Taiwanese IC Packaging and Testing Industry

Taiwanese IC Packaging & Testing Industry, 2Q 2016

MIC Taiwan, Date of Publication: Oct 6, 2016, 16 Pages
US$600.00
MIC5025

IC Packaging & Testing Industry

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report found that shipment value of the Taiwanese IC packaging and testing industry fell to US$2.86 billion in the first quarter of 2016, down 8.3% year-on-year. The decline is expected to have slowed down in the second quarter, where the industry's shipment value will have reached US$2.97 billion, down 7.5% year-on-year.

TABLE OF CONTENTS

Taiwanese IC Packaging and Testing Industry Shipment Value, 4Q 2013 - 3Q 2016
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2013 - 3Q 2016
Taiwanese IC Packaging Industry Shipment Value , 4Q 2013 - 3Q 2016
Taiwanese IC Testing Industry Shipment Value , 4Q 2013 - 3Q 2016
Taiwanese IC Packaging Industry's Shipment Value Rankings, 4Q 2013 - 1Q 2016
Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 4Q 2013 - 1Q 2016
Taiwanese IC Testing Industry's Shipment Value Rankings, 4Q 2013 - 1Q 2016
Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 4Q 2013 - 1Q 2016
Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 4Q 2013 - 1Q 2016
Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 4Q 2013 - 1Q 2016
Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 4Q 2013 - 1Q 2016
Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 4Q 2013 - 1Q 2016
Exchange Rate, 4Q 2013 - 1Q 2016
Research Scope & Definitions

Companies Covered

Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton


Date of Publication:
Oct 6, 2016
File Format:
PDF via E-mail
Number of Pages:
16 Pages