market at individual component level—active or passive. This report quantifies the entire package, which provides new insight into the market dynamics.
 
This report also sheds light on the challenges and limitations faced by SiP. It also gives due coverage to alternative integration methodologies, such as SoC. This look at the alternatives provides a balance to the report coverage.
 
Essentially, the report focuses on end-use applications, which can be easily quantified and whose physical attributes can be compared, contrasted, tracked and analyzed.
 
Each end-use application has its own dynamics, benefits and challenges with respect to levels of adoption of SiP-enabled chipsets. On a larger note, each end-use application has its own market momentum dictated by the health of the regional and country markets. When these aspects are mapped for individual countries, they produce a fascinating collage of local market conditions that add to the larger picture. This report provides a refined view of individual country markets in volume and value terms for 17 key nations spanning all global regions.

SCOPE OF THE REPORT

The report measures and forecasts the size of the market in current U.S. dollars as well as in millions of shipment units for chipsets packaged using SiP.

The report forecasts the market size for the following:

  • Individual end-use application such as telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others. 
  • The above forecasts are classified in terms of die compositions, geographical regions and countries on volume and value bases; they are also classified in terms of value chain contributors on a value basis.

The Executive Summary provides a snapshot of key findings of the report.

The chapter on theoretical overview of SiP defines SiP and explains its morphology. SiP is placed in the context of other advanced packaging techniques, and a wider view is presented of where semiconductor packaging itself fits in the device-synthesis chain. The chapter dwells on simple and compound semiconductors and elaborates their pros and cons. Further, a high-level view of the SiP market is provided.
 
The chapter on global markets for SiP-enabled chipsets provides a closer look at the global market for those chipsets. End-use applications are used as the principal classification factor, and individual end-application markets are broken down by region and die composition.
 
The chapter on regional analysis for the Americas presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as the U.S., Brazil, Canada and Mexico.
 
The chapter on regional analysis for EMEA presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as Germany, France, the U.K., Spain, Italy, Russia, the Netherlands and Turkey.
 
The chapter on regional analysis for APAC presents an overview of the region and the overall market metrics, followed by analyses of individual major countries such as China, Japan, India, South Korea and Indonesia.
The chapter on major stakeholders and key companies identifies the influential stakeholder categories and leading companies that dominate the market for SiP-based chipsets.
 
The U.S. Patent Analysis chapter analyzes the U.S. patents granted in the relevant areas of SiP. The chapter classifies the patents awarded according to categories such as: analog–digital converter (ADC), digital–analog converter (DAC), radiofrequency (RF), antenna and other communication-component-specific integration; assembly and integration end-to-end process; bond, resin, solder, interposer and lead frame; design and alignment; die stacking and side-by-side placement facilitation; end-application-specific innovation-data transmission; memory-component-specific innovation; passive component integration; performance testing and verification; and power management, heat sink, inductor and capacitor.

INTENDED AUDIENCE

This report will be relevant to the following audiences:

  • Semiconductor-packaging-service providers, to analyze the relative potency of end-application sectors further broken down by die compositions, geographical regions and key country markets.
  • Semiconductor foundries, to formulate frameworks and standards based on demand for specific end application and die composition.
  • Semiconductor-device makers, to analyze the relative potency of end-application sectors further broken down by die compositions, geographical regions and key country markets; as well as to compare and contrast SiP with SoC.
  • SiP material and packaging-equipment suppliers, to identify the potential of their output across leading SiP end applications.
  • Original equipment manufacturers, to analyze the benefits and prospects of SiP-enabled chipsets used by them in their devices, equipment and products.


TABLE OF CONTENTS

Chapter 1: INTRODUCTION - Complimentary $0

STUDY GOALS AND OBJECTIVES
REASONS FOR DOING THE STUDY
SCOPE OF THE REPORT
INTENDED AUDIENCE
METHODOLOGY AND INFORMATION SOURCES
ABOUT THE AUTHOR
RELATED BCC RESEARCH REPORTS
DISCLAIMER
 
Chapter 2: EXECUTIVE SUMMARY  $250

Table Summary : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018
Figure Summary : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, 2011-2018
 
Chapter 3: THEORETICAL OVERVIEW OF SIP  $1557

DEFINITION
REGIONAL ANALYSIS OF SHIPMENTS
STEPS INVOLVED IN SIP IMPLEMENTATION
SIP MARKET BREAKDOWN BY DIE COMPOSITION
UNDERSTANDING SEMICONDUCTORS
COMPOUND SEMICONDUCTORS
LATTICE PARAMETER
BAND-GAP ENGINEERING
HETEROSTRUCTURE AND HETEROJUNCTIONS
ADVANTAGES OF COMPOUND SEMICONDUCTORS
GROUP III-V: NITRIDES, ANTIMONIDES, PHOSPHIDES AND ARSENIDES
GROUP II-VI: OXIDES, SULFIDES, SELENIDES AND TELLURIDES
GROUP IV: SILICON-BASED COMPOUNDS AND ALLOYS
OTHERS
SUBSTRATES AND THEIR ROLE IN PACKAGING
BREAKDOWN OF SIP-BASED CHIPSET MARKET BY END APPLICATIONS
FEATURES AND BENEFITS OF SIP
SIZE EFFICIENCY
PERFORMANCE ENHANCEMENT
DESIGN AND REVIEW FLEXIBILITY
COST ADVANTAGE
REDUCED TIME-TO-MARKET
LIMITATIONS AND CHALLENGES FOR SIP
LIMITED AVAILABILITY OF SKILLS AND RESOURCES
RE-ALIGNMENT OF EDA PROCESSES
LACK OF KGD
LARGER PACKAGE SIZE AS COMPARED TO SOC
PRESSURES ON WAFERING PROCESS
SOC-THE COMPETING METHODOLOGY

Chapter 4: GLOBAL MARKETS FOR SIP-ENABLED CHIPSETS  $1499

TELECOMMUNICATIONS
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

INSTRUMENTATION AND SCIENTIFIC RESEARCH
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

MEDICINE
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

ENERGY, DEFENSE AND SURVEILLANCE
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

CONSUMER ELECTRONICS
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

INDUSTRIAL AND AUTOMOTIVE
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

RETAIL AND OTHERS
OVERVIEW OF DRIVERS AND APPLICATIONS
BREAKDOWN BY REGION
BREAKDOWN BY DIE COMPOSITION

Chapter 5: REGIONAL ANALYSIS-AMERICAS  $1153

SNAPSHOT OF KEY COUNTRY MARKETS IN THE REGION
DETAILED MARKET METRICS
MAJOR COUNTRY PROFILES
 
Chapter 6: REGIONAL ANALYSIS-EMEA  $1960

SNAPSHOT OF KEY COUNTRY MARKETS IN THE REGION
MAJOR COUNTRY PROFILES
 
Chapter 7: REGIONAL ANALYSIS-APAC  $1384

SNAPSHOT OF KEY COUNTRY MARKETS IN THE REGION
OVERALL MARKET METRICS
MAJOR COUNTRY PROFILES
CHINA
JAPAN
INDIA
INDONESIA
SOUTH KOREA
 
Chapter 8: MAJOR STAKEHOLDERS AND KEY COMPANIES  $1441

INDEPENDENT PACKAGING-SERVICES PROVIDERS
SEMICONDUCTOR FOUNDRIES
SEMICONDUCTOR-DEVICE AND COMPONENT MAKERS
ORIGINAL EQUIPMENT MANUFACTURERS (OEMS)
ELECTRONIC DESIGN AUTOMATION (EDA) PLAYERS
PACKAGING-MATERIAL SUPPLIERS AND EQUIPMENT MAKERS
PROFILES OF KEY COMPANIES
 
Chapter 9: U.S. PATENT ANALYSIS  $519

INTRODUCTION
TRENDS BY FUNCTIONAL CATEGORIES
TRENDS BY YEAR
TRENDS BY COUNTRY
TRENDS BY ASSIGNEE
 

List of Tables

Summary Table : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018
Table 1 : SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY REGION, THROUGH 2018
Table 2 : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018
Table 3 : SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY DIE COMPOSITION, THROUGH 2018
Table 4 : GROUP III-V COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
Table 5 : GROUP II-VI COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
Table 6 : GROUP IV COMPOUND SEMICONDUCTORS
Table 7 : OTHER COMPOUND SEMICONDUCTORS BY CHEMICAL COMPOSITION
Table 8 : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018
Table 9 : SHIPMENT SALES FOR SIP-BASED CHIPSETS, BY END APPLICATION, THROUGH 2018
Table 10 : DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018
Table 11 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY REGION, THROUGH 2018
Table 12 : DOLLAR SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 13 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO TELECOMMUNICATIONS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 14 : DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018
Table 15 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY REGION, THROUGH 2018
Table 16 : DOLLAR SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 17 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO INSTRUMENTATION AND SCIENTIFIC-RESEARCH END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 18 : DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018
Table 19 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY REGION, THROUGH 2018
Table 20 : DOLLAR SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 21 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO MEDICINE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 22 : DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018
Table 23 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY REGION, THROUGH 2018
Table 24 : DOLLAR SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 25 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO ENERGY, DEFENSE AND SURVEILLANCE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 26 : DOLLAR SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY REGION, THROUGH 2018
Table 27 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY REGION, THROUGH 2018
Table 28 : DOLLAR SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 29 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO CONSUMER-ELECTRONICS END APPLICATION, BY DIE COMPOSITION
Table 30 : DOLLAR SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY REGION, THROUGH 2018
Table 31 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY REGION, THROUGH 2018
Table 32 : DOLLAR SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 33 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO INDUSTRIAL AND AUTOMOTIVE END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 34 : DOLLAR SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY REGION, THROUGH 2018
Table 35 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY REGION, THROUGH 2018
Table 36 : DOLLAR SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 37 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO RETAIL AND OTHERS END APPLICATION, BY DIE COMPOSITION, THROUGH 2018
Table 38 : DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE AMERICAS REGION, THROUGH 2018
Table 39 : SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE AMERICAS REGION, THROUGH 2018
Table 40 : DOLLAR SALES OF SIP-BASED CHIPSETS TO THE AMERICAS REGION, BY END APPLICATION, THROUGH 2018
Table 41 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE AMERICAS REGION, BY END APPLICATION, THROUGH 2018
Table 42 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE U.S., THROUGH 2018
Table 43 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE U.S., BY END APPLICATION, THROUGH 2018
Table 44 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR U.S., BY END APPLICATION, THROUGH 2018
Table 45 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR BRAZIL
Table 46 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR BRAZIL, BY END APPLICATION, THROUGH 2018
Table 47 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR BRAZIL, BY END APPLICATION, THROUGH 2018
Table 48 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR CANADA, THROUGH 2018
Table 49 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR CANADA, BY END APPLICATION, THROUGH 2018
Table 50 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR CANADA, BY END APPLICATION, THROUGH 2018
Table 51 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR MEXICO, THROUGH 2018
Table 52 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR MEXICO, BY END APPLICATION, THROUGH 2018
Table 53 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR MEXICO, BY END APPLICATION, THROUGH 2018
Table 54 : DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE EMEA REGION, THROUGH 2018
Table 55 : SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE EMEA REGION, THROUGH 2018
Table 56 : DOLLAR SALES OF SIP-BASED CHIPSETS TO THE EMEA REGION, BY END APPLICATION, THROUGH 2018
Table 57 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE EMEA REGION, BY END APPLICATION, THROUGH 2018
Table 58 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR GERMANY, THROUGH 2018
Table 59 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR GERMANY, BY END APPLICATION, THROUGH 2018
Table 60 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR GERMANY, BY END APPLICATION, THROUGH 2018
Table 61 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR FRANCE, THROUGH 2018
Table 62 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR FRANCE, BY END APPLICATION, THROUGH 2018
Table 63 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR FRANCE, BY END APPLICATION, THROUGH 2018
Table 64 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE U.K., THROUGH 2018
Table 65 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE U.K., BY END APPLICATION, THROUGH 2018
Table 66 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR THE U.K., BY END APPLICATION, THROUGH 2018
Table 67 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR ITALY, THROUGH 2018
Table 68 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR ITALY, BY END APPLICATION, THROUGH 2018
Table 69 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR ITALY, BY END APPLICATION, THROUGH 2018
Table 70 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR RUSSIA, THROUGH 2018
Table 71 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR RUSSIA, BY END APPLICATION, THROUGH 2018
Table 72 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR RUSSIA, BY END APPLICATION, THROUGH 2018
Table 73 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR SPAIN, THROUGH 2018
Table 74 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR SPAIN, BY END APPLICATION, THROUGH 2018
Table 75 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR SPAIN, BY END APPLICATION, THROUGH 2018
Table 76 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR THE NETHERLANDS, THROUGH 2018
Table 77 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR THE NETHERLANDS, BY END APPLICATION, THROUGH 2018
Table 78 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR THE NETHERLANDS, BY END APPLICATION, THROUGH 2018
Table 79 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR TURKEY
Table 80 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR TURKEY, BY END APPLICATION, THROUGH 2018
Table 81 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR TURKEY, BY END APPLICATION, THROUGH 2018
Table 82 : DOLLAR SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE APAC REGION, THROUGH 2018
Table 83 : SHIPMENT SALES FOR SIP-BASED CHIPSETS TO MAJOR COUNTRY MARKETS IN THE APAC REGION, THROUGH 2018
Table 84 : DOLLAR SALES OF SIP-BASED CHIPSETS TO THE APAC REGION, BY END APPLICATION, THROUGH 2018
Table 85 : SHIPMENT SALES OF SIP-BASED CHIPSETS TO THE APAC REGION, BY END APPLICATION, THROUGH 2018
Table 86 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR CHINA, THROUGH 2018
Table 87 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR CHINA, BY END APPLICATION, THROUGH 2018
Table 88 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR CHINA, BY END APPLICATION, THROUGH 2018
Table 89 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR JAPAN, THROUGH 2018
Table 90 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR JAPAN, BY END APPLICATION, THROUGH 2018
Table 91 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR JAPAN, BY END APPLICATION, THROUGH 2018
Table 92 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR INDIA, THROUGH 2018
Table 93 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR INDIA, BY END APPLICATION, THROUGH 2018
Table 94 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR INDIA, BY END APPLICATION, THROUGH 2018
Table 95 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR INDONESIA, THROUGH 2018
Table 96 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR INDONESIA, BY END APPLICATION, THROUGH 2018
Table 97 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR INDONESIA, BY END APPLICATION, THROUGH 2018
Table 98 : SNAPSHOT OF THE SIP-BASED CHIPSET MARKET FOR SOUTH KOREA, THROUGH 2018
Table 99 : DOLLAR SALES FOR SIP-BASED CHIPSETS FOR SOUTH KOREA, BY END APPLICATION, THROUGH 2018
Table 100 : SHIPMENT SALES FOR SIP-BASED CHIPSETS FOR SOUTH KOREA, BY END APPLICATION, THROUGH 2018
Table 101 : U.S. PATENTS IN SIP BY PATENT CATEGORY, 1976-NOVEMBER 2013
Table 102 : U.S. PATENT TRENDS IN SIP BY YEAR OF GRANT, 1976–NOVEMBER 2013
Table 103 : SHARES OF U.S. PATENTS IN SIP BY COUNTRY OF GRANT, 1976-NOVEMBER 2013
Table 104 : LIST OF ASSIGNEES FOR THE U.S. PATENTS IN SIP, 1976-NOVEMBER 2013
Table 105 : ASSIGNEES OF FOUR OR MORE U.S. PATENTS IN SIP, 1976 THROUGH NOVEMBER 2013
 
List of Figures

Summary Figure : DOLLAR SALES FOR SIP-BASED CHIPSETS, BY REGION, 2011-2018
Figure 1 : POSITION OF PACKAGING AND TESTING IN SEMICONDUCTOR MANUFACTURING CYCLE


Additional Information:
Pricing on the website is provided for single users and 2-5 users licenses only. Please contact us to purchase other multi-user licenses.
Date of Publication:
Feb 26, 2014
File Format:
PDF via E-mail
Number of Pages:
173 Pages
Type the characters you see in the picture above.